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    Microstructure and Process for its Assembly
    21.
    发明申请
    Microstructure and Process for its Assembly 审中-公开
    其组装及其组装工艺

    公开(公告)号：US20110048799A1

    公开(公告)日：2011-03-03

    申请号：US12857737

    申请日：2010-08-17

    Applicant: Sebastian Kisban ,  Stanislav Herwik ,  Patrick Ruther ,  Tobias Holzhammer ,  Oliver Paul

    Inventor： Sebastian Kisban ,  Stanislav Herwik ,  Patrick Ruther ,  Tobias Holzhammer ,  Oliver Paul

    IPC: H02G3/00 ,  B81C1/00

    CPC classification number: B81C3/004 ,  B81B2201/12 ,  B81B2207/07 ,  B81C3/008 ,  H01R12/79 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/091 ,  H05K2201/1059 ,  Y10T29/49002

    Abstract: In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one electrical contact element (7a, 7b). Provision is made of a flexible cable (8) having a flat substrate layer (9) made of an electrically insulating material and at least one strip conductor (10) arranged thereon. The cable (8) has at least one tongue (14a, 14b) on which is arranged at least one counter-contact element (11a, 11b) connected to the strip conductor (10). The cable (8) and the microstructure pieces (5) are positioned relative to each other in a preassembly position in which the connecting region (6) is opposite the receiving recess (3) and the tongue (14a, 14b) is aligned between the connecting region (6) and the receiving recess (3). The connecting region (6) is then introduced in the receiving recess (3) by displacement of the microstructure pieces (2, 5) toward one another. In doing so the at least one tongue (14a, 14b) is deflected in the receiving recess (3) in such a way that the at least one counter-contact element (11a, 11b) contacts the at least one contact element (7a, 7b).

    Abstract translation: 在组装微结构（1）的方法中，提供在其表面上具有接收凹槽（3）的第一微结构件（2）和具有连接区域（6）的第二微结构件（5） 接收凹部（3），并且其上布置有至少一个电接触元件（7a，7b）。 设置有具有由电绝缘材料制成的平坦基底层（9）的柔性电缆（8）和布置在其上的至少一个带状导体（10）。 电缆（8）具有至少一个舌片（14a，14b），其上设置有至少一个连接到带状导体（10）的反接触元件（11a，11b）。 电缆（8）和微结构件（5）在连接区域（6）与容纳凹部（3）相对的预组装位置中相对定位，并且舌部（14a，14b）在 连接区域（6）和接收凹部（3）。 然后通过使微结构件（2,5）彼此移位将连接区域（6）引入到容纳凹部（3）中。 在这样做时，至少一个舌片（14a，14b）在接收凹部（3）中被偏转，使得至少一个反接触元件（11a，11b）接触至少一个接触元件（7a， 7b）。

    Electronic apparatus and method of manufacturing the same
    22.
    发明授权
    Electronic apparatus and method of manufacturing the same 有权
    电子设备及其制造方法

    公开(公告)号：US07829387B2

    公开(公告)日：2010-11-09

    申请号：US12385693

    申请日：2009-04-16

    Applicant: Masashi Yamasaki ,  Mutsumi Yoshino

    Inventor： Masashi Yamasaki ,  Mutsumi Yoshino

    IPC: H01L21/00

    CPC classification number: H05K7/142 ,  H05K3/202 ,  H05K3/341 ,  H05K2201/091 ,  H05K2201/10598 ,  H05K2203/175 ,  Y10T29/49144

    Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

    Abstract translation: 电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。 布线板固定在柱状部分上，使得布线电路与基部间隔开。 布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。 布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。 电子器件在热回流工艺中立即焊接到布线板上。

    Motor
    23.
    发明授权
    Motor 失效
    发动机

    公开(公告)号：US07812489B2

    公开(公告)日：2010-10-12

    申请号：US12030272

    申请日：2008-02-13

    Applicant: Toshifumi Hino ,  Nobuhiko Sato

    Inventor： Toshifumi Hino ,  Nobuhiko Sato

    IPC: H02K5/22 ,  H02K3/50

    CPC classification number: H05K3/445 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K3/0061 ,  H05K3/306 ,  H05K3/3421 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10287

