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    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME
    21.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME 失效
    电磁带结构与印刷电路板

    公开(公告)号：US20100252319A1

    公开(公告)日：2010-10-07

    申请号：US12650486

    申请日：2009-12-30

    Applicant: Won Woo CHO ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    Inventor： Won Woo CHO ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    IPC: H05K9/00

    CPC classification number: H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

    Abstract translation: 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 带隙结构包括包括多个导电板的导电层; 以及设置在所述导电层上或下的金属层，并且包括将所述第一导电板电连接到所述多个导电板的第二导电板的缝合图案。 带隙结构包括形成在与导电层不同的金属层中的螺旋缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。

    RING OF POWER VIA
    22.
    发明申请
    RING OF POWER VIA 审中-公开
    电源环

    公开(公告)号：US20100236823A1

    公开(公告)日：2010-09-23

    申请号：US12406850

    申请日：2009-03-18

    Applicant: LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

    Inventor： LIEN-FEN HU ,  JORGE E. MARTINEZ-VARGAS, JR. ,  SAMUEL M. LEE ,  KARL A. SAUTER ,  AARON MENDELSOHN

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

    Abstract: Systems and methods for providing plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB.

    Abstract translation: 本文描述了用于在PCB中提供电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。

    CIRCUIT BOARD
    24.
    发明申请
    CIRCUIT BOARD 失效
    电路板

    公开(公告)号：US20100172111A1

    公开(公告)日：2010-07-08

    申请号：US12422292

    申请日：2009-04-13

    Applicant: Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

    Inventor： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

    IPC: H05K7/00 ,  H01F5/00

    CPC classification number: H05K1/0236 ,  H01F2017/0046 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    Abstract: A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.

    Abstract translation: 提供了包括第一图案化金属层和第二图案化金属层的电路板。 第一图案化金属层具有金属块和螺旋结构。 在任何两个相邻的金属块之间保持间隙。 每个螺旋结构电连接在任何两个相邻的金属块之间。 第二图案化金属层设置在第一图案化金属层旁边并且具有跨接段。 每个跳线段具有与第一端相对的第一端和第二端。 每个螺旋结构具有外端和内端。 外端连接到两个相邻的金属块中的一个。 内端电连接到一个跳线段的第一端，并且跳线段的第二端电连接到两个金属块中的另一个。

    Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
    27.
    发明授权
    Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same 有权
    微电子器件包括桥接互连到被动嵌入式结构的顶层导电层及其制造方法

    公开(公告)号：US07738257B2

    公开(公告)日：2010-06-15

    申请号：US11610385

    申请日：2006-12-13

    Applicant: Islam Salama ,  Yongki Min ,  Huankiat Seh

    Inventor： Islam Salama ,  Yongki Min ,  Huankiat Seh

    IPC: H05K1/18

    CPC classification number: H05K1/162 ,  H05K1/0269 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/09918 ,  H05K2203/0353 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: A microelectronic device, a method of fabricating the device, and a system including the device. The device includes: a substrate including a polymer build-up layer, and a passive structure embedded in the substrate. The passive structure includes a top conductive layer overlying the polymer build-up layer, a dielectric layer overlying the top conductive layer, and a bottom conductive layer overlying the dielectric layer. The device further includes a conductive via extending through the polymer build-up layer and electrically insulated from the bottom conductive layer, an insulation material insulating the conductive via from the bottom conductive layer, and a bridging interconnect disposed at a side of the top conductive layer facing away from the dielectric layer, the bridging interconnect electrically connecting the conductive via to the top conductive layer.

    Abstract translation: 微电子器件，制造该器件的方法以及包括该器件的系统。 该装置包括：包含聚合物累积层的基底和嵌入基底中的被动结构。 被动结构包括覆盖聚合物积聚层的顶部导电层，覆盖顶部导电层的电介质层和覆盖在电介质层上的底部导电层。 该器件还包括延伸穿过聚合物积聚层并与底部导电层电绝缘的导电通孔，将导电通孔与底部导电层绝缘的绝缘材料以及布置在顶部导电层侧面的桥接互连 背离电介质层，桥接互连将导电通孔电连接到顶部导电层。

    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
    28.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 有权
    电磁带结构和印刷电路板

    公开(公告)号：US20100134212A1

    公开(公告)日：2010-06-03

    申请号：US12568324

    申请日：2009-09-28

    Applicant: Han KIM ,  Kang-Wook Bong

    Inventor： Han KIM ,  Kang-Wook Bong

    IPC: H01P1/20

    CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627

    Abstract: An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface; second conductive plates, placed on a second planar surface; a first conductive trace, electrically connecting any two adjacent first conductive plates with each other on the first planar surface, in which the two adjacent first conductive plates are in a first direction; a second conductive trace, electrically connecting any two adjacent second conductive plates with each other on the second planar surface, in which the two adjacent second conductive plates are in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the first planar surface with each other; and a second stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the second planar surface with each other.

    Abstract translation: 电磁带隙结构包括：第一导电板，放置在第一平面上; 第二导电板，放置在第二平面上; 第一导电迹线，在第一平坦表面上电连接任何两个相邻的第一导电板，其中两个相邻的第一导电板处于第一方向; 第二导电迹线，在第二平坦表面上彼此相互连接任何两个相邻的第二导电板，其中两个相邻的第二导电板处于第一方向; 第一缝合通孔，将在第一平面上的与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接; 以及第二缝合通孔，将在第二平坦表面上沿与第一方向不同的方向排列的任何两个相邻的导电部彼此电连接。

    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
    29.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD 审中-公开
    电磁带结构和印刷电路板

    公开(公告)号：US20100132996A1

    公开(公告)日：2010-06-03

    申请号：US12466677

    申请日：2009-05-15

    Applicant: Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

    Inventor： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Kang-Wook Bong

    IPC: H05K1/11

    CPC classification number: H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

    Abstract: In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other.

    Abstract translation: 根据本发明的实施例，电磁带隙结构包括多个导电板，以及多通孔连接部，其将多个导电板中的任何两个彼此电连接。 这里，多通孔连接部件包括：包括第一通孔的第一多通孔，其具有连接到两个导电板中的一个的一个端部，以及至少一个其它通孔，其连接到第一通孔，通过导电 跟踪; 包括连接到所述两个导电板中的另一个的一个端部的第二多通孔，以及至少一个通过导电迹线串联连接到所述第二通孔的另一通孔; 以及导电连接图案，其将包括在第一多通孔中的任何一个通孔和包括在第二多通孔中的任何一个通孔彼此连接。

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