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    PRINTED BOARD
    24.
    发明申请
    PRINTED BOARD 审中-公开

    公开(公告)号：US20180235076A1

    公开(公告)日：2018-08-16

    申请号：US15737876

    申请日：2016-07-04

    Applicant: NEC Corporation

    Inventor： Kazuhiro KASHIWAKURA ,  Ayako UEMURA

    IPC: H05K1/02 ,  H05K3/46 ,  H05K9/00 ,  H05K1/11

    CPC classification number: H05K1/0216 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/11 ,  H05K3/46 ,  H05K9/0064 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09609 ,  H05K2201/10

    Abstract: An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

    MULTILAYER SUBSTRATE
    25.
    发明申请
    MULTILAYER SUBSTRATE 审中-公开

    公开(公告)号：US20180177040A1

    公开(公告)日：2018-06-21

    申请号：US15840598

    申请日：2017-12-13

    Applicant: Onkyo Corporation

    Inventor： Makoto YOSHIDA

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/115 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0225 ,  H05K1/0259 ,  H05K9/0039 ,  H05K9/006 ,  H05K2201/093 ,  H05K2201/09327 ,  H05K2201/09354

    Abstract: A multilayer substrate includes plural layers of circuit patterns. Each circuit pattern includes a ground conductor surrounding a wiring region provided with a conductive wiring pattern. Each ground conductor includes a slit connecting between the outside of the multilayer substrate and the wiring region. In the multilayer substrate, the slit of the ground conductor provided at one of adjacent two layers of the circuit patterns and the slit of the ground conductor provided at the other circuit pattern are formed at positions not overlapping with each other. That is, these slits are formed at such positions that a view in an upper-to-lower direction is blocked. The shape of the slit of each ground conductor is in such a shape that a view from an end side of the multilayer substrate to a wiring region side is blocked.

    MULTILAYER WIRING BOARD
    26.
    发明申请
    MULTILAYER WIRING BOARD 有权
    多层接线板

    公开(公告)号：US20140133115A1

    公开(公告)日：2014-05-15

    申请号：US13922349

    申请日：2013-06-20

    Applicant: FUJI XEROX Co., Ltd.

    Inventor： Daisuke IGUCHI

    IPC: H05K1/02

    CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09345 ,  H05K2201/09663

    Abstract: A multilayer wiring board includes a signal electrode, a first power supply electrode, and a ground electrode, which are connected to a first element that outputs a signal, an electrode connected to a second element that receives the signal, a ground layer that serves as a return path for a return current of the signal, a first power supply layer that is disposed adjacent to the ground layer with a dielectric layer interposed therebetween and supplies electric power to the first element, and a second power supply layer that is provided independently of the first power supply layer and supplies electric power to the second element. The first power supply layer causes the return current to return to the first element through the first power supply electrode as a displacement current between the ground layer and the first power supply layer.

    Abstract translation: 多层布线板包括信号电极，第一电源电极和接地电极，它们连接到输出信号的第一元件，连接到接收信号的第二元件的电极，用作 用于所述信号的返回电流的返回路径，与所述接地层相邻设置有电介质层并且向所述第一元件提供电力的第一电源层和与所述第一电源层独立地设置的第二电源层， 第一电源层并且向第二元件供电。 第一电源层使返回电流通过第一电源电极返回到第一元件，作为接地层和第一电源层之间的位移电流。

    LAMINATED HIGH-FREQUENCY MODULE
    27.
    发明申请
    LAMINATED HIGH-FREQUENCY MODULE 审中-公开
    层压高频模块

    公开(公告)号：US20110284281A1

    公开(公告)日：2011-11-24

    申请号：US13109030

    申请日：2011-05-17

    Applicant: Takahiro AKIYAMA

    Inventor： Takahiro AKIYAMA

    IPC: H05K1/11

    CPC classification number: H05K1/0218 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K3/4611 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09972

    Abstract: In a laminated high-frequency module, a laminate includes a plurality of dielectric layers. In a lower layer region including some of the plurality of dielectric layers, a digital circuit is provided. In an interlayer region including some of the plurality of dielectric layers, a digital circuit and an analog circuit are arranged so that they do not overlap in plan view of the laminate. In an upper layer region including some of the plurality of dielectric layers, a digital circuit is provided. Digital ICs are mounted on the surface of the uppermost dielectric layer in the upper layer region. An inner-layer ground electrode is provided on substantially an entire boundary surface between the lower layer region and the interlayer region and on substantially an entire boundary surface between the interlayer region and the upper layer region. In the interlayer region, a digital line and an inner-layer ground electrode are alternately arranged in the lamination direction.

    Abstract translation: 在层压高频模块中，层叠体包括多个电介质层。 在包括多个电介质层中的一些的下层区域中，提供数字电路。 在包括多个电介质层中的一些的层间区域中，布置数字电路和模拟电路，使得它们在叠层的平面图中不重叠。 在包括多个电介质层中的一些的上层区域中，提供数字电路。 数字IC被安装在上层区域中最上层的电介质层的表面上。 内层接地电极设置在下层区域和层间区域之间的基本整个边界表面上以及在层间区域和上层区域之间的大致整个边界表面上。 在层间区域中，数字线和内层接地电极在层叠方向上交替布置。

    MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
    28.
    发明申请
    MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS 审中-公开
    多层柔性印刷线路板和电子设备

    公开(公告)号：US20110139492A1

    公开(公告)日：2011-06-16

    申请号：US13033828

    申请日：2011-02-24

    Applicant: Mitsuhiko Sugane

    Inventor： Mitsuhiko Sugane

    IPC: H05K1/00

    CPC classification number: H05K1/0218 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/148 ,  H05K3/3447 ,  H05K3/363 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/096 ,  H05K2201/10303

    Abstract: A multilayer flexible printed circuit board includes a core material made of an insulating material having bendability. A solid layer is provided on one surface of the core material. The solid layer is made of an electrically conductive material to form a ground plane. A wiring layer is provided on the other surface of the core material. The wiring layer is made of an electrically conductive material having a controlled impedance. The core material, the solid layer and the wiring layer together form one set of lamination. A plurality of sets of the lamination are laminated via an insulation layer.

