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    Method for providing an electrical ground connection between a printed circuit board and a metallic substrate
    205.
    发明授权
    Method for providing an electrical ground connection between a printed circuit board and a metallic substrate 失效
    用于在印刷电路板和金属基底之间提供电接地连接的方法

    公开(公告)号：US06223431B1

    公开(公告)日：2001-05-01

    申请号：US09086235

    申请日：1998-05-28

    Applicant: Peter Doikas ,  David Geis ,  Jeffrey D. Merwin

    Inventor： Peter Doikas ,  David Geis ,  Jeffrey D. Merwin

    IPC: H01R900

    CPC classification number: H05K3/4038 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

    Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

    Abstract translation: 一种用于在印刷电路板（700）和金属衬底（200）之间提供电接地连接的方法（100）包括以下步骤：（i）在衬底（200）中提供孔（204）; （ii）从金属坯料（300）中形成接地塞（302）; （iii）将接地插头（300）插入基板（200）中的孔中; （iv）将接地插头（302）压缩到衬底（200）中的孔（204）中; （v）将印刷电路板（700）放置在基板（200）上; 和（vi）将焊料施加到印刷电路板（700）中的孔中并到达接地插头（302）上。 在单次冲压操作（120）中进行形成（104），插入（106）和压缩（108）的步骤。 方法（100）有效地提供高质量的电接地连接，并避免对复杂机械的任何需要。

    Fabrication of aluminum-backed printed wiring boards with plated holes therein
    208.
    发明授权
    Fabrication of aluminum-backed printed wiring boards with plated holes therein 失效
    在其中镀铝孔的铝背印刷电路板的制造

    公开(公告)号：US6003225A

    公开(公告)日：1999-12-21

    申请号：US982012

    申请日：1997-12-01

    Applicant: Sunghee Yoon

    Inventor： Sunghee Yoon

    IPC: H05K3/06 ,  H05K3/42 ,  H05K3/44 ,  H05K3/10

    CPC classification number: H05K3/062 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K3/427 ,  Y10T29/49165

    Abstract: A printed wiring board has an aluminum backing, a dielectric layer overlying the aluminum backing, and a copper layer overlying the dielectric layer. Holes are drilled through the copper and the dielectric layers, and either partially or fully through the aluminum backing, and plated to provide a conductive path between the copper layer and the aluminum backing. Tin-lead traces are applied to the upper surface of the copper layer and the copper layer is etched to define conductive paths. The copper exposed and aluminum exposed surfaces are protected so as to permit processing of the printed wiring board in otherwise-incompatible etchants and other solutions.

    Abstract translation: 印刷电路板具有铝背衬，覆盖在铝背衬上的电介质层和覆盖在电介质层上的铜层。 孔穿过铜和电介质层，并且部分或完全穿过铝背衬，并被电镀以在铜层和铝衬垫之间提供导电路径。 锡引线迹线被施加到铜层的上表面，并且铜层被蚀刻以限定导电路径。 铜暴露和铝暴露表面被保护，以便允许在其它不相容的蚀刻剂和其它溶液中处理印刷线路板。

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