公开(公告)号：US20170351143A1

公开(公告)日：2017-12-07

申请号：US15539322

申请日：2015-12-18

Applicant: Sharp Kabushiki Kaisha

Inventor： SHINYA KADOWAKI ,  RYUZO YUKI ,  MITSUHIRO MURATA ,  TAKESHI ISHIDA ,  TAKESHI MASUDA ,  HISASHI WATANABE

IPC: G02F1/1335 ,  F21V8/00

CPC classification number: G02F1/133603 ,  F21V23/001 ,  F21V23/0442 ,  F21Y2103/33 ,  G02B6/002 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0081 ,  G02B6/0083 ,  G02B6/0088 ,  G02B6/009 ,  G02B6/0093 ,  G02F1/133615 ,  G02F2201/56 ,  G04G9/0005 ,  G04G17/045 ,  H05K1/028 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/10106

Abstract: A backlight device 12 includes at least: a plurality of LEDs 17 arranged in an annular and curved shape; a light guide plate 14 surrounded by the plurality of LEDs 17 having am outer shape along the arrangement of the plurality of LEDs 17, and guiding light from the plurality of LEDs 17; and an LED board (light source board) 18 on which the plurality of LEDs 17 are mounted and wiring portions 18c for feeding power to the plurality of LEDs 17 are formed. The LED board 18 extends along the arrangement of the plurality of LEDs 17, and has a terminated annular shape or an endless annular shape, and includes a no-wiring formed region NWA in a part with respect to the circumferential direction thereof, where the wiring portions 18c are not formed.

公开(公告)号：US20170271308A1

公开(公告)日：2017-09-21

申请号：US15174465

申请日：2016-06-06

Applicant: SK hynix Inc.

Inventor： Jin Ho BAEK ,  Il PARK ,  Ho Kyoon LEE ,  Young Pyo JOO

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06562 ,  H05K1/181 ,  H05K2201/09027 ,  H05K2201/10515

Abstract: A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.

公开(公告)号：US20170185102A1

公开(公告)日：2017-06-29

申请号：US14998067

申请日：2015-12-24

Applicant: Khang Choong Yong ,  Shu Young Cheah ,  Wil Choon Song ,  Jackson Chung Peng Kong ,  Howard Heck

Inventor： Khang Choong Yong ,  Shu Young Cheah ,  Wil Choon Song ,  Jackson Chung Peng Kong ,  Howard Heck

IPC: G06F1/16 ,  H01R13/10 ,  H01R13/426 ,  H01R12/70

CPC classification number: G06F1/163 ,  A41D1/005 ,  G06F1/1656 ,  H01R4/58 ,  H01R12/7011 ,  H01R12/718 ,  H05K1/11 ,  H05K3/4007 ,  H05K2201/09027

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to provide a interface component including a housing comprising a first shell portion and a second shell portion, the first shell portion forming an extended portion for the housing and comprising a retention track engageable a counterpart retention track. The interface component to include a printed circuit board disposed within the housing, the printed circuit board comprising a plurality of contact pins each comprising a contact hole and a retention bump and a socket to couple with a stud.

公开(公告)号：US20170094792A1

公开(公告)日：2017-03-30

申请号：US15276547

申请日：2016-09-26

Applicant: TBS Avionics Co. Ltd.

Inventor： Christoph Dunkel ,  Remo Masina ,  Raphael Pirker

IPC: H05K1/14 ,  A63H27/00 ,  A63H29/22 ,  H05K1/18

CPC classification number: H05K1/144 ,  A63H27/02 ,  A63H27/12 ,  A63H29/22 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: The invention concerns an electronic component that comprises a printed circuit board stack with multiple printed circuit boards arranged one on top of the other and that is used, in particular, for model aircraft or commercially utilized unmanned aircraft. The printed circuit boards are held at a distance from one another by spacers. The fastening elements that are provided here are electrically conductive in design, and the printed circuit boards are connected to one another in an electrically conductive manner and also mechanically by these fastening elements.

