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    DESIGN SUPPORT METHOD, RECORDING MEDIUM STORING DESIGN SUPPORT PROGRAM AND SEMICONDUCTOR DEVICE
    22.
    发明申请
    DESIGN SUPPORT METHOD, RECORDING MEDIUM STORING DESIGN SUPPORT PROGRAM AND SEMICONDUCTOR DEVICE 有权
    设计支持方法，记录媒体存储设计支持程序和半导体器件

    公开(公告)号：US20130328156A1

    公开(公告)日：2013-12-12

    申请号：US13834899

    申请日：2013-03-15

    Applicant: FUJITSU LIMITED

    Inventor： Akiyoshi SAITOU

    IPC: G06F17/50 ,  H01L27/02

    CPC classification number: G06F17/5072 ,  H01L21/4853 ,  H01L23/50 ,  H01L27/02 ,  H01L27/0207 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K3/0005 ,  H05K2201/09081 ,  H01L2924/00

    Abstract: A design support method includes: selecting, by a computer, a power feed point of an integrated semiconductor circuit on a first board model in which a power supply layer and a ground layer are stacked; determining a first placement position of a first protrusion portion from the first board model on a side of the first board model, the first protrusion portion being corresponding to the power feed point; determining a second placement position of a second protrusion portion from the first board model on the side of the first board model, the second protrusion portion provided so as to separate from the first placement position by a distance; and placing the first protrusion portion and the second protrusion portion on the first placement position and the second placement position, respectively.

    Abstract translation: 一种设计支持方法包括：通过计算机在集成半导体电路的电源层和接地层堆叠的第一板模型上进行选择; 从所述第一板模型确定第一突出部分在所述第一板模型的一侧的第一放置位置，所述第一突出部分对应于所述馈电点; 从所述第一板模型确定第二突出部分在所述第一板模型侧的第二放置位置，所述第二突出部分设置成与所述第一放置位置分开一定距离; 以及将第一突出部分和第二突出部分分别放置在第一放置位置和第二放置位置上。

    Electrical circuitry
    24.
    发明授权
    Electrical circuitry 有权
    电路

    公开(公告)号：US08575498B2

    公开(公告)日：2013-11-05

    申请号：US12737446

    申请日：2009-06-15

    Applicant: Andre Lischeck ,  Juergen Stein

    Inventor： Andre Lischeck ,  Juergen Stein

    IPC: H05K5/00 ,  H05K1/00

    CPC classification number: H05K1/0271 ,  H05K1/02 ,  H05K7/1417 ,  H05K2201/09081 ,  H05K2201/10598

    Abstract: An electrical circuitry has a base element, a printed circuit board and a fastening apparatus for fastening the printed circuit board to the base element. The fastening apparatus retains the printed circuit board by virtue of the base element being present on a top side and underside of the printed circuit board. In this case, the base element acts upon the top side and underside of the printed circuit board at application points which are opposite one another at an offset with respect to one another while elastically deforming the printed circuit board.

    Abstract translation: 电路具有基底元件，印刷电路板和用于将印刷电路板紧固到基底元件的紧固装置。 紧固装置通过存在于印刷电路板的上侧和下侧上的基座元件来保持印刷电路板。 在这种情况下，基板元件在印刷电路板的顶侧和下侧作用在彼此相对彼此偏移并且使印刷电路板弹性变形的应用点处。

    Suspension board with circuit and producing method thereof
    25.
    发明授权
    Suspension board with circuit and producing method thereof 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US08525037B2

    公开(公告)日：2013-09-03

    申请号：US13325815

    申请日：2011-12-14

    Applicant: Masaki Mizutani

    Inventor： Masaki Mizutani

    IPC: H05K1/02

    CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/0191 ,  H05K2201/09081 ,  Y10T29/49126

    Abstract: A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.

    Abstract translation: 具有电路的悬挂板包括万向节部分。 万向节部分包括在开口的内侧形成的舌部，用于安装有安装有用于电连接到导电层的磁头的滑块，形成在开口的外侧以支撑舌头的外伸支架部分 并且穿过通过万向架部分的开口和/或外伸支架部分的外侧区域的通过部分。 通过部分包括导电层和覆盖导电层的绝缘层。 通过部分中的绝缘层的下半部分的厚度与其上半部分的厚度相同。

    Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length
    27.
    发明授权
    Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length 有权
    头部万向节组件，滑块和制造头部万向节组件的方法，导线长度减小

    公开(公告)号：US08503132B2

    公开(公告)日：2013-08-06

    申请号：US11509972

    申请日：2006-08-25

    Applicant: Eiki Oosawa

    Inventor： Eiki Oosawa

    IPC: G11B5/60

    CPC classification number: G11B5/60 ,  H05K3/3442 ,  H05K2201/09081 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613

    Abstract: A head gimbal assembly for a hard disk drive includes a head slider having a head element part which performs reading and/or writing of data to/from a magnetic disc and a suspension on which the head slider is mounted. Bonding pads formed on the head slider are formed on a side surface of the head slider except for an air bearing surface (ABS) which faces the magnetic disc and a back surface on a side opposite to the ABS. End peripheries of the bonding pads are arranged to be in contact with an end periphery of the side surface of the head slider which abuts on the back surface of the head slider.

