公开(公告)号：US12051629B2

公开(公告)日：2024-07-30

申请号：US16825512

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunghwa Hyun ,  Younghwan Kim ,  Hwayoung Park ,  Youngsu Ryu ,  Yusang Cheon

IPC: H01L21/66 ,  B05D1/00 ,  G01N21/95 ,  G03F7/16 ,  H01L21/67

CPC classification number: H01L22/12 ,  B05D1/005 ,  G01N21/9503 ,  G03F7/162 ,  H01L21/67023

Abstract: A semiconductor device manufacturing system includes a spin coater and a coating layer inspector. The spin coater includes: a chuck, a rotation driver configured to rotate the chuck; and a solution dispenser configured to spray a solution onto a portion of the coating layer formed on an edge portion of the wafer, wherein the coating layer inspector includes an edge inspection camera and an inspection controller configured to determine a radius, eccentricity, and a top-view shape of the coating layer, based on images of the edge portion of the wafer.

公开(公告)号：US12038263B2

公开(公告)日：2024-07-16

申请号：US17793473

申请日：2021-01-14

Applicant: EURENCO

Inventor： Bastien Chautar ,  Julien Loyer ,  Sébastien Cuvelier

IPC: F42C19/08 ,  B05D1/00 ,  B05D1/26 ,  B05D7/22 ,  C06C7/02 ,  F42B3/195 ,  F42B33/02

CPC classification number: F42C19/0826 ,  B05D1/002 ,  B05D1/26 ,  B05D7/22 ,  C06C7/02 ,  F42B3/195 ,  F42B33/0207

Abstract: A device for depositing paste patterns on the surface of the channel of a tube, the device comprising a frame supporting a first mechanical assembly for holding, positioning and moving the tube, and a second mechanical assembly for extruding paste for depositing said paste patterns, the assemblies cooperating with one another.

公开(公告)号：US20240228789A9

公开(公告)日：2024-07-11

申请号：US18279007

申请日：2022-02-23

Applicant: LEIBNIZ-INSTITUT FÜR POLYMERFORSCHUNG DRESDEN E. V

Inventor： JENS FRIEDRICHS ,  RALF HELBIG ,  LARS DAVID RENNER ,  TILO POMPE ,  JENS-UWE SOMMER ,  CARSTEN WERNER

IPC: C09D4/00 ,  B05D1/00 ,  C09D5/00 ,  C09D7/20

CPC classification number: C09D4/00 ,  B05D1/005 ,  C09D5/00 ,  C09D7/20

Abstract: A molecular assembly having a structural formation of amphiphilic molecules is disclosed where the amphiphilic molecules are selected from a group containing amphiphilic molecules which a) have a hydrophobic moiety and a hydrophilic moiety b) are soluble in a polar aprotic solvent and form self-organizing layer structures in the absence of the polar aprotic solvent, and c) orient molecularly in formed layer structures at an interfacial layer, or in an aqueous environment. The amphiphilic molecules in the formed layer structure are in contact with an aqueous environment. A method for coating a solid surface with a molecular assembly is also disclosed, wherein the amphiphilic molecules are dissolved in a polar aprotic solvent, and resulting solution is applied to a solid surface by spin coating.

公开(公告)号：US20240216948A1

公开(公告)日：2024-07-04

申请号：US18609140

申请日：2024-03-19

Applicant: HZO, Inc.

Inventor： John Janik ,  Sean Clancy ,  Benjamin Lawrence

IPC: B05D1/00 ,  C09D165/04

CPC classification number: B05D1/62 ,  C09D165/04

Abstract: A method for depositing coating onto a substrate includes providing a monomer for creation of a protective coating on a substrate, energizing the monomer with a plasma generation system, and polymerizing the energized monomer onto the substrate in a plasma-enhanced chemical vapor deposition (PECVD) chamber.

