公开(公告)号：US20160376143A1

公开(公告)日：2016-12-29

申请号：US14935296

申请日：2015-11-06

Applicant: InvenSense, Inc.

Inventor： Jongwoo SHIN ,  Houri JOHARI-GALLE ,  Martin LIM ,  Joseph SEEGER

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0089 ,  B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00206 ,  B81C2201/016 ,  B81C2203/035

Abstract: A MEMS device and method for providing a MEMS device are disclosed. In a first aspect, the MEMS device comprises a first substrate and a second substrate coupled to the first substrate forming a sealed enclosure. A moveable structure is located within the sealed enclosure. An outgassing layer is formed on the first or second substrates and within the sealed enclosure. A first conductive layer is disposed between the moveable structure and the outgassing layer, wherein the first conductive layer allows outgassing species to pass therethrough.

Abstract translation: 公开了一种用于提供MEMS器件的MEMS器件和方法。 在第一方面，MEMS装置包括第一基板和耦合到第一基板的第二基板，形成密封外壳。 可移动的结构位于密封的外壳内。 在第一或第二基板上和密封的外壳内形成除气层。 第一导电层设置在可移动结构和除气层之间，其中第一导电层允许除气物质通过其中。

公开(公告)号：US20160368762A1

公开(公告)日：2016-12-22

申请号：US15160884

申请日：2016-05-20

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-Wen Cheng ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Hung-Chia Tsai ,  Yi-Chuan Teng

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0006 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/098 ,  B81C1/0023 ,  B81C2203/0154 ,  B81C2203/0714 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31 ,  H01L2924/16152 ,  H01L2924/16235

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract translation: 一个实施例是包括具有第一压力的第一腔的第一MEMS模具和第二压力下具有第二空腔的第二MEMS模具，第二压力不同于第一压力的MEMS装置和围绕第一MEMS的模制材料 模具和第二MEMS模具，所述模制材料具有在第一和第二MEMS模具上的第一表面。 该装置还包括模制材料中的第一组电连接器，第一组电连接器中的每一个将第一和第二MEMS模具中的至少一个耦合到模制材料的第一表面，以及将第二组电连接器 连接器在模制材料的第一表面上，每个第二组电连接器被耦合到第一组电连接器中的至少一个。

公开(公告)号：US20160347605A1

公开(公告)日：2016-12-01

申请号：US14723927

申请日：2015-05-28

Applicant: InvenSense, Inc.

Inventor： Matthew Thompson ,  Joseph Seeger

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B7/02 ,  B81B2201/014 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2201/036 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/012 ,  B81C2203/0792 ,  H01H1/0036

Abstract: A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).

Abstract translation: 一种利用MEMS开关技术来操作MEMS传感器的系统和/或方法。 作为非限制性示例，可以使用MEMS开关来控制施加到MEMS传感器结构的DC偏压和/或AC偏压。 也可以使用一个或多个MEMS开关来向MEMS传感器提供驱动信号（例如，向MEMS陀螺仪提供驱动信号）。

公开(公告)号：US20160332864A1

公开(公告)日：2016-11-17

申请号：US15147197

申请日：2016-05-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Antti IIHOLA ,  Altti TORKKELI ,  Ville-Pekka RYTKÖNEN ,  Matti LIUKKU

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B3/0094 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/04 ,  B81C1/00357 ,  B81C2201/0112 ,  B81C2201/0132

Abstract: The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

Abstract translation: 微机械装置技术领域本发明涉及包括仅包含均质硅材料的多层微机械结构的微机械装置。 装置层至少包括一个转子和至少两个定子。 转子和至少两个定子中的至少一些至少部分地凹陷到来自装置层的第一表面的至少两个不同的凹陷深度，并且至少一些转子和至少两个定子至少部分地凹入 与器件层的第二表面的至少两个不同的凹陷深度。

公开(公告)号：US20160320426A1

公开(公告)日：2016-11-03

申请号：US15206935

申请日：2016-07-11

Applicant: Motion Engine, Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01P15/18 ,  G01P15/125 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00238 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  H01L2224/16145

Abstract: The present invention provides a 3D System (“3DS”) MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (SoC) or System in Package (SiP). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.

Abstract translation: 本发明提供了一种3D系统（“3DS”）MEMS架构，其能够将MEMS器件与IC芯片集成以形成片上系统（SoC）或系统级封装（SiP）。 集成MEMS系统包括至少一个MEMS芯片，包括MEMS换能器，以及至少一个IC芯片，不仅包括MEMS处理电路，还包括用于处理辅助信号的附加/辅助电路。 MEMS芯片可以包括第一和第二绝缘导电路径。 第一路通过传感器和IC芯片之间的MEMS信号进行处理; 并且第二导电路径可以延伸穿过MEMS芯片的整个厚度，以将辅助信号（例如功率，RF，I / O）传送到IC芯片，以便处理附加电路。

公开(公告)号：US09464899B2

公开(公告)日：2016-10-11

申请号：US14497317

申请日：2014-09-25

Applicant: mCube Inc.

Inventor： Wenhua Zhang

IPC: G01C19/5776

CPC classification number: G01C19/5776 ,  B81B2201/0242 ,  H03B2200/0094

Abstract: A gyroscope device and method of operation therefor. The gyroscope device can include a power input, a charge pump portion coupled to the power input, a selection mechanism, a switching mechanism, an oscillator driving mechanism coupled to the switching mechanism, and an oscillator coupled to the charge pump portion and to the oscillator driving mechanism. The method of operation can include providing a first or second selection signal from a selection mechanism associated with the outputting of a DC input power or DC output power from a switching mechanism, respectively. These signals, along with an oscillator driving signal from an oscillator driving mechanism, can be used to initiate and maintain oscillation of an oscillator at a steady-state frequency within a predetermined range of frequencies.

