公开(公告)号：US09591763B2

公开(公告)日：2017-03-07

申请号：US15068706

申请日：2016-03-14

Applicant: FUJITSU LIMITED

Inventor： Mitsunori Abe ,  Kiyoyuki Hatanaka ,  Nobuo Taketomi ,  Shigeo Iriguchi ,  Ryo Kanai ,  Naoki Nakamura

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L2224/16225 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/3442 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2203/0445 ,  H05K2203/046 ,  H05K2203/063 ,  Y02P70/611

Abstract: Disclosed substrate with embedded component includes: an insulating base member; a conductive pad formed on the insulating base member; a component connected to the conductive pad with a solder; and a resin covering the component, wherein a hole is provided in the insulating base member and the conductive pad, and the insulating base member is exposed on a side surface of the hole.

Abstract translation: 具有嵌入部件的公开的基板包括绝缘基底部件; 形成在所述绝缘基底构件上的导电垫; 用焊料连接到导电焊盘的部件; 以及覆盖所述部件的树脂，其中在所述绝缘基底构件和所述导电垫中设置孔，并且所述绝缘基底构件暴露在所述孔的侧表面上。

公开(公告)号：US09480149B2

公开(公告)日：2016-10-25

申请号：US14230843

申请日：2014-03-31

Applicant: Brocade Communications Systems, Inc.

Inventor： Shahriar Mokhtarzad

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K1/0272 ,  H05K1/0203 ,  H05K1/181 ,  H05K9/0024 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: An embodiment of an electronic system includes a printed circuit board (PCB) including fluid flow channel extending through the PCB. In addition, the electronic system includes an electronic component including a bottom surface and positioned on the PCB over the fluid flow channel to thereby expose the bottom surface of the electronic component to fluid flow through the fluid flow channel.

Abstract translation: 电子系统的实施例包括印刷电路板（PCB），其包括延伸穿过PCB的流体流动通道。 此外，电子系统包括电子部件，该电子部件包括底表面，并且位于流体流动通道上的PCB上，从而将电子部件的底部表面暴露于通过流体流动通道的流体流动。

公开(公告)号：US20160295310A1

公开(公告)日：2016-10-06

申请号：US15036678

申请日：2014-09-11

Applicant: ROBERT BOSCH GMBH

Inventor： Jochen Zoellin ,  Ricardo Ehrenpfordt ,  Christoph Schelling

IPC: H04R1/04 ,  H04R31/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H04R1/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10083 ,  Y02P70/611

Abstract: Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.

Abstract translation: 描述了可以实现麦克风组件的后部体积的措施，而不管其包装如何。 在麦克风模块的框架内，电路板用于至少一个麦克风组件部分的第二级安装，其中在其表面中形成有至少一个连接开口，其终止于电路的层结构中的空腔 板。 此外，具有连接开口的电路板表面被配置为用于密封安装麦克风部件在连接开口上方，从而麦克风部件通过电路板中的连接开口与电路板中的空腔声学连接 表面，并且该腔用作麦克风组件部分的背面体积。

公开(公告)号：US09451699B2

公开(公告)日：2016-09-20

申请号：US14017567

申请日：2013-09-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yasunari Ukita

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/184 ,  H05K3/3436 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K2201/2009 ,  Y02P70/611 ,  Y02P70/613

Abstract: According to one embodiment, a circuit board is provided with a first rectangular electronic component, a board and a reinforcing plate. The first electronic component has a plurality of connection terminals. The board has the first electronic component mounted thereon via the connection terminals, and has a through hole for receiving a second electronic component at a position at which the first electronic component overlaps with the second electronic component. The reinforcing plate is attached to the back surface of the board, and has a plurality of first portions near the corner portions of the first electronic component, and a second portion of a strip shape coupling the first portions and located near the hole. The first and second portions are formed integral as one body.

Abstract translation: 根据一个实施例，电路板设置有第一矩形电子部件，板和加强板。 第一电子部件具有多个连接端子。 该板具有经由连接端子安装在其上的第一电子部件，并且具有用于在第一电子部件与第二电子部件重叠的位置处接收第二电子部件的通孔。 加强板附接到板的背面，并且在第一电子部件的角部附近具有多个第一部分，以及连接第一部分并位于孔附近的带状的第二部分。 第一和第二部分一体地形成为一体。

公开(公告)号：US09433091B1

公开(公告)日：2016-08-30

申请号：US14918620

申请日：2015-10-21

Applicant: International Business Machines Corporation

Inventor： Andreas C. Doering

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K7/00 ,  H01K3/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/101 ,  H05K1/0293 ,  H05K3/0094 ,  H05K3/4697 ,  H05K2201/0329 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2203/1142 ,  H05K2203/1178 ,  H05K2203/173 ,  H05K2203/175

Abstract: A method is provided for customizing connections of conductors of a printed circuit board (PCB) including conductors and a cavity formed in a thickness of the PCB, and adjoining two of the conductors. The cavity includes two distinct electrical contacts, each in electrical communication with one of the two conductors. The cavity is at least partly filled with an electrically conductive material to enable electrical communication between the two conductors. The cavity is preferably a buried cavity, joined by one or more ducts, such that the electrically conductive material can be injected into the cavity via the duct. One, or each, of the two conductors is an inner conductor of the PCB. The injected conductive material may be a liquid or a gel; and is preferably a conductive adhesive. The present invention further concerns a PCB as obtained from the above method.

