公开(公告)号：US20090189298A1

公开(公告)日：2009-07-30

申请号：US12010571

申请日：2008-01-28

Applicant: Fu-Chung Wu ,  Sheng-Yuan Tsai

Inventor： Fu-Chung Wu ,  Sheng-Yuan Tsai

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K1/0293 ,  H01L2224/13028 ,  H05K2201/0305 ,  H05K2203/173

Abstract: The bonding pad structure includes a main bonding pad and a blank path. The blank path crosses through the main bonding pad for dividing the main bonding pad into a first sub-bonding pad and a second sub-bonding pad. The bonding pad structure may further include a solder covered on the blank path and the main bonding pad selectively. The main bonding pad is regarded as a closed circuit when the solder is covered on the blank path and the main bonding pad. The main bonding pad is regarded as a open circuit when the solder is not covered on the blank path and the main bonding pad. A debug method with the bonding pad structure is also disclosed.

Abstract translation: 焊盘结构包括主焊盘和坯料路径。 空白路径穿过主焊盘，用于将主焊盘分成第一子接合焊盘和第二子焊盘。 接合焊盘结构还可以包括覆盖在坯料路径上的焊料和主焊盘。 当焊料覆盖在坯料路径和主焊盘上时，主焊盘被认为是闭合电路。 当焊料未被覆盖在坯料路径和主焊盘上时，主焊盘被认为是开路。 还公开了具有焊盘结构的调试方法。

公开(公告)号：US20090153072A1

公开(公告)日：2009-06-18

申请号：US12226602

申请日：2007-04-20

Applicant: Takeshi Hatakeyama

Inventor： Takeshi Hatakeyama

IPC: H05B41/36

CPC classification number: H05B41/2824 ,  H05B41/2821 ,  H05K1/0293 ,  H05K1/162 ,  H05K2201/0305 ,  H05K2201/09672 ,  H05K2203/171

Abstract: From the individual small areas of a conductor pattern arranged on the back side of a circuit board, there are individually extended leader patterns, which are midway led by through holes to the surface side of the circuit board. The individual leader patterns led to the surface side are connected with a terminal portion on the low-voltage side through jumper pads. The desired small areas are enabled to function by shorting the jumper pads with solder. The individual small areas are constituted to have a capacity of 1 pF, when caused to function, and they have such a capacity as a pattern capacitor as is proportional to the number of the shorted jumper pads.

Abstract translation: 从设置在电路板的背面的导体图案的各个小区域，存在单独延伸的引导图案，其中间通过通孔引导到电路板的表面侧。 导致表面侧的单个引线图案通过跨接垫与低压侧的端子部分连接。 通过用焊料短路跳线垫，可以使所需的小区域起作用。 各个小区域被构造成具有1pF的容量，当其起作用时，并且它们具有与短路跳线焊盘的数量成比例的图案电容器的容量。

公开(公告)号：US07533955B2

公开(公告)日：2009-05-19

申请号：US11903979

申请日：2007-09-25

Applicant: Isao Kobayashi

Inventor： Isao Kobayashi

IPC: B41J29/377

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  B41J2202/08 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09554

Abstract: A recording apparatus, including: a recording head including an actuator; a head holder holding the head; a circuit board disposed on the holder and configured to be connected to an external signal source; a drive circuit operable to drive the actuator; a flexible wiring member which includes wires that connect the actuator and the circuit board, which is elongated in a direction in which the wires extend, which is connected to the actuator and the circuit board at longitudinally opposite ends thereof, respectively, and on which the drive circuit is mounted between the longitudinal opposite ends, the wires including (a) a common voltage wire which connects common-voltage portions of the drive circuit and the circuit board and (b) a drive signal wire for driving the actuator; and a radiator having heat conductivity and electric conductivity and disposed between the head and the circuit board so as to extend along the wiring member, the radiator being heat-conductively and electrically joined to: (a) the common voltage wire in the vicinity of the drive circuit; (b) at least one portion of the common voltage wire intermediate between the drive circuit and the circuit board; and (c) at least one of (c-1) the common voltage wire in the vicinity of the circuit board and (c-2) the common-voltage portion of the circuit board connected to the common voltage wire of the wiring member.