Abstract translation: 陀螺仪装置及其操作方法。 陀螺仪装置可以包括功率输入，耦合到功率输入的电荷泵部分，选择机构，开关机构，耦合到开关机构的振荡器驱动机构，以及耦合到电荷泵部分和振荡器 驱动机制。 操作方法可以包括分别从与切换机构输出DC输入功率或DC输出功率相关的选择机构提供第一或第二选择信号。 这些信号以及来自振荡器驱动机构的振荡器驱动信号可以用于启动并保持在预定频率范围内的稳态频率的振荡器的振荡。

公开(公告)号：US20160289063A1

公开(公告)日：2016-10-06

申请号：US14778514

申请日：2014-04-17

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Ilker E. Ocak ,  Julius Ming Lin Tsai ,  Navab Singh

IPC: B81B7/00 ,  G01P15/125 ,  G01R33/028 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/0172 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/0286 ,  H01L25/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.

Abstract translation: 一种机电装置及其制造方法，包括：在其第一表面上提供具有电路装置的第一晶片和在其第二表面上的第一电极; 从所述第一晶片的第一表面到所述第二表面形成第一和第二通孔结构，所述第一通孔将所述第一电极与所述电路装置电连接; 在其第一表面上提供具有悬挂结构的第二晶片; 在所述悬挂结构上形成第二电极; 在与第二电极电连接的第二晶片的第一表面上形成互连结构; 将第一晶片接合到第二晶片，其中第一晶片的第二表面面向第二晶片的第一表面，其中第二通孔结构将电路装置电连接到互连结构，并且第一和第二电极形成电容结构 。

公开(公告)号：US20160273967A1

公开(公告)日：2016-09-22

申请号：US14726472

申请日：2015-05-30

Applicant: Chih-Ming Sun ,  Ming-Han Tsai

Inventor： Chih-Ming Sun ,  Ming-Han Tsai

IPC: G01J5/02 ,  B81B7/02 ,  H04N5/33 ,  G01K7/02

CPC classification number: G01J5/0265 ,  B81B7/0025 ,  B81B7/0061 ,  B81B7/02 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0278 ,  G01J5/0025 ,  G01J5/027 ,  G01J5/04 ,  G01J5/046 ,  G01J5/14 ,  H01L2224/48091 ,  H01L2924/16151 ,  H01L2924/16153 ,  H01L2924/16235 ,  H04N5/2256 ,  H01L2924/00014

Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on a part of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.

Abstract translation: 本发明公开了一种具有组合感测能力的可佩戴装置，其包括可穿戴组件和至少一个多功能传感器模块。 可穿戴组件适合佩戴在使用者身体的一部分上。 可穿戴组件包括至少一个透光窗。 多功能传感器模块位于可穿戴组件的内部，用于执行图像感测功能和红外温度感测功能。 多功能传感器模块包括图像传感器模块，用于通过图像感测通过光可透过窗口感测物体的物理或生物学特征; 以及用于通过红外温度感测通过透光窗口感测温度的红外温度传感器模块。

公开(公告)号：US20160273916A1

公开(公告)日：2016-09-22

申请号：US15037532

申请日：2014-10-21

Applicant: SAGEM DEFENSE SECURITE

Inventor： Alain JEANROY ,  Philippe ONFROY

IPC: G01C19/574 ,  G01C19/5769

CPC classification number: G01C19/574 ,  B81B3/0021 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81C1/00547 ,  B81C2201/013 ,  G01C19/5733 ,  G01C19/5769

Abstract: An inertial sensor comprising a frame to which at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane, and transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another, characterized in that the seismic bodies have a single shape and a single mass, and in that the seismic bodies comprise interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centres of gravity that coincide with one another. A method for manufacturing such a sensor.

Abstract translation: 一种惯性传感器，包括框架，至少两个地震体通过弹性装置连接到该框架上，以便能够在悬挂平面中移动，以及换能器，以保持地震体的振动并确定地震体相对于彼此的相对运动 其特征在于，地震体具有单一形状和单一质量，并且地震体包括互锁部分，使得地震体彼此嵌套，同时相对于另一个地震体在悬架平面中可移动 地震体的重心相互重合。 一种用于制造这种传感器的方法。

公开(公告)号：US09448068B2

公开(公告)日：2016-09-20

申请号：US14745686

申请日：2015-06-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Uchida ,  Toshio Yamazaki ,  Tomohiro Mitani

IPC: G01C19/56 ,  G01C19/5607 ,  G01C19/5628 ,  G01C19/5769 ,  B81B7/00 ,  G01C19/574

CPC classification number: G01C19/5607 ,  B81B7/0016 ,  B81B2201/0242 ,  G01C19/5628 ,  G01C19/574 ,  G01C19/5769

Abstract: A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Abstract translation: 配置构件通过与端子电连接的端子从外部被支撑，并且X轴方向延伸部分，Y轴方向延伸部分和Z轴方向延伸部分是 在终端提供。 这种结构提供了一种角速度传感器，其中消除了从外部施加的Y轴方向和Z轴方向振动不能被阻尼的问题，并且可以抑制三轴方向上的所有振动。