公开(公告)号：US08708710B2

公开(公告)日：2014-04-29

申请号：US11881969

申请日：2007-07-30

Applicant: Che Seong Law ,  Kaneasan Edumban

Inventor： Che Seong Law ,  Kaneasan Edumban

IPC: H01R12/00

CPC classification number: H01R13/04 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/10325

Abstract: An electronic structure (for example a reliability board or a cycling control module) has a body including a body portion insertable into a connector. A plurality of contact structures are provided on a side of the body portion, each contact structure comprising a first contact and a second contact spaced from the first contact, with the first and second contacts of each contact structure being aligned in the direction of insertion of the body portion into the connector. A corresponding second plurality of contact structures is provided on a side of the body portion opposite the first-mentioned side. These contacts connect with respective corresponding contacts of the connector.

Abstract translation: 电子结构（例如可靠性板或循环控制模块）具有主体，该主体包括可插入到连接器中的主体部分。 多个接触结构设置在主体部分的一侧上，每个接触结构包括第一触点和与第一触点间隔开的第二触点，每个触头结构的第一和第二触点沿插入方向对准 主体部分插入连接器。 相应的第二多个接触结构设置在与第一侧相对的主体部分的一侧上。 这些触点与连接器的相应的相应的触点相连。

公开(公告)号：US20140008780A1

公开(公告)日：2014-01-09

申请号：US14006527

申请日：2012-07-20

Applicant: Mahiro Tsujino ,  Manabu Miyahara

Inventor： Mahiro Tsujino ,  Manabu Miyahara

IPC: H01L23/00

CPC classification number: H01L24/42 ,  H01L23/057 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/171 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09409 ,  H05K2201/09909 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors.

Abstract translation: 半导体器件壳体封装包括：基体，其上表面具有半导体器件的安装区域; 框架体，其具有设置在基体的上表面上的框状部分，围绕安装区域，以及从框状部分的内侧穿过其外侧的开口; 设置在所述开口中的平板状绝缘构件，从所述框体的内部延伸到其外部; 布线导体设置在绝缘构件的上表面上，从框体的内部延伸到其外部; 以及设置在所述绝缘构件的上表面的一部分上的金属膜，所述金属膜位于围绕所述布线导体的框架体的外侧。

公开(公告)号：US20130118783A1

公开(公告)日：2013-05-16

申请号：US13429450

申请日：2012-03-26

Applicant: Chih Sheng Huang

Inventor： Chih Sheng Huang

IPC: H05K1/00

CPC classification number: H01R12/718 ,  H05K1/117 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09854 ,  H05K2201/1028

Abstract: A circuit board includes a first pinout set of USB 2.0 standard provided on the circuit board; a second pinout set provided on the circuit board; and a flexible metal strip having a jut and four pinouts corresponding to StdA_SSRX−, StdA_SSRX+, StdA_SSTX−, and StdA_SSTX+ of USB 3.0 standard.

Abstract translation: 电路板包括电路板上提供的第一个USB 2.0标准引脚， 设置在电路板上的第二引脚排列; 以及具有对应于USB 3.0标准的StdA_SSRX-，StdA_SSRX +，StdA_SSTX-和StdA_SSTX +的突出和四个引脚的柔性金属条。

公开(公告)号：US20130083505A1

公开(公告)日：2013-04-04

申请号：US13609690

申请日：2012-09-11

Applicant: Noriyuki Kobayashi

Inventor： Noriyuki Kobayashi

IPC: H05K1/14 ,  H01R24/00 ,  H05K1/00

CPC classification number: H05K1/0245 ,  H05K1/11 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/09409 ,  H05K2201/0949

Abstract: Disclosed herein is a wiring board including: a differential-line pair including two lines for transmitting differential signals; and two connection pads each electrically connected to one of the two lines pertaining to one of the differential-line pairs, wherein a plurality of the differential-line pairs are laid out side by side; a plurality of the connection pads are provided to form a plurality of columns; and on each of the columns of the connection pads, any two the connection pads electrically connected to the lines pertaining to the same differential-line pair are provided at locations adjacent to each other on the same one of the columns.