公开(公告)号：US09593831B2

公开(公告)日：2017-03-14

申请号：US14485406

申请日：2014-09-12

Applicant: 1 ENERGY SOLUTIONS, INC.

Inventor： Jing Jing Yu

IPC: H05B37/02 ,  F21V23/06 ,  F21V23/00 ,  A47G33/06 ,  F21V23/02 ,  H05B33/08 ,  F21W121/04 ,  H05K1/18 ,  F21Y101/00

CPC classification number: F21V23/004 ,  A47G33/06 ,  F21S4/10 ,  F21V23/006 ,  F21V23/02 ,  F21V23/06 ,  F21W2121/04 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05B33/0806 ,  H05K1/18 ,  H05K2201/09027 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: Disclosed are various embodiments of an artificial tree that is lit by LEDs. Individual trunk modules are provided on trunk sections that provide individual control of LED strings disposed on branches on each of the trunk sections. Remote control devices and smart devices connected to the Internet can control the trunk modules. Spring-loaded flat connectors between the trunk sections, and also between the branches in the trunks, provide a solid electrical connection, which has a low susceptibility to failure. Plastic injection molded branches having injected molded sockets are provided for connecting LEDs that can be plugged directly into sockets on the trunk sections. The LEDs can be driven with an AC or DC electrical power supply.

Abstract translation: 公开了由LED照亮的人造树的各种实施例。 在主干部分上提供单独的中继线模块，其提供设置在每个干线部分上的分支上的LED串的单独控制。 连接到互联网的遥控设备和智能设备可以控制中继模块。 主干部分之间以及中继线之间的分支之间的弹簧式扁平连接器提供了一种牢固的电连接，其具有低的故障敏感性。 提供具有注射模制插座的塑料注塑分支，用于连接可直接插入到主干部分上的插座中的LED。 LED可以用AC或DC电源驱动。

公开(公告)号：US09582085B2

公开(公告)日：2017-02-28

申请号：US14502949

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Aidan N. Zimmerman ,  Bruce E. Berg ,  Glenn Aune ,  Kevin C. Armendariz ,  Ryan P. Brooks

IPC: G06F3/0354 ,  G06F3/046 ,  H01Q1/24 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  G06F3/044 ,  H05K3/28

CPC classification number: G06F3/03545 ,  G06F3/044 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025 ,  H01Q1/243 ,  H05K1/0274 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/4038 ,  H05K2201/09027 ,  H05K2201/09545

Abstract: An electronic device may have printed circuits to which electrical components are mounted. Plastic may be molded over a printed circuit. Vias may be formed in the printed circuit that connect metal traces on the surface of the molded plastic to metal traces on the printed circuit. The vias may be formed by drilling or by covering the metal traces on the printed circuit with mold pins in a molding tool during plastic molding operations. Plated metal traces or other metal traces may extend onto the interior surface of via holes. Vias may also be filled with conductive material such as solder or conductive adhesive. Metal members that are soldered or otherwise connected to printed circuit traces may be used in coupling surface metal traces to printed circuit traces. Antenna structure, shielding structures, and electrodes for a stylus may be formed using the metal traces on the molded plastic.

Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 塑料可以在印刷电路上模制。 可以在印刷电路中形成通孔，其将模制塑料表面上的金属迹线连接到印刷电路上的金属迹线。 可以通过在塑料模制操作期间通过钻孔或通过在模制工具中的模具销覆盖印刷电路上的金属迹线来形成通孔。 镀金属痕迹或其他金属迹线可延伸到通孔的内表面。 通孔也可以填充导电材料，例如焊料或导电粘合剂。 焊接或以其他方式连接到印刷电路迹线的金属构件可用于将表面金属迹线耦合到印刷电路迹线。 用于触针的天线结构，屏蔽结构和电极可以使用模制塑料上的金属迹线形成。

