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    Device housing package
    21.
    发明授权
    Device housing package 有权
    设备外壳包装

    公开(公告)号：US09408307B2

    公开(公告)日：2016-08-02

    申请号：US14382801

    申请日：2013-03-05

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

    IPC: H05K5/00 ,  H05K1/18 ,  H01L23/057 ,  H05K1/16

    CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

    Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

    Method for producing package, method for producing electronic device, and electronic device
    22.
    发明授权
    Method for producing package, method for producing electronic device, and electronic device 有权
    包装方法，电子装置的制造方法以及电子装置

    公开(公告)号：US09370106B2

    公开(公告)日：2016-06-14

    申请号：US13962201

    申请日：2013-08-08

    Applicant: Seiko Epson Corporation

    Inventor： Tomoyuki Kamakura

    IPC: H05K5/06 ,  H05K1/18 ,  C04B37/04 ,  H03H9/10 ,  C04B37/00 ,  H05K1/02

    CPC classification number: H05K1/183 ,  C04B37/005 ,  C04B37/045 ,  C04B2237/10 ,  H01L2224/16225 ,  H03H9/1021 ,  H05K1/0284 ,  H05K2201/10075

    Abstract: A method for producing a package includes preparing a base substrate provided with a low-melting glass and a lid, defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere, and joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere.

    Abstract translation: 制造包装的方法包括制备具有低熔点玻璃和盖子的基底基材，通过将低熔点玻璃加热至等于或高于倾点的温度在减压下将低熔点玻璃消泡 气氛，并且通过使基底基板和盖子彼此叠加通过低熔点玻璃而将基底和盖子彼此接合，然后将低熔点玻璃加热至等于或高于倾点的温度 在减压气氛中。

    DEVICE HOUSING PACKAGE
    24.
    发明申请
    DEVICE HOUSING PACKAGE 有权
    设备外壳包装

    公开(公告)号：US20150016074A1

    公开(公告)日：2015-01-15

    申请号：US14382801

    申请日：2013-03-05

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Eiichi Katayama ,  Emi Mukai ,  Atsushi Ogasawara

    IPC: H05K1/18 ,  H05K1/16

    CPC classification number: H05K1/181 ,  H01L23/057 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K1/184 ,  H05K1/189 ,  H05K2201/0344 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10143 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10196 ,  H01L2924/00

    Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

    Abstract translation: 一种器件外壳封装，包括矩形形式的衬底，在其上表面具有器件的安装区域; 框架体，其设置在所述基板上，以沿着所述安装区域的外周延伸，所述框体具有在其一部分处形成的切口; 以及设置在所述切口中的输入输出端子。 输入输出端子包括第一绝缘层，覆盖在第一绝缘层上的第二绝缘层和覆盖在第二绝缘层上的第三绝缘层。 设置在预定电位的第一端子设置在第一绝缘层的上表面上。 设置在预定电位的第二端子设置在第一绝缘层的下表面上。 AC信号流过的第三端子设置在第二绝缘层的上表面上。

    CERAMIC PACKAGE
    25.
    发明申请
    CERAMIC PACKAGE 有权
    陶瓷包装

    公开(公告)号：US20140319982A1

    公开(公告)日：2014-10-30

    申请号：US14360143

    申请日：2012-12-20

    Applicant: NGK Spark Plug Co., Ltd.

    Inventor： Hiroaki Yamamoto ,  Yoshitaka Yoshida ,  Takatoshi Tojo ,  Naoki Kito ,  Kazushige Akita ,  Jun Suzuki

    IPC: H01L23/10

    CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H03H9/1014 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10075 ,  H01L2924/00

    Abstract: Provided is a ceramic package having a cavity in which an electronic component such as a crystal oscillator is mounted, and which realizes even joining of a metallic frame around the opening thereof, as well as reliable sealing of the opening. A ceramic package 1 includes a package main body 2 which is formed of a ceramic material, which has a front surface 3 and a back surface 4 having a rectangular shape in plan view, and which has a cavity 6 opening toward the front surface 3; a first metalized layer 11 which has a frame shape in plan view and is formed on the front surface 3; and a second metalized layer 12 which is formed on the front surface 10 of the first metalized layer 11 so as to assume a frame shape, and which has a width w2 smaller than the width w1 of the first metalized layer 11, the width w2 being measured in an inward/outward direction of the package main body 2, wherein the width w2, in the inward/outward direction, of the second metalized layer 12a at each corner portion C of the front surface 3 in plan view is smaller than the width w1, in the inward/outward direction, of the second metalized layer 12 in a region other than the corner portion C in plan view.