Abstract translation: 一种记录装置，包括：包括致动器的记录头; 持有头部的头架; 设置在所述保持器上并且被配置为连接到外部信号源的电路板; 可操作以驱动致动器的驱动电路; 柔性布线构件，其包括连接致动器和电路板的导线，所述导线在导线延伸的方向上延伸，其分别在其纵向相对端连接到致动器和电路板，并且其上 驱动电路安装在纵向相对端之间，导线包括（a）连接驱动电路的公共电压部分和电路板的公共电压线和（b）用于驱动致动器的驱动信号线; 以及散热器，其具有导热性和导电性，并且设置在所述头部和所述电路板之间，沿着所述布线构件延伸，所述散热器被导热和电接合到：（a）所述公共电压线在 驱动电路; （b）在驱动电路和电路板之间的中间的公共电压线的至少一部分; 和（c）电路板附近的公共电压线中的（c-1）和（c-2）连接到配线部件的公共电压线的电路板的公共电压部分中的至少一个。

公开(公告)号：US07520757B2

公开(公告)日：2009-04-21

申请号：US11502979

申请日：2006-08-11

Applicant: Victor L. Bartholomew

Inventor： Victor L. Bartholomew

IPC: H01R12/00

CPC classification number: H05K1/0219 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/062 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/10356 ,  H05K2203/173 ,  Y10S439/943 ,  Y10T29/49155

Abstract: A transition circuit board for transitioning a cable to a connector is provided. A circuit board has an outer surface with a circuit trace, ground plane and ground link provided thereon. A cable pad and a contact pad are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.

Abstract translation: 提供了一种用于将电缆转换到连接器的转换电路板。 电路板具有外表面，其上设置有电路迹线，接地平面和接地链路。 在电路迹线的相对端设有电缆垫和接触垫。 接地链路与接地平面电气相同，并且位于与电路迹线相邻并且与电路迹线隔开的空间中。 在电路板的至少一部分，接地平面和电路板的外表面上提供绝缘涂层。 绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。 在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

公开(公告)号：US20090050887A1

公开(公告)日：2009-02-26

申请号：US12254255

申请日：2008-10-20

Applicant: Hyoung-ho Kim ,  Ye-jung Jung

Inventor： Hyoung-ho Kim ,  Ye-jung Jung

IPC: H01L23/58 ,  H01L21/66

CPC classification number: H05K1/0268 ,  G01R31/2818 ,  G09G3/006 ,  H01L22/20 ,  H01L22/32 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/0293 ,  H05K1/11 ,  H05K1/189 ,  H05K2201/0305 ,  H05K2201/09381 ,  H05K2203/173 ,  H01L2924/00

Abstract: A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receiving data and control signals and transmitting the data and control signals to the semiconductor chip, a plurality of passive elements connected to terminals of the semiconductor chip, and a plurality of test pads for testing one or more terminals of the semiconductor chip that are not connected to the signal-input portion. The test pads of the COF package are capable of testing a plurality of internal terminals which are integrated into one terminal and do not connected to the signal-input portion, thereby easily testing the electrical function of the chip.

Abstract translation: 提供了包括用于测试半导体芯片的电功能的测试焊盘的芯片片（COF）封装及其制造方法。 COF封装包括安装在基膜上的半导体芯片，用于接收数据和控制信号的信号输入部分，并将数据和控制信号发送到半导体芯片，连接到半导体芯片的端子的多个无源元件，以及 用于测试半导体芯片的一个或多个未连接到信号输入部分的端子的多个测试焊盘。 COF封装的测试焊盘能够测试集成在一个端子中并且不连接到信号输入部分的多个内部端子，从而容易地测试芯片的电功能。