公开(公告)号：US09549460B2

公开(公告)日：2017-01-17

申请号：US14717456

申请日：2015-05-20

Applicant: FUJIKURA LTD

Inventor： Hirohito Watanabe ,  Taiji Ogawa

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H01P3/08

CPC classification number: H05K1/0216 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09027 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31A) that constitutes differential signal lines formed on the insulating substrate (10) and includes a curved portion; a second signal line (L31B) provided along the first signal line (L31A) and side by side inside the curved portion; and a ground layer (30) formed for the first signal line (L31A) and the second signal line (L31B) via an insulating material (10). The ground layer (30) includes a first ground layer (G31A) corresponding to a first region (D1) and a second ground layer (G31B) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31A) and has a first predetermined width (W31A). The second region (D2) is defined based on the second signal line (L31B) and has a second predetermined width (W31B). The first ground layer (G31A) has a remaining ratio lower than a remaining ratio of the second ground layer (G31B).

Abstract translation: 为了抑制由于信号线之间的长度差导致的传输时间差的发生，提供了一种印刷线路板，其具有：绝缘基板（10）; 第一信号线（L31A），其构成形成在绝缘基板（10）上并包括弯曲部分的差分信号线; 沿着第一信号线（L31A）设置并并列在弯曲部分内的第二信号线（L31B）; 以及经由绝缘材料（10）为第一信号线（L31A）和第二信号线（L31B）形成的接地层（30）。 接地层（30）包括对应于第一区域（D1）的第一接地层（G31A）和对应于第二区域（D2）的第二接地层（G31B）。 第一区域（D1）基于第一信号线（L31A）定义并具有第一预定宽度（W31A）。 第二区域（D2）基于第二信号线（L31B）被定义并且具有第二预定宽度（W31B）。 第一接地层（G31A）的剩余比率比第二接地层（G31B）的剩余率低。

公开(公告)号：US09380698B1

公开(公告)日：2016-06-28

申请号：US14644183

申请日：2015-03-10

Applicant: VivaLnk Limited (Cayman Islands)

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/02 ,  G06K19/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14 ,  A61B5/00 ,  H04B1/3827 ,  H04B5/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

公开(公告)号：US09212801B2

公开(公告)日：2015-12-15

申请号：US13683838

申请日：2012-11-21

Applicant: Huizhou Light Engine Limited

Inventor： Tean Sue-Anne Leung ,  Eddie Ping Kuen Li

IPC: H01R33/00 ,  B60Q1/06 ,  F21V29/00 ,  F21S13/10 ,  F21V3/00 ,  F21V15/00 ,  F21V5/00 ,  F21K99/00 ,  F21V23/06 ,  F21V29/506 ,  F21V23/00 ,  F21Y101/02 ,  F21V29/87 ,  F21V29/89

CPC classification number: F21V29/506 ,  F21K9/23 ,  F21K9/238 ,  F21V23/006 ,  F21V23/06 ,  F21V29/87 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K3/366 ,  H05K2201/066 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: An LED lamp comprises: a lamp base having live and neutral contacts for supplying electrical power to the LED lamp; a substantially hollow lamp holder; a PCB assembly comprising: first and second connection pins; a table portion attached to the top of each of the first and second connection pins; and at least one connecting structure formed at a top surface of the table portion and electrically coupled to the first and second connection pins; an LED PCB comprising at least one LED affixed to a PCB and an LED PCB connector having connector pins electrically coupled to the at least one LED and to the at least one connecting structure of the table portion; and a heat sink being configured to thermally couple to the at least one LED, and a globe having a bottom portion which is thermally coupled to an outer surface of the heat sink.

Abstract translation: 一种LED灯包括：灯座，其具有用于向LED灯供电的带电和中性触点; 大致中空的灯座; PCB组件，包括：第一和第二连接销; 连接到所述第一和第二连接销中的每一个的顶部的台部分; 以及至少一个连接结构，其形成在所述台部的顶表面处并电耦合到所述第一和第二连接销; LED PCB，其包括固定到PCB的至少一个LED和具有电耦合到所述至少一个LED和所述台部的至少一个连接结构的连接器引脚的LED PCB连接器; 并且散热器被配置为热耦合到所述至少一个LED，以及具有底部的球体，所述底部热耦合到所述散热器的外表面。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。