    Abstract translation: 提供一种陶瓷封装，其具有安装有诸如晶体振荡器的电子部件的空腔，并且实现了金属框架围绕其开口的均匀接合以及可靠地密封开口。 陶瓷封装1包括由陶瓷材料形成的封装主体2，其具有前表面3和俯视图中具有矩形形状的背面4，并且具有朝向前表面3开口的空腔6; 第一金属化层11，其在平面图中具有框架形状并形成在前表面3上; 以及第二金属化层12，其形成在第一金属化层11的前表面10上以呈现框架形状，并且具有小于第一金属化层11的宽度w1的宽度w2，宽度w2为 在包装主体2的向内/向外方向上测量，其中在平面图中，前表面3的每个拐角部分C处的第二金属化层12a在向内/向外方向上的宽度w2小于宽度 在平面图中，在角部C以外的区域中的第二金属化层12的向内/向外方向w1。

    COMPOSITE ELECTRONIC COMPONENT
    26.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号：US20140313682A1

    公开(公告)日：2014-10-23

    申请号：US14257006

    申请日：2014-04-21

    Applicant: NIHON DEMPA KOGYO CO., LTD.

    Inventor： HIROYUKI MITOME

    IPC: H05K1/02

    CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

    Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

    METHOD FOR PRODUCING PACKAGE, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    27.
    发明申请
    METHOD FOR PRODUCING PACKAGE, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 有权
    生产包装的方法，用于生产电子装置的方法和电子装置

    公开(公告)号：US20140049927A1

    公开(公告)日：2014-02-20

    申请号：US13962201

    申请日：2013-08-08

    Applicant: Seiko Epson Corporation

    Inventor： Tomoyuki Kamakura

    IPC: H05K1/18 ,  C04B37/04

    CPC classification number: H05K1/183 ,  C04B37/005 ,  C04B37/045 ,  C04B2237/10 ,  H01L2224/16225 ,  H03H9/1021 ,  H05K1/0284 ,  H05K2201/10075

    Abstract: A method for producing a package includes preparing a base substrate provided with a low-melting glass and a lid, defoaming the low-melting glass by heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere, and joining the base substrate and the lid to each other by superimposing the base substrate and the lid on each other through the low-melting glass, and then heating the low-melting glass to a temperature equal to or higher than the pour point in a reduced pressure atmosphere.

    Abstract translation: 制造包装的方法包括制备具有低熔点玻璃和盖子的基底基材，通过将低熔点玻璃加热至等于或高于倾点的温度在减压下将低熔点玻璃消泡 气氛，并且通过使基底基板和盖子彼此叠加通过低熔点玻璃而将基底和盖子彼此接合，然后将低熔点玻璃加热至等于或高于倾点的温度 在减压气氛中。

    SURFACE MOUNT OVENIZED OSCILLATOR ASSEMBLY
    29.
    发明申请
    SURFACE MOUNT OVENIZED OSCILLATOR ASSEMBLY 审中-公开
    表面安装过滤振荡器组件

    公开(公告)号：US20130321088A1

    公开(公告)日：2013-12-05

    申请号：US13804564

    申请日：2013-03-14

    Applicant: Pierino Vidoni ,  Marc Yvain Pasche ,  Pierre Krummenacher

    Inventor： Pierino Vidoni ,  Marc Yvain Pasche ,  Pierre Krummenacher

    IPC: H03L1/04

    CPC classification number: H03L1/04 ,  H05K1/0212 ,  H05K2201/09181 ,  H05K2201/10075 ,  H05K2203/165

    Abstract: An oscillator assembly including a base substrate with a cavity defining an insulative air pocket. A component substrate is seated on the base substrate. An oscillator and a combination heater/temperature control assembly are located on one side and a temperature control assembly is located on the opposite side and extends into the cavity. An interior lid covers and defines an oven for the oscillator and the heater/temperature control assembly. An exterior lid covers the interior lid. A thermal resistance/heat transfer element is seated on the oscillator for increasing thermal resistance and is seated on both the oscillator and the heater/temperature control assembly for decreasing thermal resistance.

    Abstract translation: 一种振荡器组件，包括具有限定绝缘气囊的空腔的基底基板。 部件基板安置在基底基板上。 振荡器和组合加热器/温度控制组件位于一侧，温度控制组件位于相对侧并延伸到空腔中。 内盖盖住并定义了振荡器和加热器/温度控制组件的烘箱。 外盖覆盖内盖。 热阻/传热元件位于振荡器上以增加热阻，并且位于振荡器和加热器/温度控制组件上以降低热阻。

    Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate
    30.
    发明授权
    Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate 有权
    电子元件封装，电子元器件封装基座，电子元件封装和电路基板的结构

    公开(公告)号：US08279610B2

    公开(公告)日：2012-10-02

    申请号：US12674505

    申请日：2008-08-21

    Applicant: Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

    Inventor： Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

    IPC: H05K1/00 ,  H05K1/18

    CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

    Abstract translation: 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基座的短边方向上的与一个角位置相对的另一个角位置处设置有沿着基座的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。

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