公开(公告)号：US20110256739A1

公开(公告)日：2011-10-20

申请号：US12991442

申请日：2010-04-08

Applicant: Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

Inventor： Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

IPC: H01R12/70 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle includes a signal terminal, a ground terminal, and a signal terminal. A second portion of the ground terminal is distanced from a first portion of the signal terminal in an extension direction. A third portion of the signal terminal is distanced from the first portion of the signal terminal in the extension direction.

Abstract translation: 插座包括信号端子，接地端子和信号端子。 接地端子的第二部分在延伸方向上远离信号端子的第一部分。 信号端子的第三部分在延伸方向上远离信号端子的第一部分。

公开(公告)号：US07944028B2

公开(公告)日：2011-05-17

申请号：US12154753

申请日：2008-05-27

Applicant: Don Saunders ,  Gabe Cherian

Inventor： Don Saunders ,  Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

公开(公告)号：US06884707B1

公开(公告)日：2005-04-26

申请号：US10075060

申请日：2002-02-11

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10825 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于有铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

公开(公告)号：US06790102B2

公开(公告)日：2004-09-14

申请号：US10268327

申请日：2002-10-10

Applicant: Morris D Stillabower ,  Roy A. Visser

Inventor： Morris D Stillabower ,  Roy A. Visser

IPC: H01R1122

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.

公开(公告)号：US5606298A

公开(公告)日：1997-02-25

申请号：US496516

申请日：1995-06-29

Applicant: Josef Weiser

Inventor： Josef Weiser

IPC: H01H1/58 ,  H01H50/02 ,  H01H50/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01H51/22

CPC classification number: H05K3/3426 ,  H01H50/023 ,  H01H50/14 ,  H05K3/308 ,  H01H1/5805 ,  H01H2001/5888 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K3/3421 ,  Y02P70/613

Abstract: In an electrical relay for integration on printed circuit boards, terminal leads thereof emerge from an upper side of a housing that faces away from a floor side or from the printed circuit board, and have bent-over sections extending along sidewalls of the housing down into the region of the floor side, where they form press-in pins or SMT solder terminals. As a result thereof, a decoupling of the press-in stems from the seal leadthroughs at the housing occurs, so that a de-adjustment in the interior of the relay due to the press-in is avoided.

Abstract translation: 在用于集成在印刷电路板上的继电器中，端子引线从外壳的上侧离开地板一侧或从印刷电路板出来，并且具有沿壳体的侧壁延伸的弯曲部分， 地板一侧的区域，形成压入式针脚或SMT焊接端子。 结果是，压入杆从外壳处的密封引线脱离，从而避免了由于压入引起的继电器内部的去调整。

公开(公告)号：US5098305A

公开(公告)日：1992-03-24

申请号：US324906

申请日：1989-03-17

Applicant: Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

Inventor： Nicholas J. Krajewski ,  David J. Johnson ,  Arthur O. Kunstmann

IPC: C22F1/00 ,  H01L21/48 ,  H01L21/607 ,  H01L23/49 ,  H01R4/01 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L24/16 ,  C22F1/006 ,  H01L21/4853 ,  H01L24/11 ,  H01R12/523 ,  H01R4/01 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L24/45 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/49126

Abstract: A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.

Abstract translation: 一种使用机械地插入通孔的存储金属线互连电路板组件的方法和装置。 本发明适用于堆叠电路板组件的互连，其中扭曲的存储金属线被拉伸，使得电线基本上是直的; 插入到电路板的轴向对齐的通孔中; 并释放，使得记忆金属线在穿透孔内改造其原来的扭结形状，在电路板之间形成电连接。 记忆金属合金用于扭结记忆金属丝的构造，以利用低于成形温度范围的奥氏体相中合金的假弹性行为。

公开(公告)号：US5054192A

公开(公告)日：1991-10-08

申请号：US53142

申请日：1987-05-21

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/50 ,  H01R12/52 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/14 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49153

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the hold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract translation: 一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。 本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与芯片表面基本垂直的方式与集成电路芯片的焊盘焊接在一起，将金线插入到通孔的通孔中 一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。 本发明还应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得保持引线在穿通孔内压缩和弯曲 在电路板之间形成电连接。

公开(公告)号：US5045975A

公开(公告)日：1991-09-03

申请号：US386290

申请日：1989-07-27

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L24/45 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4914

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the disc and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract translation: 一种使用在纯通孔内机械压缩的近纯软质退火金的电子电路互连的方法和装置。 本发明的应用是将集成电路芯片直接连接到电路板上，通过将金线以与盘的表面基本垂直的方式将金线焊接到集成电路芯片的焊盘上，并将金引线插入到通孔的通孔中 一旦导线在穿透孔内被压缩就提供电气和机械连接的电路板。 本发明还将其应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得金引线在穿透孔内压缩和弯曲 在电路板之间形成电连接。

公开(公告)号：US4815982A

公开(公告)日：1989-03-28

申请号：US86433

申请日：1987-08-18

Applicant: Amir-Akbar Sadigh-Behzadi

Inventor： Amir-Akbar Sadigh-Behzadi

IPC: H01R12/72 ,  H05K1/02 ,  H05K3/30 ,  H05K1/00

CPC classification number: H05K3/308 ,  H01R12/727 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/10825 ,  Y10S439/908

Abstract: An electrical connector having stress-free resiliently deformable contacts is shown. The connector includes a plurality of elongate contacts having first and second opposed ends. Movement is permitted between respective ends by incorporating a plurality of independently resiliently deformable transition regions in the contacts between the ends thereof. These transition regions permit the contacts to be movable in three dimensions without placing undue stress on either the contact or the fixed terminal ends.

Abstract translation: 示出了具有无应力弹性变形触点的电连接器。 连接器包括具有第一和第二相对端的多个细长触头。 通过在其端部之间的接触中并入多个独立的可弹性变形的过渡区域，在相应的端部之间允许运动。 这些过渡区域允许触点在三维空间中是可移动的，而不会在接触件或固定端子端上施加不适当的应力。

公开(公告)号：US3735307A

公开(公告)日：1973-05-22

申请号：US3735307D

申请日：1971-09-24

Applicant: PHILIPS NV

Inventor： DE GROOT J

IPC: H01F5/04 ,  H01F27/02 ,  H01F27/29 ,  H05K1/02 ,  H05K3/30 ,  H01F1/02

CPC classification number: H01F5/04 ,  H01F27/027 ,  H01F27/29 ,  H01F2005/046 ,  H05K1/0201 ,  H05K3/308 ,  H05K2201/062 ,  H05K2201/10825

Abstract: A support made of a thermoplastic synthetic resin, for an electrical component, such as a coil, having a base with cylindrical apertures in which connecting pins are inserted. The pins comprise strips of twisted metal the width of which is equal to the diameter of the apertures.

Abstract translation: 由热塑性合成树脂制成的支撑件，用于诸如线圈的电气部件，其具有带有插入连接销的圆柱形孔的基座。 销钉包括扭曲金属条，其宽度等于孔的直径。