公开(公告)号：US11662262B2

公开(公告)日：2023-05-30

申请号：US16739815

申请日：2020-01-10

Applicant: TE Connectivity Solutions GmbH

Inventor： Ismael Brunner ,  Thomas Arnold ,  Predrag Drljaca

IPC: G01L9/00 ,  G01L7/00 ,  B81B3/00 ,  G01L7/08

CPC classification number: G01L7/08 ,  B81B3/0064 ,  G01L9/0019 ,  G01L9/0042 ,  B81B2201/0264

Abstract: A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.

公开(公告)号：US20230144578A1

公开(公告)日：2023-05-11

申请号：US17522710

申请日：2021-11-09

Applicant: Sony Interactive Entertainment Inc.

Inventor： Dennis Castleman ,  Todd Tokubo ,  Victoria Dorn

IPC: G02B27/01 ,  G01L19/14 ,  B81B7/02

CPC classification number: G02B27/0176 ,  G01L19/14 ,  B81B7/02 ,  B81B2201/0264 ,  G02B2027/0178

Abstract: Methods and systems for interacting with an augmented reality application includes a providing an array of barometric pressure sensors within a housing of a wearable device to capture pressure variances detected from motion of one or more facial features that are proximate to the array of barometric pressure sensors. The pressure variances are analyzed to identify motion metrics related to the motion of the facial features. The motion metrics are used to derive engagement metrics of the user to content of the augmented reality application presented to the user.

公开(公告)号：US20190202687A1

公开(公告)日：2019-07-04

申请号：US16334196

申请日：2017-09-18

Applicant: Robert Bosch GmbH

Inventor： Arne Dannenberg ,  Torsten Kramer ,  Joachim Fritz ,  Thomas Friedrich

IPC: B81C1/00 ,  B81B7/00 ,  G01L9/00 ,  G01L19/14

CPC classification number: B81C1/00325 ,  B81B7/0048 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2203/035 ,  G01L9/0042 ,  G01L9/0045 ,  G01L19/0076 ,  G01L19/146

Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

公开(公告)号：US20190119100A1

公开(公告)日：2019-04-25

申请号：US16167904

申请日：2018-10-23

Applicant: MISTIC

Inventor： Bertrand BOUTAUD

IPC: B81B3/00 ,  G01L9/00

CPC classification number: B81B3/0021 ,  A61B5/0215 ,  A61B2562/0247 ,  A61B2562/028 ,  B81B7/0058 ,  B81B2201/0264 ,  B81B2207/015 ,  G01L9/0042 ,  G01L9/0072 ,  G01L9/0073

Abstract: The sensor includes: a first biocompatible substrate, with an operative area deformable under the effect of an external mechanical stress and a mobile transducer element; a second biocompatible substrate, with an operative area and a fixed transducer element cooperative with the mobile element to vary an electrical parameter of the sensor; a mechanical connection for securing the first substrate to the second substrate; a first sensor terminal coupled to the mobile element; and a second sensor terminal coupled to the fixed element. The operative area of one of the substrates has the shape of an islet of closed contour, physically and electrically isolated from the remainder of the substrate by a peripheral lateral layer that is monolithically integrated with the remainder of the substrate and the operative area.

公开(公告)号：US20190092622A1

公开(公告)日：2019-03-28

申请号：US16202444

申请日：2018-11-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chien Yang ,  Ming-Lun Shih ,  Ren-Dou Lee ,  Jen-Hao Liu

IPC: B81B7/00 ,  G01L9/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00293 ,  B81C2203/0145 ,  B81C2203/036 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01L9/0048 ,  G01L9/0072 ,  G01L9/008

Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.

公开(公告)号：US20180356255A1

公开(公告)日：2018-12-13

申请号：US15781352

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Mengjin CAI

IPC: G01D5/241

CPC classification number: G01D5/2417 ,  B81B2201/0214 ,  B81B2201/0221 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/053 ,  B81C1/00182 ,  B81C1/00214 ,  G01K7/34 ,  G01L9/0045 ,  G01L9/0047 ,  G01L9/0073

Abstract: An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

公开(公告)号：US20180327257A1

公开(公告)日：2018-11-15

申请号：US15536088

申请日：2015-12-16

Applicant: Robert Bosch GmbH

Inventor： Ando Feyh ,  Gary O'Brien

IPC: B81B7/02 ,  B81C1/00 ,  G01L9/00

CPC classification number: B81B7/02 ,  B81B3/007 ,  B81B3/0072 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/115 ,  B81C1/00261 ,  G01L9/0042 ,  G01L9/0073

Abstract: A capacitive micro electrical mechanical system (MEMS) pressure sensor in one embodiment includes a base layer, a lower oxide layer supported by the base layer, a contact layer extending within the lower oxide layer, a membrane layer positioned generally above the lower oxide layer, the membrane layer including at least one protrusion extending downwardly through a portion of the lower oxide layer and contacting the contact layer, a nitride layer extending partially over the membrane layer, an upper oxide layer above the nitride layer, a backplate layer directly supported by the membrane layer and positioned above the upper oxide layer, a front-side etched portion exposing a first portion of the membrane layer through the upper oxide layer and the nitride layer, and a backside etched portion extending through the base layer, the backside etched portion at least partially aligned with the front-side etched portion.

公开(公告)号：US20180305201A1

公开(公告)日：2018-10-25

申请号：US16023509

申请日：2018-06-29

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81C1/00 ,  B81B3/00 ,  G01C19/56 ,  B81B7/02

CPC classification number: B81C1/00293 ,  B81B3/0021 ,  B81B7/0041 ,  B81B7/007 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00134 ,  B81C1/00309 ,  B81C2201/013 ,  B81C2203/0118 ,  G01C19/56 ,  G01C19/5769 ,  G01L9/0044 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/00 ,  G01P15/0802 ,  G01P15/125

Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

公开(公告)号：US10081533B2

公开(公告)日：2018-09-25

申请号：US14448767

申请日：2014-07-31

Applicant: Infineon Technologies AG

Inventor： Ulrich Schmid ,  Tobias Frischmuth ,  Peter Irsigler ,  Thomas Grille ,  Daniel Maurer ,  Ursula Hedenig ,  Markus Kahn ,  Günter Denifl

IPC: B81B3/00 ,  B06B1/02 ,  B81C1/00 ,  H04R19/02 ,  H04R19/04 ,  H04R31/00 ,  H04R7/24 ,  H04R7/02 ,  H04R19/00

CPC classification number: B81B3/0021 ,  B06B1/02 ,  B81B3/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/051 ,  B81C1/00142 ,  B81C1/0015 ,  B81C1/00158 ,  B81C1/00373 ,  B81C2201/0176 ,  B81C2201/0181 ,  B81C2201/019 ,  H04R7/02 ,  H04R7/24 ,  H04R19/005 ,  H04R19/02 ,  H04R19/04 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/023 ,  H04R2400/01 ,  H04R2499/11

Abstract: A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.

公开(公告)号：US20180230003A1

公开(公告)日：2018-08-16

申请号：US15952700

申请日：2018-04-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Ming Chen ,  Ping-Yin Liu ,  Chung-Yi Yu ,  Yeur-Luen Tu

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/052 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/013 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/03 ,  H01L24/09 ,  H01L2224/02163 ,  H01L2224/05082 ,  H01L2224/05109 ,  H01L2224/05117 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/1461

Abstract: An embodiment method includes forming a first plurality of bond pads on a device substrate, depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads, and etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads. The method further includes bonding a cap substrate including a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.