公开(公告)号：US20080080152A1

公开(公告)日：2008-04-03

申请号：US11541840

申请日：2006-10-02

Applicant: Jeffrey Scott Duppong ,  Dale Arthur Janssen ,  Amanda Renee Wyland ,  Richard James Livdahl ,  Vincent Guy Segal ,  Travis Lee Johnston ,  Nathan Matthew Hawk

Inventor： Jeffrey Scott Duppong ,  Dale Arthur Janssen ,  Amanda Renee Wyland ,  Richard James Livdahl ,  Vincent Guy Segal ,  Travis Lee Johnston ,  Nathan Matthew Hawk

IPC: H05K7/00

CPC classification number: H05K3/366 ,  H05K3/301 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A circuit board arrangement includes a first printed circuit board having a first edge connector and a second printed circuit board having a second edge connector. The first edge connector includes a plurality of fingers, with each finger having at least one first conductor pad. The second edge connector includes a plurality of openings positioned generally in line with each other and a plurality of second conductor pads. Each opening has a corresponding finger positioned therein. Each second conductor pad is positioned adjacent a corresponding opening and corresponding first conductor pad.

Abstract translation: 电路板装置包括具有第一边缘连接器的第一印刷电路板和具有第二边缘连接器的第二印刷电路板。 第一边缘连接器包括多个手指，每个手指具有至少一个第一导体垫。 第二边缘连接器包括多个通常彼此成直线定位的开口和多个第二导体焊盘。 每个开口具有定位在其中的相应手指。 每个第二导体焊盘定位在相应的开口和对应的第一导体焊盘附近。

公开(公告)号：US07316571B1

公开(公告)日：2008-01-08

申请号：US11626982

申请日：2007-01-25

Applicant: Hung-Chi Chen

Inventor： Hung-Chi Chen

IPC: H01R12/00

CPC classification number: H01R12/7011 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10606

Abstract: A circuit module includes a printed circuit board, which is vertically mounted on a system circuit board. The support structure includes a first supporting member and a second supporting member. The first supporting member is arranged on a first side of the printed circuit board and includes a first bottom surface lying flat on the system circuit board. The second supporting member is arranged on a second side of the printed circuit board and includes a second bottom surface lying flat on the system circuit board, wherein the second side is opposed to the first side. The first supporting member and the second supporting member cooperatively clamp a lower edge of the printed circuit board therebetween.

Abstract translation: 电路模块包括垂直安装在系统电路板上的印刷电路板。 支撑结构包括第一支撑构件和第二支撑构件。 第一支撑构件布置在印刷电路板的第一侧上，并且包括平坦地放置在系统电路板上的第一底面。 第二支撑构件布置在印刷电路板的第二侧上，并且包括平面放置在系统电路板上的第二底面，其中第二侧与第一侧相对。 第一支撑构件和第二支撑构件协同地夹持印刷电路板的下边缘。

公开(公告)号：US07269031B2

公开(公告)日：2007-09-11

申请号：US11236340

申请日：2005-09-27

Applicant: Klaus Lorenzen

Inventor： Klaus Lorenzen

IPC: H05K7/12

CPC classification number: H05K3/301 ,  H01F17/062 ,  H01F27/027 ,  H01F2027/065 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A board-mounting device (20) which includes a base carrier (10) that can be snapped down on a board (14). The base carrier (10) includes at least one locking hook (22) which engages behind the board (14) in the mounted condition of the device (20). The device (20) further includes a device carrier (11), connected with the base carrier (10), which is adapted to be moved relative to the base carrier (10). The locking hook (22) is provided with at least one shoulder (43) on which the device carrier (11) is supported by at least one guide pin (31, 40, 50, 60) before the device (20) is in its mounted condition.

Abstract translation: 一种板安装装置（20），其包括能够卡在板（14）上的基座（10）。 底架（10）包括在装置（20）的安装状态下接合板（14）后面的至少一个锁定钩（22）。 装置（20）还包括与基座（10）连接的装置载体（11），其适于相对于基架（10）移动。 锁定钩（22）设置有至少一个肩部（43），在装置（20）处于其中之前，装置载体（11）在其上由至少一个引导销（31,40,50,60）支撑在其上 安装条件。

公开(公告)号：US07264500B2

公开(公告)日：2007-09-04

申请号：US11353604

申请日：2006-02-14

Applicant: Eriko Noguchi

Inventor： Eriko Noguchi

IPC: H01R3/00 ,  H01M2/10

CPC classification number: H01M2/10 ,  H01M2/0222 ,  H01M2/0421 ,  H01M2/20 ,  H01M2/30 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10666

Abstract: A portable electronic apparatus comprises a frame having a recessed portion for receiving a battery. The recessed portion has a bottom portion that has an upper surface on which the battery seats. A circuit board is disposed beneath the frame and has two locking holes positioned at spaced-apart locations beneath a lower surface of the bottom portion. A negative battery terminal is disposed in an opening formed in the bottom portion. The negative battery terminal has two battery contact spring portions for elastically contacting a negative terminal of the battery and two locking spring portions that are sandwiched between the lower surface of the bottom portion and the circuit board. The two locking spring portions terminate in elastically deformable locking portions that are inserted into, and elastically deformed to make pressure contact with, inner walls of respective ones of the locking holes.

