公开(公告)号：US20180022013A1

公开(公告)日：2018-01-25

申请号：US15649124

申请日：2017-07-13

Applicant: Samsung Display Co., Ltd.

Inventor： Myung Gil CHOI ,  Jung Min LEE ,  Sang Moo LEE ,  Sae Sam JANG

IPC: B29C53/36 ,  B32B37/14 ,  H05K1/02 ,  B32B37/12

CPC classification number: B29C53/36 ,  B29L2031/3425 ,  B29L2031/3437 ,  B29L2031/3475 ,  B32B37/12 ,  B32B37/14 ,  B32B37/18 ,  B32B38/1866 ,  B32B2457/08 ,  H05K1/028 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10128

Abstract: A method of manufacturing a display device includes bending a first film member of a processing object such that a part of one side of the first film member surrounds a part of an outer side of a bending area of a second film member of the processing object while the first film member is laminated on the second film member.

公开(公告)号：US20170229417A1

公开(公告)日：2017-08-10

申请号：US15502585

申请日：2015-08-17

Applicant: Sharp Kabushiki Kaisha

Inventor： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA

IPC: H01L23/00 ,  G02F1/13 ,  G02F1/1345 ,  H05K3/32

CPC classification number: H01L24/75 ,  G02F1/1303 ,  G02F1/13452 ,  G02F2201/54 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H05K1/148 ,  H05K3/32 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K2203/0278 ,  H05K2203/1105 ,  H01L2924/00

Abstract: A driver mounting apparatus 40 includes a driver mount-side heat supply support member 42, a substrate support member 41, a driver-side heat supply support member 43, a first moving portion 44, and a second moving portion 45. The driver mount-side heat supply support member 42 supports a driver mount portion GSd and supplies heat to the driver mount portion GSd. The substrate support member supports a substrate main portion GSm. The driver-side heat supply support member 43 supports and sandwich a driver 21 with the driver mount-side heat supply support member 42 and supplies heat to the driver 21. The first moving portion 44 relatively moves the driver mount portion GSd and the driver mount-side heat supply support member 42 in an overlapping direction in which the glass substrate GS and the driver 21 are overlapped. The second moving portion 45 relatively moves the driver 21 and the driver-side heat supply support member 43 in the overlapping direction.

公开(公告)号：US20170222177A1

公开(公告)日：2017-08-03

申请号：US15484614

申请日：2017-04-11

Applicant: NLT Tehnologies, Ltd.

Inventor： Yojiro MATSUEDA

IPC: H01L51/52 ,  G06F1/16 ,  H01L27/32 ,  H05K1/02 ,  H01L51/00

CPC classification number: H01L51/5237 ,  G06F1/1616 ,  G06F1/1652 ,  G09F9/301 ,  H01L27/1214 ,  H01L27/323 ,  H01L27/3262 ,  H01L27/3265 ,  H01L51/0097 ,  H01L2251/5338 ,  H04M1/0216 ,  H04M1/0247 ,  H04M1/0268 ,  H05K1/028 ,  H05K2201/056

Abstract: Disclosed are folding type display apparatuses. The folding type display apparatus comprises a flexible display section, and a plurality of housings, which includes a first housing having a space formed therein, and second and third housings bendably connected to both ends of the first housing. The display section is fixed to the second and third housings, and in a closed state of the second and third housings, a folding portion of the display section is housed in the space formed by the first housing, while in an open state of the second and third housings away from each other, the display section becomes flat, and the first housing functions as a leg protruding from flat surfaces of the second and third housings, so that the second and third housings are fixed to each other and the folding portion of the display section is supported, by a holding member for connecting these housings.

公开(公告)号：US09706657B2

公开(公告)日：2017-07-11

申请号：US14969585

申请日：2015-12-15

Applicant: KYOCERA Corporation

Inventor： Kengo Suzuki ,  Kouji Morimoto

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/189 ,  H05K3/281 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/10053 ,  H05K2201/10189

Abstract: A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film. The bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed.

公开(公告)号：US09651998B2

公开(公告)日：2017-05-16

申请号：US14789423

申请日：2015-07-01

Applicant: NLT TECHNOLOGIES, LTD.