Abstract translation: 这里公开了一种布线板，包括：差分线对，包括用于传输差分信号的两条线; 以及两个连接焊盘，每个连接焊盘电连接到属于所述差分线对之一的两条线之一，其中多个所述差分线对并排布置; 提供多个连接焊盘以形成多个列; 并且在连接焊盘的每个列上，电连接到与相同的差分线对相关的线的任何两个连接焊盘设置在相同的一个列上彼此相邻的位置处。

公开(公告)号：US08310645B2

公开(公告)日：2012-11-13

申请号：US12995578

申请日：2009-04-10

Applicant: Takashi Matsui ,  Motoji Shiota

Inventor： Takashi Matsui ,  Motoji Shiota

IPC: G02F1/1343 ,  G02F1/1345

CPC classification number: H05K1/111 ,  G02F1/13452 ,  H01L2224/05553 ,  H05K2201/09409 ,  H05K2201/09672 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A wiring board of the present invention has pads disposed in a plurality of rows including: first row pads each being connected to a respective one of the connection wires that is long in length; and second row pads (30b) each being connected to a respective one of the connection wires that is shorter in length than that of first connection wires (10a) connected to the first row pads, each of the first connection wires (10a) being provided not in a region between adjacent ones of the second row pads (30b) but in a lower layer region of the second row pads (30b), in such a manner that at least a first insulating layer (20a) is sandwiched between the second row pads (30b) and the first connection wires (10a), and 0.8≦W1/W2≦1, where W1 is a line width of the first connection wires (10a) in the lower layer region of the second row pads (30b), and W2 is a width of the second row pads (30b).

Abstract translation: 本发明的布线基板具有排列成多行的焊盘，包括：第一行焊盘，各自连接到长度相等的连接线; 和第二排焊盘（30b）分别连接到长度比连接到第一行焊盘的第一连接线（10a）短的连接线中的每个连接线，每个第一连接线（10a）被设置 不是在相邻的第二列焊盘（30b）之间的区域中，而是在第二行焊盘（30b）的下层区域中，使得至少第一绝缘层（20a）夹在第二行 焊盘（30b）和第一连接线（10a），以及0.8＆lt; W1; W1 / W2＆nlE; 1，其中W1是第二行焊盘（30b）的下层区域中的第一连接线（10a）的线宽， ，W2是第二排焊盘（30b）的宽度。

公开(公告)号：US20120138340A1

公开(公告)日：2012-06-07

申请号：US13369363

申请日：2012-02-09

Applicant: Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

Inventor： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

IPC: H05K1/09

CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

公开(公告)号：US20120040560A1

公开(公告)日：2012-02-16

申请号：US13210605

申请日：2011-08-16

Applicant: CHIEN-CHIUNG WANG ,  XUE-LIANG ZHANG ,  QING-MAN ZHU

Inventor： CHIEN-CHIUNG WANG ,  XUE-LIANG ZHANG ,  QING-MAN ZHU

IPC: H01R13/648 ,  H01R24/28

CPC classification number: H01R24/62 ,  H01R12/57 ,  H01R13/6471 ,  H01R13/6658 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409

Abstract: An electrical connector comprises a PCB (220) having a front edge to be inserted into a mating receptacle. The PCB comprises a top face having a row of first mating pads (242), and an opposite bottom face having a row of second mating pads (262) and a row of third mating pads (264) behind the second row of mating pads. The first and second mating pads are compatibly fit with an SFP receptacle (120). The PCB comprises a first sub-PCB (540) having a first outer layer containing the first mating pads and an opposite second outer layer containing the second mating pads, and a second sub-PCB (560) attached to the second outer layer on an area behind the second mating pads, the second sub-PCB having a second outer layer containing the third mating pads.