    Abstract translation: 用于硬盘驱动器的头万向架组件包括具有头元件部分的磁头滑动器，磁头元件部件执行从磁盘读取和/或写入数据以及安装磁头滑块的悬架。 形成在磁头滑块上的接合焊盘形成在磁头滑块的侧表面上，除了面向磁盘的空气轴承表面（ABS）和与ABS相对的一侧的后表面。 接合焊盘的端部周边被布置成与头部滑块的侧表面的与端部滑块的后表面邻接的端部周边接触。

    Printed circuit board interconnecting structure with compliant cantilever interposers
    28.
    发明授权
    Printed circuit board interconnecting structure with compliant cantilever interposers 失效
    印刷电路板互连结构与柔性悬臂插入器

    公开(公告)号：US08466371B2

    公开(公告)日：2013-06-18

    申请号：US12267864

    申请日：2008-11-10

    Applicant: Erick Spory

    Inventor： Erick Spory

    IPC: H05K1/16

    CPC classification number: H05K1/16 ,  H01R12/52 ,  H01R12/7082 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/10378

    Abstract: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on the pad, and a second copper plate-up area is deposited on the distal end of the trace. A slot, semi-circumscribing the pad and extending on both sides of the trace toward the distal end of the trace, is cut through the substrate to allow the proximal end of the trace to be displaced in a cantilevered manner below the lower side of the substrate when a force is applied to the pad.

    Abstract translation: 用于互连两个电子模块的互连结构。 该结构包括具有沉积在其下表面上的铜迹线的电介质基板，以及直接位于迹线一端上方的衬底的上表面上的铜焊盘。 沉积在垫上的第一铜平板区域和第二铜平板区域沉积在迹线的远端上。 将衬垫半封闭并在迹线的两侧延伸到迹线的远端的狭缝被切穿穿过衬底，以允许迹线的近端以悬臂方式移位到下方的下方 当将力施加到衬垫时，衬底。

    Circuit element coupling devices and methods for flexible and other circuits
    29.
    发明授权
    Circuit element coupling devices and methods for flexible and other circuits 有权
    用于柔性和其他电路的电路元件耦合器件和方法

    公开(公告)号：US08460026B2

    公开(公告)日：2013-06-11

    申请号：US13093117

    申请日：2011-04-25

    Applicant: Michael J. Tate ,  David G. Sime

    Inventor： Michael J. Tate ,  David G. Sime

    IPC: H01R13/00

    CPC classification number: H05K1/189 ,  H05K1/038 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10037 ,  Y10T29/49204

    Abstract: Embodiments relate to coupling and/or holding devices for electrically and/or mechanically contacting circuit elements, such as power sources, sensors, transducers and other devices. In one embodiment, a coupling device comprises a substrate having at least one printed conductive element and at least one fold, flap, slit, slot, perforation or other alteration configured to encourage contact between a circuit element, such as a battery, sensor, transducer or other element, and the at least one printed conductive element.

    Abstract translation: 实施例涉及用于电和/或机械接触电路元件（例如电源，传感器，换能器和其它装置）的装置和/或保持装置。 在一个实施例中，耦合装置包括具有至少一个印刷导电元件的基板和至少一个折叠，折片，狭缝，狭槽，穿孔或其它改变，其构造成促进电路元件 或其他元件，以及所述至少一个印刷导电元件。

    OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR
    30.
    发明申请
    OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREFOR 失效
    OPTO-ELECTRIC HYBRID BOARD及其制造方法

    公开(公告)号：US20120251055A1

    公开(公告)日：2012-10-04

    申请号：US13409422

    申请日：2012-03-01

    Applicant: Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

    Inventor： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

    IPC: G02B6/42 ,  H05K3/36

    CPC classification number: G02B6/42 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4257 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/002 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10121 ,  Y02P70/611 ,  Y10T29/49 ,  Y10T29/49126

    Abstract: Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.

    Abstract translation: 提供了一种光电混合板和制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元。 光波导单元包括用于定位电路单元的插座部分，其形成在下包层的表面上并且由与芯相同的材料形成。 插座部分相对于芯的一个端面位于预定位置处。 电路单元包括通过使电路板的一部分弯曲成立以形成以弯曲的弯曲部分，用于装配到插座部分中。 弯曲部分相对于光学元件位于预定位置。 光波导单元和电路单元在弯曲部分配合到插座部分的状态下耦合。

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