    Abstract translation: 多层柔性印刷电路板包括由具有弯曲性的绝缘材料制成的芯材。 在芯材的一个表面上设置固体层。 固体层由导电材料制成以形成接地平面。 在芯材的另一个表面上设置布线层。 布线层由具有受控阻抗的导电材料制成。 核心材料，固体层和布线层一起形成一组层压。 通过绝缘层层叠多组层叠体。

    PRINTED CIRCUIT BOARD
    29.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：US20110139489A1

    公开(公告)日：2011-06-16

    申请号：US12772469

    申请日：2010-05-03

    Applicant: Hee-Soo Yoon ,  Dong-Hwan Lee ,  Kyoung-Ho Lee ,  Yoon-Dong Kim ,  Su-Bong Jang

    Inventor： Hee-Soo Yoon ,  Dong-Hwan Lee ,  Kyoung-Ho Lee ,  Yoon-Dong Kim ,  Su-Bong Jang

    IPC: H05K1/00

    CPC classification number: H05K1/0227 ,  H05K1/0262 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09663

    Abstract: A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed on one surface of the insulation substrate and connected to a second power source, a separator, which separates the first ground from the second ground, a first signal line, which is stacked on at least one of the first ground and the second ground, and a second signal line, which is stacked on at least one of the first ground and the second ground and is adjacent to the first signal line. The separator can include a curved part, which is bent in between the first signal line and the second signal line.

    Abstract translation: 公开了印刷电路板。 根据本发明的实施例的印刷电路板可以包括绝缘基板，第一接地，其形成在绝缘基板的一个表面上并连接到第一电源，第二接地形成在第一接地 绝缘基板的表面并且连接到第二电源，将第一接地与第二接地分离的隔离件，堆叠在第一接地和第二接地中的至少一个上的第一信号线，以及第二接地 信号线，其堆叠在第一接地和第二接地中的至少一个上并且与第一信号线相邻。 分离器可以包括在第一信号线和第二信号线之间弯曲的弯曲部分。

    Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces
    30.
    发明申请
    Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces 有权
    制造具有电隔离的多层电路装置的方法紧密间隔的电流携带痕迹

    公开(公告)号：US20090158581A1

    公开(公告)日：2009-06-25

    申请号：US12263416

    申请日：2008-10-31

    Applicant: Vinh T. Nguyen ,  Claude A.S. Hamrick

    Inventor： Vinh T. Nguyen ,  Claude A.S. Hamrick

    IPC: H05K3/10 ,  H01S4/00

    CPC classification number: H05K3/1258 ,  H05K3/108 ,  H05K3/125 ,  H05K3/243 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09536 ,  H05K2201/098 ,  H05K2203/013 ,  H05K2203/0568 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A process for making a multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces, comprising of providing an insulative substrate having a first side coated with a layer of conductive metal intended to form a ground plane; providing a plurality of seed layer traces of a predetermined width of approximately 25 microns or less separated from each other by a predetermined distance of approximately 25 microns or less on a second side of the insulative substrate, the narrowness of such separation being essentially limited only by characteristics of the photoresist material to be deposited and developed therebetween and to withstand subsequent processing; developing ribs or barriers of photoresist forming vertical walls rising above the spaces separating the seed layer traces and defining valleys or channels thereover; depositing a desired thickness of conductive material over the seed layer traces and in the valleys or channels between the vertical walls; stripping away the resist ribs or barriers to leave conductive traces to be variously used as ground lines, signal lines and power lines; repeating the previous steps to develop a plurality of circuit boards; stacking the several circuit boards and joining them together with layers of insulative material; identifying particular ones of the traces as signal lines and other traces as power lines and/or ground lines; interconnecting at least some of the ground lines on one board to ground lines and/or ground planes on other boards by conductors extending through vias; interconnecting signal lines to signal input and output terminals; and perhaps to signal lines on other boards through vias; and interconnecting power lines to power input and output terminals, and perhaps to power lines on other boards through vias.

    Abstract translation: 一种用于制造具有电隔离的紧密间隔的电流载体轨迹的多层电路器件的方法，包括提供一个绝缘衬底，该绝缘衬底具有涂覆有用于形成接地平面的导电金属层的第一侧; 提供大约25微米或更小的预定宽度的多个种子层迹线，其在绝缘衬底的第二面上彼此隔开约25微米或更小的预定距离，这种分离的狭窄本质上仅受限于 要在其间沉积和显影的光致抗蚀剂材料的特性，并承受随后的加工; 显影光刻胶的肋或障碍物形成垂直壁，上面分开种子层迹线并在其上限定谷或沟道的空间上方; 在所述种子层迹线和所述垂直壁之间的谷或通道中沉积所需厚度的导电材料; 剥离抗蚀肋或障碍物，使导电迹线不同地用作接地线，信号线和电源线; 重复以前的步骤来开发多个电路板; 堆叠几个电路板并将其与绝缘材料层连接在一起; 将特定的迹线识别为信号线和其它迹线作为电力线和/或接地线; 将一个板上的至少一些接地线与通过通孔延伸的导体将其它板上的接地线和/或接地平面互连; 互连信号线到信号输入和输出端子; 也许通过通孔在其他董事会上发出信号; 并将电源线互连到电源输入和输出端子，并且可能通过通孔将其他电路板上的电源线连接起来。

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