Abstract translation: 电连接器包括具有插入配合插座的前边缘的PCB（220）。 PCB包括具有一排第一配对焊盘（242）的顶面和相对的底面，其具有在第二排匹配焊盘后面的一排第二配合焊盘（262）和一排第三配合焊盘（264）。 第一和第二配合垫与SFP插座（120）兼容地配合。 PCB包括第一子PCB（540），第一子PCB（540）具有包含第一配对焊盘的第一外层和包含第二配对焊盘的相对的第二外层，以及附接到第二外部层的第二子PCB（560） 区域在第二匹配垫后面，第二子PCB具有包含第三配合垫的第二外层。

公开(公告)号：US20110271025A1

公开(公告)日：2011-11-03

申请号：US12824850

申请日：2010-06-28

Applicant: YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

Inventor： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

IPC: G06F13/00

CPC classification number: H05K1/113 ,  G06F1/185 ,  H05K1/0251 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/10159

Abstract: A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

Abstract translation: 计算机主板包括印刷电路板，其包括中央处理单元（CPU）插座和一组存储器插槽。 该组存储器插槽包括一个在线型存储器插槽和一个表面安装器件（SMD）型存储器插槽。 在线型存储槽包括多个电镀通孔。 SMD型内存插槽设置在串行型内存插槽和CPU插槽之间。 在线式存储插槽的通孔通过走线连接到CPU插座，SMD型存储插槽的焊盘连接到具有相同引脚定义的在线型存储器插槽的相应通孔。

公开(公告)号：US20110256739A1

公开(公告)日：2011-10-20

申请号：US12991442

申请日：2010-04-08

Applicant: Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

Inventor： Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

IPC: H01R12/70 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle includes a signal terminal, a ground terminal, and a signal terminal. A second portion of the ground terminal is distanced from a first portion of the signal terminal in an extension direction. A third portion of the signal terminal is distanced from the first portion of the signal terminal in the extension direction.

Abstract translation: 插座包括信号端子，接地端子和信号端子。 接地端子的第二部分在延伸方向上远离信号端子的第一部分。 信号端子的第三部分在延伸方向上远离信号端子的第一部分。

公开(公告)号：US07922291B2

公开(公告)日：2011-04-12

申请号：US11700343

申请日：2007-01-31

Applicant: Tomoyuki Kubo ,  Seiji Shimizu ,  Hiroo Ogawa ,  Hiromitsu Mizutani ,  Atsushi Ito

Inventor： Tomoyuki Kubo ,  Seiji Shimizu ,  Hiroo Ogawa ,  Hiromitsu Mizutani ,  Atsushi Ito

IPC: B41J2/14 ,  B41J2/05 ,  B41J2/045

CPC classification number: B41J2/14209 ,  B41J2/055 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2203/0278

Abstract: An ink jet head, includes: an actuator including a plurality of terminals; a wiring material including a base made of a flexible resin film on which a plurality of lands are arranged in arrays corresponding to the plurality of terminals, the wiring material of which one end is superimposed on a surface of the actuator, and which is extended in a direction parallel to the surface of the actuator; and a drive circuit for driving the actuator, wherein: the wiring material includes a small width portion, of which a width in a direction, perpendicular to an extended direction is smaller than that of the one end superimposed on the actuator, arranged on an extended portion; and the drive circuit is mounted on the extended portion; and wiring patterns are formed on the wiring material, for connecting the drive circuit and the plurality of lands.

Abstract translation: 一种喷墨头，包括：包括多个端子的致动器; 布线材料，其包括由柔性树脂膜构成的基底，多个平台排列成与多个端子对应的阵列，所述布线材料的一端重叠在所述致动器的表面上，并且延伸到 平行于致动器表面的方向; 以及用于驱动所述致动器的驱动电路，其中：所述布线材料包括小宽度部分，其宽度方向垂直于延伸方向的宽度小于重叠在致动器上的一端的宽度，布置在延伸方向上 一部分; 并且驱动电路安装在延伸部分上; 并且布线图案形成在布线材料上，用于连接驱动电路和多个焊盘。