Abstract translation: 便携式电子设备包括具有用于接收电池的凹部的框架。 凹部具有底部，其具有电池座所在的上表面。 电路板设置在框架下方，并具有位于底部下表面下方隔开位置的两个锁定孔。 负极电池端子设置在形成在底部的开口中。 负极端子具有用于弹性地接触电池的负极的两个电池接触弹簧部分和夹在底部的下表面和电路板之间的两个锁定弹簧部分。 两个锁定弹簧部分终止于弹性变形的锁定部分，该弹性变形的锁定部分插入到弹性变形的锁定部分中，弹性变形以与相应的锁定孔的内壁压力接触。

公开(公告)号：US20070149007A1

公开(公告)日：2007-06-28

申请号：US11644251

申请日：2006-12-21

Applicant: Yasuo Horiuchi

Inventor： Yasuo Horiuchi

IPC: H05K1/00

CPC classification number: H05K3/301 ,  H04N5/64 ,  H04N5/642 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10606

Abstract: The formation of the retaining member 42 at the forming of the main board 40 so as to be able to be cut off and the cutting-off from the main board 40 after the board forming of the main board 40 causes the retaining member 42 to be separated in a letterpress shape from the main board 40. In addition, on the main board 40, the earphone plug socket 44 is mounted with the plug-in inlet 44b facing the outer periphery, the slit is formed and the projected part 43a of the retaining member 42 is fitted into the slit as well. Further, the fitting of the retaining member 42 into the slit 46 causes the side edge 43b thereof to abut on a groove 44a at the back surface of the earphone plug socket 44.

Abstract translation: 在主板40的板形成之后，在形成主板40时能够被切断和从主板40的切断形成保持构件42，使得保持构件42成为 从主板40以凸版形状分离。此外，在主板40上，耳机插头插座44安装有插入口44b，其面向外周，形成狭缝并且突出部分43a 保持构件42也嵌合在狭缝中。 此外，将保持构件42装配到狭缝46中使得其侧边缘部分3bb抵靠在耳机插头插座44的后表面上的凹槽44a上。

公开(公告)号：US20060238999A1

公开(公告)日：2006-10-26

申请号：US11080015

申请日：2005-03-14

Applicant: Yuan Cheng

Inventor： Yuan Cheng

IPC: B60Q1/26

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10606

Abstract: A light device includes a number of brackets disposed on a base board, and a number of light members engaged in the brackets respectively, for attaching to the base board. The light members are made of light emitting diodes and arranged in series, to generate a light of an increased brightness, and to have an increased working life. The light members will not generate a great heat such that the working life of the light members may further be increased. A control device may be coupled to the light members, to control and to operate the light members. A number of driving devices may be coupled to the light members and the control device, to control and to operate the light members to generate lights of different colors.

Abstract translation: 灯装置包括设置在基板上的多个托架以及分别与托架相配合的多个灯构件，用于附接到基板。 光构件由发光二极管制成并且串联布置，以产生亮度增加的光，并且具有增加的工作寿命。 轻构件不会产生大的热量，从而可以进一步增加轻构件的使用寿命。 控制装置可以耦合到灯构件，以控制和操作灯构件。 多个驱动装置可以耦合到光部件和控制装置，以控制和操作光部件以产生不同颜色的光。

公开(公告)号：US20060124614A1

公开(公告)日：2006-06-15

申请号：US10536251

申请日：2003-12-01

Applicant: Stephane Rossopoulos ,  Irene Verettas ,  Raymond Clavel

Inventor： Stephane Rossopoulos ,  Irene Verettas ,  Raymond Clavel

IPC: B23K26/20

CPC classification number: B23K33/00 ,  B23K1/0056 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/10606 ,  H05K2203/0475 ,  H05K2203/107 ,  Y02P70/613

Abstract: The invention relates to a method for fixing a miniaturized component, especially comprising a micro-optical element, to a pre-determined fixing section of a baseplate by means of a soldered joint. Said baseplate comprises an upper side and a lower side, and the component comprises a base surface. At least the fixing section of the baseplate is coated on the upper side by a metallic layer which is applied at least in the fixing section in a continuously plane manner and thus without interruptions. Solder material is applied at least to the fixing section coated with the metallic layer. In one step of the method, the component is arranged above the fixing section, the base surface of the component being positioned above the solder material in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other. In another step, thermal energy is supplied, especially by means of a laser beam, in a region which is locally limited essentially to the fixing section, in order to melt the solder from the lower side of the baseplate, such that the intermediate region is filled by drop formation of the melted solder, fixing both sides.