Abstract translation: 提供了一种用于定制印刷电路板（PCB）的导体的连接的方法，所述印刷电路板（PCB）包括导体和形成在PCB的厚度中的空腔以及邻接的两个导体。 空腔包括两个不同的电触点，每个电触点与两个导体之一电连通。 空腔至少部分地填充有导电材料，以实现两个导体之间的电连通。 空腔优选地是由一个或多个管道连接的掩埋空腔，使得导电材料可以经由管道被注入到空腔中。 两个导体中的一个或每个导体是PCB的内部导体。 注入的导电材料可以是液体或凝胶; 优选为导电性粘合剂。 本发明还涉及从上述方法获得的PCB。

公开(公告)号：US20160223179A1

公开(公告)日：2016-08-04

申请号：US15011479

申请日：2016-01-29

Applicant: BRIDGELUX, INC.

Inventor： Robert LaDUCA ,  Howard HERRERA

IPC: F21V29/70 ,  F21V19/00

CPC classification number: F21V23/005 ,  F21V15/01 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/18 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: Some embodiments of the invention comprise a lighting assembly comprising including a substrate including a first side, a second side and an opening. The lighting assembly includes several electronic components disposed on the first side of the substrate. The lighting assembly includes a light emitting element attached to the substrate on the first side and positioned within the opening of the substrate.

Abstract translation: 本发明的一些实施例包括照明组件，其包括包括第一侧，第二侧和开口的基板。 照明组件包括设置在基板的第一侧上的多个电子部件。 照明组件包括在第一侧附接到基板并位于基板的开口内的发光元件。

公开(公告)号：US09370107B2

公开(公告)日：2016-06-14

申请号：US14255971

申请日：2014-04-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Wei-Ming Cheng

IPC: H05K13/04 ,  H05K1/18 ,  H05K3/28 ,  H05K1/11 ,  H01L27/00

CPC classification number: H05K13/04 ,  H05K1/11 ,  H05K1/114 ,  H05K1/183 ,  H05K1/184 ,  H05K1/186 ,  H05K3/284 ,  H05K2201/09072 ,  H05K2201/10083 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: An embedded component structure includes a wiring board, a component and an encapsulant. The wiring board has a front side, a reverse side opposite to the front side, an opening and an interconnection layer. The opening penetrates the wiring board and connects the front side and the reverse side of the wiring board. The interconnection layer is located on the front side of the wiring board and extends toward the opening. The component includes an active surface, a back side opposite to the active side, and a working area located on the active surface. The active surface is connected to the interconnection layer of the wiring board. The encapsulant is filled inside the opening and covers the component, which makes the working area of the component exposed. Besides, a method of the embedded component structure is also provided.

Abstract translation: 嵌入式组件结构包括布线板，部件和密封剂。 布线板具有前侧，与前侧相反的反面，开口和互连层。 开口穿过布线板并连接布线板的正面和背面。 互连层位于布线板的正面，朝向开口部延伸。 该部件包括活动表面，与活动侧相对的后侧以及位于活动表面上的工作区域。 有源表面连接到布线板的互连层。 密封剂填充在开口内部并覆盖部件，这使得部件的工作区域暴露。 此外，还提供了嵌入式组件结构的方法。

公开(公告)号：US20160135302A1

公开(公告)日：2016-05-12

申请号：US14938191

申请日：2015-11-11

Applicant: IBIDEN CO., LTD.

Inventor： Naoyuki NAGAYA ,  Kiyotaka Tsukada

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/341 ,  H05K1/0206 ,  H05K3/005 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y02P70/613

Abstract: A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.

Abstract translation: 用于安装电子部件的基板包括：基材，其包括绝缘树脂，形成在所述材料的第一表面上的第一导体层，形成在所述材料的第二表面上的第二导体层，以及插入穿透所述材料的孔中的金属块 第一导体，材料和第二导体，使得金属块安装在孔中。 所述材料具有与所述孔中的所述金属块接触的弯曲部分，使得所述弯曲部朝向所述第二导体弯曲，所述金属块在第一导体侧具有表面，使得所述表面具有具有弯曲表面的外周部分 并且所述孔在所述第一导体层侧具有第一配件入口，在所述第二导体侧具有第二配件入口，并且所述金属块被定位成与所述第二配件入口接触。

公开(公告)号：US20160135280A1

公开(公告)日：2016-05-12

申请号：US14897615

申请日：2014-06-10

Applicant: THALES

Inventor： Sebastien BONNET ,  Serge VERDEYME ,  Michel CAMPOVECCHIO ,  Alain DRAVET ,  Marc-Yves LIENHART

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H05K1/0204 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/4623 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2201/1056

Abstract: The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that it is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m·K), placed in the first cavity so as to be in contact with the electronic component.

Abstract translation: 具有多层结构的印刷电路包括：加工成形成通过该层的点表面的第一层，包含通过该层的第一腔的第二层，在一个面上包括电子部件的第三层， 在第一空腔中，包括第二空腔的第四层，具有两部分的导热元件：一个由金属制成的称为热盖的导热元件，其被插入到第一层的表面中以机械和电气闭合， 第一腔，另一个由导热> 30W /（m·K）的介电材料制成，放置在第一腔中以与电子部件接触。

公开(公告)号：US09253879B2

公开(公告)日：2016-02-02

申请号：US13875896

申请日：2013-05-02

Applicant: NITTO DENKO CORPORATION

Inventor： Jun Ishii ,  Saori Kanazaki

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  G11B5/48 ,  H05K3/40 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0296 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/189 ,  H05K3/06 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract translation: 布线电路板包括线，以及在布线电路板的厚度方向上在其一个表面上电连接到电线以电连接到电子元件的端子。 端子在其厚度方向的一个表面上包括在厚度方向上朝向其一侧突出的突出部分和覆盖突出部分在厚度方向上的一个端部的覆盖层。