    Abstract: The present invention provides a motor that enables a lead of a coil to be appropriately led through holes, while allowing the lead of the coil to be fixed without contacting a wall surface of the hole in a base. Cuts 14b are formed in an insulating sheet or a printed circuit board 14; the cuts 14b extend substantially radially or spirally from a lead lead-out portion 14a as a center. Thus, even if an end of the lead 7a abuts against an area located outside the lead lead-out portion 14a, the abutting area and a nearby area located in the vicinity of the abutting area are pushed open along the cuts 14b extending from the lead lead-out portion 14a and guide the end of the lead 7a toward the lead lead-out portion 14a. The end of the lead 7a is thus appropriately guided into the lead lead-out portion 14a.

    Abstract translation: 本发明提供一种电动机，其能够使线圈的引线适当地引导通孔，同时允许线圈的引线固定而不接触基座中的孔的壁表面。 切屑14b形成在绝缘片或印刷电路板14中; 切口14b从作为中心的引出引出部分14a基本上径向或螺旋地延伸。 因此，即使引线7a的端部与引线引出部分14a的外侧的区域抵接，位于邻接区域附近的邻接区域和附近区域也沿着从引线延伸的切口14b被推开 引出部分14a并且引导引线7a的端部朝向引线引出部分14a。 引线7a的端部被适当地引导到引出引出部分14a中。

    MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    26.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
    多层陶瓷基板及其制造方法

    公开(公告)号：US20100112284A1

    公开(公告)日：2010-05-06

    申请号：US12691782

    申请日：2010-01-22

    Applicant: Yuichi IIDA ,  Osamu CHIKAGAWA

    Inventor： Yuichi IIDA ,  Osamu CHIKAGAWA

    IPC: B32B3/10 ,  B32B3/00 ,  B29C65/02 ,  B29C65/56

    CPC classification number: H05K1/186 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/091 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T156/1002 ,  Y10T428/24322 ,  Y10T428/24612 ,  Y10T428/24926 ,  Y10T428/24942

    Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

    Abstract translation: 层压体包括基材层和设置在其间的层间约束层。 所述基材层由包含玻璃材料和第一陶瓷材料的第一粉末的烧结体形成，所述中间层约束层包括第二粉末，所述第二粉末包括在用于熔化所述玻璃的温度下不被烧结的第二陶瓷材料 并且处于这样的状态，即第二粉末通过在烘烤时包含在基材层中的包含玻璃材料的第一粉末的一部分的扩散或流动而粘附在一起。 所引入的元件处于其整个外围被层间限制层覆盖的状态。

    Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder
    29.
    发明授权
    Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder 失效
    磁头组件焊接电极焊盘的焊盘和电极焊盘的柔性布线基板一起焊接

    公开(公告)号：US07649715B2

    公开(公告)日：2010-01-19

    申请号：US11553892

    申请日：2006-10-27

    Applicant: Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

    Inventor： Ooki Yamaguchi ,  Takao Haino ,  Hideaki Abe

    IPC: G11B5/58

    CPC classification number: H05K3/3442 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/189 ,  H05K3/326 ,  H05K3/3494 ,  H05K2201/091 ,  H05K2201/10727 ,  H05K2203/107 ,  Y02P70/613

    Abstract: A magnetic head assembly is provided. The magnetic head assembly includes a slider in which a head element is mounted. A flexure supports the slider. The flexure includes a pair of outriggers, a connection portion, and a tongue portion. A flexible wiring substrate is fixedly bonded to the surface of the flexure. An electrode pad of the slider and an electrode pad of the flexible wiring substrate are bonded to each other by solder. A plurality of solder bonded portions are arranged on the connection portion. A deformable portion is formed in the pair of outriggers and located on an extended line on which the solder bonded portions are arranged, so that the free end side of the flexure is deformable.

    Abstract translation: 提供磁头组件。 磁头组件包括其中安装有头元件的滑块。 挠性件支撑滑块。 挠曲件包括一对外伸支架，连接部分和舌部。 柔性布线基板固定地粘合到挠曲件的表面上。 滑块的电极焊盘和柔性布线基板的电极焊盘通过焊料彼此接合。 多个焊接接合部分布置在连接部分上。 可变形部分形成在该对外伸支架中并且位于其上布置焊料接合部分的延伸线上，使得挠曲件的自由端侧可变形。

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