Abstract translation: 本发明涉及一种通过焊接接头将小型化部件（特别是包括微型光学元件）固定到基板的预定固定部分的方法。 所述基板包括上侧和下侧，并且所述部件包括基面。 至少基板的固定部分由金属层涂覆在上侧，至少在固定部分中以连续平面的方式施加，因此不中断。 至少将涂料施加到涂有金属层的固定部分上。 在该方法的一个步骤中，部件布置在固定部分的上方，部件的基底表面位于焊料材料上方，使得它们不接触，垂直间隔并形成彼此之间的中间区域。 在另一个步骤中，特别是通过激光束在局部限制于固定部分的区域中提供热能，以便从底板的下侧熔化焊料，使得中间区域是 通过熔融焊料的熔滴形成填充，固定两侧。

公开(公告)号：US07023291B2

公开(公告)日：2006-04-04

申请号：US10946890

申请日：2004-09-22

Applicant: Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B5/32

CPC classification number: H05K1/0201 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10606

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.

Abstract translation: 提供具有增加的热效率的高度稳定的晶体振荡器。 高度稳定的晶体振荡器包括： 恒温器主机，其保持包括用于密封晶体片的谐振器容器的晶体谐振器的温度，与所述晶体谐振器一起构成振荡电路的振荡元件，控制所述恒温器主机内部的温度的温度控制元件， 以及安装有所述恒温器主机，所述振荡元件和所述温度控制元件的电路板。 该结构使得在所述振荡元件和所述温度控制元件之中具有较高温度依赖性的发热芯片电阻器和高热敏元件被布置在所述电路板的一个主平面上，并且所述发热芯片电阻器， 所述高热敏元件，并且所述恒温器主机通过热导材料直接热粘合。

公开(公告)号：US5319525A

公开(公告)日：1994-06-07

申请号：US880176

申请日：1992-05-06

Applicant: David Lightfoot

Inventor： David Lightfoot

IPC: H03H9/02 ,  H03H3/00 ,  H03H9/58 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K5/00

CPC classification number: H05K1/181 ,  H03H3/00 ,  H05K3/301 ,  H05K1/0233 ,  H05K1/0237 ,  H05K2201/1006 ,  H05K2201/10537 ,  H05K2201/10606 ,  Y02P70/611

Abstract: A circuit assembly comprises a plurality of electronic devices mounted on a circuit board, including a matched pair of devices intended for use together in the same circuit. In order to reduce the risk of using un-matched devices at the assembly stage the pair of matched devices are joined together prior to mounting them on the circuit board. For this purpose a simple bracket is disclosed into which the two devices can be inserted from opposite ends by push-fitting.

Abstract translation: 一种电路组件包括安装在电路板上的多个电子装置，包括一组旨在一起用于同一电路中的一对装置。 为了减少在组装阶段使用不匹配的设备的风险，将这对匹配的设备在将它们安装在电路板上之前连接在一起。 为此，公开了一种简单的支架，其中两个装置可以通过推入从相对端插入。

公开(公告)号：US5211579A

公开(公告)日：1993-05-18

申请号：US884492

申请日：1992-05-15

Applicant: Au Y. C. Seong ,  Yuen P. Wong

Inventor： Au Y. C. Seong ,  Yuen P. Wong

IPC: H01M2/02 ,  H01M2/10 ,  H01M2/20 ,  H01R12/70 ,  H05K3/30

CPC classification number: H01M2/20 ,  H01M2/1055 ,  H01R12/7076 ,  H05K3/301 ,  H01M2/022 ,  H05K2201/10325 ,  H05K2201/10606

Abstract: A battery holder is disclosed which is of one piece construction and which includes a housing having a base and a pair of spaced end walls. One of the end walls is longer than the other and defines a recess therein which is configured to receive one end of the battery when the battery is inserted in the housing. A resilient terminal contact is provided at both ends of the housing and the terminal contact at the end opposite the recess is configured in a manner such that as the battery is being inserted in the housing the terminal contact is biased toward its end of the housing, and when the battery has been inserted into the housing the resilient terminal contact moves into overlying relationship with its end of the battery to hold that end of the battery against removal from the housing. In addition, terminal tails are provided on the terminal contacts which are kinked across their width to retain the connector on a circuit board prior to soldering.