公开(公告)号：US07273988B2

公开(公告)日：2007-09-25

申请号：US11150210

申请日：2005-06-13

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/16

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。

公开(公告)号：US20070123082A1

公开(公告)日：2007-05-31

申请号：US11669068

申请日：2007-01-30

Applicant: Benjamin Eldridge

Inventor： Benjamin Eldridge

IPC: H01R13/62

CPC classification number: G01R1/0466 ,  G01R1/06711 ,  G01R1/07307 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/67005 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01R12/57 ,  H01R12/714 ,  H01R12/853 ,  H01R13/2407 ,  H05K3/303 ,  H05K3/325 ,  H05K3/4092 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y10S439/948 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits.

Abstract translation: 互连组件和形成和使用它们的方法。 在本发明的一个示例中，互连组件包括基板，弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置，其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中，止动结构设置在具有第一接触元件的第一基板上，该止动结构限定弹性接触元件的第一位置，该第一位置设置在第二基板上，弹性接触元件位于其中 与第一接触元件机械和电接触。 本发明的其他方面包括形成停止结构并使用该结构来执行集成电路的测试的方法，所述集成电路包括例如集成电路的半导体晶片。

公开(公告)号：US07221868B2

公开(公告)日：2007-05-22

申请号：US11110155

申请日：2005-04-20

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H01R12/00

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

Abstract translation: 在根据本发明的照相机中，透镜筒单元的边缘部分从前盖突出并布置。 透镜筒单元被连接到前盖的前盖圆柱形构件覆盖，并且前盖圆柱形构件的前部暴露部分被外部圆柱形构件覆盖为可拆卸（安装前）金属圆柱形构件。 外圆柱形部件通过前盖侧的止动爪定位并固定。 具有柔性的C形止挡部分盖被制成柔性并且被安装在止动爪部分周围，并由螺钉固定。 相机的镜筒单元的外观上的设计限制减少，摄像机外部部分可以由金属制成。

公开(公告)号：US20070020959A1

公开(公告)日：2007-01-25

申请号：US11486027

申请日：2006-07-14

Applicant: Toshihiko Sasaki ,  Toshio Ishimoto ,  Masayoshi Terashima ,  Naofumi Okayama

Inventor： Toshihiko Sasaki ,  Toshio Ishimoto ,  Masayoshi Terashima ,  Naofumi Okayama

IPC: H05K1/00

CPC classification number: H05K3/306 ,  H01R12/7011 ,  H01R13/64 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2203/167 ,  H05K2203/168

Abstract: A plurality of jacks are a video signal jack, a left audio signal jack, and a right audio signal jack from left to right. Jack fixing protrusions are formed on a surface of each jack which surface is attached to a circuit board. The jack fixing protrusions are arranged differently among the respective jacks, and can be inserted only into attachment portions of the circuit board corresponding to the respective jacks. Namely, insertion of the respective jacks into incorrect attachment portions is made physically impossible, and erroneous insertion of the jacks can be prevented.

Abstract translation: 多个插孔是从左到右的视频信号插孔，左音频信号插孔和右音频信号插孔。 千斤顶固定突起形成在每个千斤顶的表面附接到电路板的表面上。 千斤顶固定突起在各个插孔之间布置不同，并且可以仅插入到对应于各个插孔的电路板的安装部分中。 也就是说，将各个千斤顶插入错误的安装部分在物理上是不可能的，并且可以防止插座的错误插入。

公开(公告)号：US07161236B2

公开(公告)日：2007-01-09

申请号：US10118580

申请日：2002-04-08

Applicant: Lee Choon Kuan ,  Lee Kian Chai

Inventor： Lee Choon Kuan ,  Lee Kian Chai

IPC: H01L23/48

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10S438/926 ,  Y10S438/928 ,  Y10T428/24 ,  Y10T428/24802 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.

公开(公告)号：US07053493B2

公开(公告)日：2006-05-30

申请号：US10992651

申请日：2004-11-22

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

Abstract translation: 一种半导体器件，包括衬底，安装在衬底上的半导体元件和经由粘合剂附着到衬底的与安装半导体元件的表面相对的表面的加强件。 粘合剂的热膨胀系数小于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或大于10GPa。 否则，粘合剂的热膨胀系数大于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或小于10GPa。 加强件的高度小于外部端子的高度。

公开(公告)号：US06979781B2

公开(公告)日：2005-12-27

申请号：US10882204

申请日：2004-07-02

Applicant: Kenji Aoki

Inventor： Kenji Aoki

IPC: H01L23/28 ,  H01L23/00 ,  H01L23/12 ,  H01L23/498 ,  H05K3/30 ,  H05K13/04 ,  H05K5/06

CPC classification number: H01L23/562 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/303 ,  H05K13/04 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package has first and second surfaces and has a plurality of pedestals disposed on the first surface, for keeping a certain height of the semiconductor package after mounting.

Abstract translation: 半导体封装具有第一表面和第二表面，并且具有设置在第一表面上的多个基座，用于在安装之后保持半导体封装的一定高度。

公开(公告)号：US06941537B2

公开(公告)日：2005-09-06

申请号：US10067244

申请日：2002-02-07

Applicant: Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  G06F17/50

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A standoff device provides predetermined control of a standoff distance between electrical components mounted together with opposing conductive grid array patterns. In an embodiment, a predetermined electrical function is provided by the device to at least one of the electrical components. The standoff device comprises a plurality of rigid one-piece standoff pins which, in an embodiment, contains one or more stops which buttress against the electrical components to serve as a distancing control structure. In an embodiment, the standoff device is integral with one of the electrical components.

Abstract translation: 对接装置提供了通过相对的导电栅格阵列图案安装在一起的电气部件之间的间隔距离的预定控制。 在一个实施例中，预定的电功能由该装置提供给至少一个电气部件。 间隔装置包括多个刚性的一体式支座销，在一个实施例中，该销钉包含一个或多个支撑电气部件以用作隔离控制结构的止挡件。 在一个实施例中，支座装置与电气部件之一是一体的。

公开(公告)号：US20050185951A1

公开(公告)日：2005-08-25

申请号：US11110155

申请日：2005-04-20

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H05K1/14 ,  H05K3/36 ,  G03B17/02

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

公开(公告)号：US06924964B2

公开(公告)日：2005-08-02

申请号：US10316026

申请日：2002-12-11

Applicant: Hiroyuki Ashiya ,  Masataka Suzuki ,  Yoshiyuki Tanaka ,  Shingo Matsuura

Inventor： Hiroyuki Ashiya ,  Masataka Suzuki ,  Yoshiyuki Tanaka ,  Shingo Matsuura

IPC: H05K3/34 ,  H01H1/58 ,  H01H45/04 ,  H01H45/14 ,  H01H50/14 ,  H01H50/44 ,  H05K1/18 ,  H05K3/30 ,  H01H47/00

CPC classification number: H01H1/5805 ,  H01H50/14 ,  H01H50/443 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L′ in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.

Abstract translation: 用于电连接的端子（11,13）分别具有要接合到布线板（20）的前端部分（11b，13b），焊料和基端部分（11a，13a）从盖子 7）由热膨胀材料制成。 为了使基端部吸收由于电磁线圈（5）由于中间部（11c，13c）的偏转变形而产生的热而受到热膨胀的盖受到的外力的应力 端子位于比布线板20更靠近盖子的位置，并且继电器件安装在布线板上，端子沿着端子的延伸方向形成有预定长度的L'，从而确保必要的柔性所需的长度 对于中间部分。