公开(公告)号：US07490402B2

公开(公告)日：2009-02-17

申请号：US11902758

申请日：2007-09-25

Applicant: Deepak K. Pai ,  Ronald R. Denny

Inventor： Deepak K. Pai ,  Ronald R. Denny

IPC: H05K3/36 ,  B23K31/00

CPC classification number: H05K3/462 ,  H01L2224/05548 ,  H05K3/28 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract translation: 本发明提供了用于层叠和互连多个基板以形成多层封装或其他电路部件的多种技术。 可以在两个或更多个基板中的至少一个的导电焊盘上形成焊料凸块。 焊料凸块优选地由焊膏应用于导电焊盘形成。 粘合剂膜可以位于具有导电焊盘的基板的表面之间，其中粘合剂膜包括基本上位于导电焊盘上方的孔，使得导电焊盘和/或焊料凸块通过孔彼此面对。 然后可以将两个或更多个基底压在一起以经由粘合剂膜机械地粘合两个或更多个基底。 可以在叠层期间或之后回流焊料凸块以产生焊接段，该焊料段通过粘合剂膜中的孔提供导电焊盘之间的电连接。

公开(公告)号：US20090019693A1

公开(公告)日：2009-01-22

申请号：US12237955

申请日：2008-09-25

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: H05K3/10

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US07435624B2

公开(公告)日：2008-10-14

申请号：US11414780

申请日：2006-04-28

Applicant: Chin-Tien Chiu ,  Hem Takiar ,  Hui Liu ,  Jiang hua Java Zhu ,  Jack Chang-Chien ,  Cheemen Yu

Inventor： Chin-Tien Chiu ,  Hem Takiar ,  Hui Liu ,  Jiang hua Java Zhu ,  Jack Chang-Chien ,  Cheemen Yu

IPC: H01L21/44

CPC classification number: H05K3/303 ,  H05K3/284 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/1316 ,  Y02P70/613

Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.

Abstract translation: 公开了一种降低集成电路上的机械应力的方法，包括在制造过程中将焊料柱施加到衬底以增加对封装的结构支撑。

公开(公告)号：US07410093B2

公开(公告)日：2008-08-12

申请号：US10967839

申请日：2004-10-18

Applicant: Kevin L. Miller ,  Thad C. McMillan

Inventor： Kevin L. Miller ,  Thad C. McMillan

IPC: B23K31/02

CPC classification number: H05K1/0293 ,  H05K3/28 ,  H05K2201/0305 ,  Y10T29/49149

Abstract: A method of making a printed circuit board having zero resistance connections. Pairs of shunt pads are formed on the board, spaced sufficiently far apart to avoid short circuiting but sufficiently close to permit a solder bridge to occur between them during a solder wave process.

Abstract translation: 制造具有零电阻连接的印刷电路板的方法。 一对分流焊盘形成在板上，隔开足够远的距离，以避免短路，但足够接近，以允许在焊波过程中在它们之间发生焊桥。

公开(公告)号：US20080169027A1

公开(公告)日：2008-07-17

申请号：US12036638

申请日：2008-02-25

Applicant: Fumihiko TOKURA ,  Mitsuo TAKEUCHI

Inventor： Fumihiko TOKURA ,  Mitsuo TAKEUCHI

IPC: F17D3/00 ,  F16L3/01

CPC classification number: H05K3/4053 ,  H05K3/3484 ,  H05K2201/0305 ,  H05K2203/0165 ,  H05K2203/0195 ,  H05K2203/0292 ,  H05K2203/082 ,  Y10T137/0391 ,  Y10T137/8593

Abstract: A fluid filling apparatus allows a stage to receive a plate on a fluid spreading over a surface of the stage. A driving mechanism drives the plate along the surface of the stage. Relative movement is induced between through holes, formed in the plate, and the fluid. Since the through holes open to the fluid, the openings of the through holes are rubbed against the fluid. The edges of the openings serve to scrape the fluid. The scraped fluid penetrates into the through holes. The through holes are thus simultaneously filled with the fluid in a significantly facilitated manner. In addition, since the through holes can be filled with the solder material without application of a large pressure, a large-scale apparatus is not required. Moreover, the alignment of the through holes is not required.

Abstract translation: 流体填充装置允许平台在流体的平台表面上扩散的流体接收板。 驱动机构沿着台的表面驱动板。 在板中形成的通孔和流体之间产生相对运动。 由于通孔对流体开放，通孔的开口与流体摩擦。 开口的边缘用于刮擦流体。 刮掉的液体渗透到通孔中。 因此，通孔以同样的方式同时充满流体。 此外，由于通孔可以填充焊料而不施加大的压力，所以不需要大规模的装置。 此外，不需要通孔的对准。