Inventor： Yojiro Matsueda

IPC: G06F1/16 ,  G09F9/30 ,  H04M1/02

CPC classification number: H01L51/5237 ,  G06F1/1616 ,  G06F1/1652 ,  G09F9/301 ,  H01L27/1214 ,  H01L27/323 ,  H01L27/3262 ,  H01L27/3265 ,  H01L51/0097 ,  H01L2251/5338 ,  H04M1/0216 ,  H04M1/0247 ,  H04M1/0268 ,  H05K1/028 ,  H05K2201/056

Abstract: Disclosed are folding type display apparatuses. The folding type display apparatus comprises a flexible display section, and a plurality of housings, which includes a first housing having a space formed therein, and second and third housings bendably connected to both ends of the first housing. The display section is fixed to the second and third housings, and in a closed state of the second and third housings, a folding portion of the display section is housed in the space formed by the first housing, while in an open state of the second and third housings away from each other, the display section becomes flat, and the first housing functions as a leg protruding from flat surfaces of the second and third housings, so that the second and third housings are fixed to each other and the folding portion of the display section is supported, by a holding member for connecting these housings.

公开(公告)号：US09638400B2

公开(公告)日：2017-05-02

申请号：US14428226

申请日：2013-09-13

Applicant: LG DISPLAY CO., LTD.

Inventor： Minsoo Kang ,  Ducksu Oh ,  Sung-Ryun Lim ,  Dong-Hyuk Heo

IPC: H01L51/50 ,  F21V19/00 ,  H05B33/06 ,  H05B33/14 ,  H05B33/28 ,  H05K1/18 ,  H05K3/40 ,  F21K9/20 ,  H05K3/32 ,  F21Y105/00 ,  F21Y115/15

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

Abstract: The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.

公开(公告)号：US20170118838A1

公开(公告)日：2017-04-27

申请号：US14919594

申请日：2015-10-21

Applicant: Applied BioPhotonics, Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H05K1/14 ,  H05K3/40 ,  H05K3/02 ,  H05K3/32 ,  H05K3/06 ,  H05K3/00 ,  H05K3/36 ,  H05K3/18

CPC classification number: H05K1/148 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/24 ,  H05K3/32 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1327

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

公开(公告)号：US20170077487A1

公开(公告)日：2017-03-16

申请号：US15289028

申请日：2016-10-07

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Paul Tsoa

IPC: H01M2/34 ,  H01M2/10 ,  H01M2/20

CPC classification number: H01M2/348 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/482 ,  H01M2200/103 ,  H05K1/0265 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037 ,  H05K2201/10181

Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

Abstract translation: 提供了用于互连一组电池单元的互连，包括这些互连的组件，形成这种互连的方法，以及形成这种组件的方法。 互连包括包括彼此电隔离的两个部分的导体。 至少一个部分可以包括用于连接到电池单元的两个触点和形成这两个触头之间的电连接的保险丝。 互连还可以包括粘附到导体上并机械地支撑导体两部分的绝缘体。 绝缘体可以包括开口，使得熔丝与该开口重叠，并且开口不干扰保险丝的操作。 在一些实施例中，保险丝可能不直接与任何其它结构接口。 此外，互连可以包括粘附到绝缘体的临时衬底，使得绝缘体设置在临时衬底和导体之间。

公开(公告)号：US20170017873A1

公开(公告)日：2017-01-19

申请号：US15171281

申请日：2016-06-02

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Hiroyuki Nakamoto

IPC: G06K19/077 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  G06K19/0704 ,  G06K19/0716 ,  G06K19/072 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07773 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0314 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10098 ,  H05K2201/10143

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

Abstract translation: 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件上并具有柔性和导电性; 电子部件，设置在所述基座部件上并且耦合到所述导电部件; 以及覆盖部件，其具有柔性和绝缘性能，并且覆盖所述基部部件的一部分和所述电子部件的一部分，其中所述覆盖部件具有高于所述基部部件的硬度的硬度，并且其中所述基部部件弯曲 以便将盖部件保持在内部。

公开(公告)号：US09516744B2

公开(公告)日：2016-12-06

申请号：US14253939

申请日：2014-04-16

Applicant: Thomas Nathaniel Tombs ,  Ronald Steven Cok ,  Christopher R. Morton

Inventor： Thomas Nathaniel Tombs ,  Ronald Steven Cok ,  Christopher R. Morton

IPC: H01R43/00 ,  H05K1/02 ,  H05K3/22 ,  H05K1/18 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46 ,  G06F3/044

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/4635 ,  H05K2201/0108 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10121 ,  H05K2201/10128 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T156/1015

Abstract: A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.

Abstract translation: 制造适于包装的微线电路结构的方法包括提供显示器和柔性基板。 柔性基板包括在柔性基板的共同侧上或附近的多个导电微线，并且在柔性基板的接触部分中形成微线电极。 一个或多个电路位于柔性基板的电路部分上或电路部分中，并且一个或多个微线将一个或多个电路电连接到相应的微线电极。 柔性基板相对于显示器定位，触摸部分位于显示观察侧附近，电路部分位于显示器背面附近，并且柔性基板的边缘部分从显示器观看围绕显示边缘缠绕 侧面显示背面。