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    WIRING SUBSTRATE AND ELECTRONIC DEVICE
    23.
    发明申请
    WIRING SUBSTRATE AND ELECTRONIC DEVICE 有权
    接线基板和电子设备

    公开(公告)号：US20140196934A1

    公开(公告)日：2014-07-17

    申请号：US14233984

    申请日：2012-06-29

    Applicant: Hiroshi Kawagoe ,  Kazuhiko Yagi

    Inventor： Hiroshi Kawagoe ,  Kazuhiko Yagi

    IPC: H05K1/02

    CPC classification number: H05K1/0209 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/498 ,  H01L23/49844 ,  H01L24/73 ,  H01L33/641 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H05K1/0204 ,  H05K3/246 ,  H05K2201/10416 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base, the heat dissipation member containing Cu; a surface metal layer disposed on a surface of the insulating base, the surface metal layer contacting and covering the heat dissipation member, the surface metal layer containing Mo as a main component, the surface metal layer including a surface portion containing Cu; and a plating layer disposed on the surface metal layer, wherein Cu contained in the heat dissipation member and Cu contained in the surface portion are bonded to each other.

    Abstract translation: 提供了在表面金属层上充分镀覆镀层并具有优异的可靠性的布线基板。 布线基板包括绝缘基底; 所述散热构件设置在所述绝缘基座中，所述散热构件部分地从所述绝缘基底露出，所述散热构件包含Cu; 表面金属层，其设置在所述绝缘基材的表面上，所述表面金属层与所述散热构件接触并覆盖，所述表面金属层包含以Mo为主要成分的所述表面金属层，所述表面金属层包括含有Cu的表面部分; 以及设置在表面金属层上的镀层，其中包含在散热构件中的Cu和表面部分中包含的Cu彼此结合。

    Substrate for Optical Device
    24.
    发明申请
    Substrate for Optical Device 审中-公开
    光学元件基板

    公开(公告)号：US20140177242A1

    公开(公告)日：2014-06-26

    申请号：US14232593

    申请日：2012-07-11

    Applicant: Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    Inventor： Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    IPC: H01L33/64

    CPC classification number: H01L33/647 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48505 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

    Abstract translation: 光学元件用基板技术领域本发明涉及一种用于光学元件的基板，其被配置为以配合的方式连接光学元件基板和电极基板，并且同时形成一个或多个与光学元件基板绝缘的桥接焊盘 水平绝缘层，在光学元件基板上。 根据本发明第一方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 分别在光学元件基板的两个侧表面上分别连接由绝缘材料制成的一对电极基板，以在其上表面的至少一部分上形成导电层，并将其导线接合到电极 的光学元件; 以及形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置。 根据本发明第二方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 由金属材料制成的一对电极基片，分别与光学元件基板的两个侧面连接，并且被引线接合到光学元件的电极上; 形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置; 以及插入在所述光学元件基板和所述电极基板之间的嵌合型垂直绝缘层，以便连接到所述装配装置。

    Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit
    28.
    发明授权
    Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit 有权
    用于电磁屏蔽和散发由电子部件释放的热量的装置及相应的电子电路

    公开(公告)号：US08422234B2

    公开(公告)日：2013-04-16

    申请号：US13056833

    申请日：2009-06-19

    Applicant: Jacques Goriaux ,  Alain Bironneau ,  Jean-Pierre Mauclerc

    Inventor： Jacques Goriaux ,  Alain Bironneau ,  Jean-Pierre Mauclerc

    IPC: H05K7/20

    CPC classification number: H05K7/205 ,  H05K1/0204 ,  H05K9/0032 ,  H05K2201/10371 ,  H05K2201/10416 ,  H05K2201/10545

    Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.

    Abstract translation: 提供了用于电磁屏蔽电子部件并且用于耗散由部件产生的热量的装置。 该组件包括被设计成通过散热器紧固到印刷电路的第一面（称为后表面）的封装，散热片穿过印刷电路的背面并出现在印刷电路的第二面上 称为前脸。 该装置包括安装在印刷电路的正面上并限定电磁屏蔽外壳的金属结构。 金属结构具有大致相对于散热器的第一散热开口。 该装置还包括至少一个热连接器，其第一端紧固到金属结构，并且其第二端紧固到散热器附近的散热器和/或印刷电路的正面。

    Method for Fabricating Heat Dissipation Substrate
    29.
    发明申请
    Method for Fabricating Heat Dissipation Substrate 有权
    制造散热基板的方法

    公开(公告)号：US20120255165A1

    公开(公告)日：2012-10-11

    申请号：US13352553

    申请日：2012-01-18

    Applicant: Chen-Chuan Chang

    Inventor： Chen-Chuan Chang

    IPC: H05K3/00

    CPC classification number: H05K1/0204 ,  H01L33/642 ,  H01L33/644 ,  H05K3/022 ,  H05K3/4046 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A method for fabricating a heat dissipation substrate is disclosed. The method includes the steps of: providing a substrate, wherein the substrate includes a metal layer, an insulation layer, and a first conductive layer, of which the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer; removing the partial metal layer for forming a metal bulk; providing an adhesive layer, wherein the adhesive layer includes an opening, and the opening is corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; forming a third conductive layer in the hole.

    Abstract translation: 公开了一种制造散热基板的方法。 该方法包括以下步骤：提供衬底，其中衬底包括金属层，绝缘层和第一导电层，绝缘层位于金属层和第一导电层之间，金属层 比第一导电层厚; 去除用于形成金属体的部分金属层; 提供粘合剂层，其中所述粘合剂层包括开口，并且所述开口对应于所述金属体; 提供第二导电层; 层叠第二导电层，粘合剂层和基板; 在所述绝缘层和所述第一导电层中形成孔，其中所述孔位于所述金属体下方; 在孔中形成第三导电层。

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