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    SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME
    23.
    发明申请
    SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME 有权
    具有MEMS声学传感器和其他MEMS传感器的系统和装置及其制造方法

    公开(公告)号：US20150158722A1

    公开(公告)日：2015-06-11

    申请号：US14618251

    申请日：2015-02-10

    Applicant: INVENSENSE, INC.

    Inventor： Martin Lim ,  Fariborz Assaderaghi

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0061 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  G01L23/125 ,  H04R19/005

    Abstract: A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an environment outside the MEMS device; and a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm. The MEMS device also includes: a first integrated circuit disposed at a second location of the substrate, wherein the first integrated circuit is electrically coupled to the MEMS microphone; and a MEMS measurement device at a third location, wherein the MEMS measurement device comprises a motion sensor and a pressure sensor.

    Abstract translation: 提供了微机电系统（MEMS）装置。 MEMS器件包括：具有第一表面和第二表面的衬底，并且其中第一表面暴露于MEMS器件外部的环境; 以及MEMS麦克风，其设置在所述基板的第二表面上的第一位置处，并且具有定位成使得在所述MEMS麦克风处接收的声波入射在所述隔膜上的隔膜。 MEMS器件还包括：设置在衬底的第二位置处的第一集成电路，其中第一集成电路电耦合到MEMS麦克风; 以及在第三位置处的MEMS测量装置，其中所述MEMS测量装置包括运动传感器和压力传感器。

    MICROELECTROMECHANICAL AND/OR NANOELECTROMECHANICAL STRUCTURE WITH A VARIABLE QUALITY FACTOR
    25.
    发明申请
    MICROELECTROMECHANICAL AND/OR NANOELECTROMECHANICAL STRUCTURE WITH A VARIABLE QUALITY FACTOR 有权
    具有可变质量因子的微电子和/或纳米电子结构

    公开(公告)号：US20140318906A1

    公开(公告)日：2014-10-30

    申请号：US14260539

    申请日：2014-04-24

    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT

    Inventor： Yannick DEIMERLY ,  Guillaume JOURDAN ,  Patrice REY

    IPC: F16F15/02 ,  H01C17/00

    CPC classification number: B81B7/0016 ,  B81B7/008 ,  B81B2201/025 ,  G01C19/5726 ,  G01P2015/0882 ,  Y10T29/49082

    Abstract: Inertial sensor comprising a fixed part and at least one mass suspended from the fixed part and means of damping the displacement of the part suspended from the fixed part, said damping means being electromechanical damping means comprising at least one DC power supply source, one electrical resistor and one variable capacitor in series, said variable capacitor being formed partly by the suspended part and partly by the fixed part such that displacement of the suspended part causes a variation of the capacitance of the variable capacitor.

    Abstract translation: 惯性传感器，包括固定部分和至少一个悬挂在固定部分上的质量，以及阻尼从固定部分悬挂的部分的位移的装置，所述阻尼装置是机电阻尼装置，包括至少一个直流电源，一个电阻 和一个串联的可变电容器，所述可变电容器部分地由悬挂部分形成，部分地由固定部分形成，使得悬置部分的位移导致可变电容器的电容的变化。

    Micromechanical component
    28.
    发明授权
    Micromechanical component 有权
    微机械部件

    公开(公告)号：US08671757B2

    公开(公告)日：2014-03-18

    申请号：US12872596

    申请日：2010-08-31

    Applicant: Jochen Reinmuth

    Inventor： Jochen Reinmuth

    IPC: G01P15/125

    CPC classification number: G01P15/0802 ,  B81B3/0051 ,  B81B2201/025 ,  G01P15/125 ,  G01P2015/0831 ,  Y10T29/49826

    Abstract: A micromechanical component which has a substrate, a seismic mass, which is deflectably situated on the substrate, and a stop structure for limiting a deflection of the seismic mass in a direction away from the substrate. The stop structure is situated on the substrate and has a limiting section for limiting the deflection of the seismic mass, which is in a plane with the seismic mass. Furthermore, a method for manufacturing a micromechanical component is described.

    Abstract translation: 具有衬底，可偏转地位于衬底上的抗震块的微机械部件和用于限制地震质体在远离衬底的方向上的偏转的止挡结构。 止动结构位于基板上，并且具有限制部分，用于限制与地震质量平面的地震质量的偏转。 此外，描述了用于制造微机械部件的方法。

    MEMS INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME
    30.
    发明申请
    MEMS INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME 有权
    MEMS惯性传感器及其制造方法

    公开(公告)号：US20130285168A1

    公开(公告)日：2013-10-31

    申请号：US13870533

    申请日：2013-04-25

    Applicant: Lexvu Opto Microelectronics Technology (Shanghai) Ltd.

    Inventor： Zhiwei Wang ,  Deming Tang ,  Lei Zhang ,  Jianhong Mao ,  Fengqin Han

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81C1/00134 ,  B81B3/0018 ,  B81B2201/025 ,  B81C1/00293 ,  B81C2203/0145 ,  G01C19/5783 ,  G01P15/125

    Abstract: A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor.

    Abstract translation: 提供了MEMS惯性传感器及其制造方法。 该方法包括：在半导体衬底上沉积第一碳层; 图案化第一碳层以形成固定的锚定螺栓，惯性锚定螺栓和底部密封环; 在固定的锚栓中形成接触塞，并在惯性锚栓中形成接触塞; 在第一碳层上形成第一固定电极，惯性电极和连接电极，其中第一固定电极和惯性电极构成电容器; 在所述第一固定电极和所述惯性电极上形成第二碳层; 以及在所述第二碳层和所述顶部密封环上形成密封盖层。 在惯性力下，只有惯性电极可以移动，固定电极几乎不会移动或振动，这提高了MEMS惯性传感器的精度。

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