公开(公告)号：US12006221B2

公开(公告)日：2024-06-11

申请号：US17546488

申请日：2021-12-09

Applicant: CORNING INCORPORATED ,  Fundació Institut de Ciències Fotòniques (ICFO) ,  Institució Catalana de Recerca i Estudis Avançats

Inventor： Therese Francoise Arliguie ,  Theresa Chang ,  Miriam Marchena Martin-Francés ,  Prantik Mazumder ,  Valerio Pruneri ,  Frederic Christian Wagner

IPC: C01B32/194 ,  B05D1/00 ,  B05D3/12

CPC classification number: C01B32/194 ,  B05D1/005 ,  B05D3/12 ,  B05D2350/60 ,  B05D2505/50 ,  C01B2204/22

Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.

公开(公告)号：US20240188208A1

公开(公告)日：2024-06-06

申请号：US18553715

申请日：2022-03-28

Applicant: UNIVERSITEIT GENT

Inventor： Yuliia Onyshchenko ,  Mehrnoush Narimisa ,  Nathalie De Geyter ,  Rino Morent

IPC: H05H1/46 ,  B05D1/00 ,  H01J37/32

CPC classification number: H05H1/466 ,  H01J37/32091 ,  H01J37/3244 ,  B05D1/62 ,  H01J2237/3382

Abstract: A device for generating a plasma jet is disclosed. A nozzle of the device comprises an inner, middle and outer channel surrounding each other and electrically insulated from each other. The device is configured for flowing through the inner, middle and outer channel respectively a first ignitable gas, a monomer precursor and a second ignitable gas towards their respective exit openings. A high voltage electrode is arranged in the inner channel for generating a plasma from the first ignitable gas. The nozzle further comprises a nozzle cap enclosing a mixing volume after the exit openings of the inner, middle and outer channel. The nozzle cap is provided with an exit opening after the mixing volume, which exit opening is smaller than the exit opening of the outer channel.

公开(公告)号：US11998945B2

公开(公告)日：2024-06-04

申请号：US17037073

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Joshua Hooge ,  Michael Carcasi ,  Mark Somervell

IPC: B05C11/10 ,  B05C5/02 ,  B05C13/02 ,  B05D1/00 ,  B05D1/26 ,  G05D7/06 ,  H01L21/67

CPC classification number: B05D1/005 ,  B05C5/0225 ,  B05C11/1013 ,  B05C11/1023 ,  B05C13/02 ,  B05D1/26 ,  G05D7/0641 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67253

Abstract: Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

公开(公告)号：US20240160149A1

公开(公告)日：2024-05-16

申请号：US18353786

申请日：2023-07-17

Applicant: DigiLens Inc.

Inventor： Jonathan David Waldern ,  Alastair John Grant ,  Milan Momcilo Popovich

IPC: G03H1/02 ,  B05D1/00 ,  B05D1/02 ,  B05D5/06 ,  F21V8/00 ,  G02B5/18 ,  G03F7/00

CPC classification number: G03H1/0248 ,  B05D1/005 ,  B05D1/02 ,  B05D5/061 ,  G02B5/1857 ,  G02B6/0065 ,  G03F7/001 ,  G03H2001/0441 ,  G03H2260/12 ,  G03H2260/33

Abstract: Systems and methods for fabricating optical elements in accordance with various embodiments of the invention are illustrated. One embodiment includes a method for fabricating an optical element, the method including providing a first optical substrate, depositing a first layer of a first optical recording material onto the first optical substrate, applying an optical exposure process to the first layer to form a first optical structure, temporarily erasing the first optical structure, depositing a second layer of a second optical recording material, and applying an optical exposure process to the second layer to form a second optical structure, wherein the optical exposure process includes using at least one light beam traversing the first layer.

公开(公告)号：US20240157394A1

公开(公告)日：2024-05-16

申请号：US18460860

申请日：2023-09-05

Applicant: ECOM Medical, Inc.

Inventor： Michael J. Ko ,  Guy Russell Lowery

IPC: B05D1/00 ,  B05B13/02 ,  B05B13/06 ,  B05C5/02 ,  B05C13/02 ,  B05D1/26

CPC classification number: B05D1/002 ,  B05B13/0207 ,  B05B13/0235 ,  B05B13/0645 ,  B05C5/022 ,  B05C5/0241 ,  B05C5/0254 ,  B05C5/027 ,  B05C13/025 ,  B05D1/26 ,  B05D2254/02

Abstract: A method for applying a predetermined pattern of material onto an elongate tubular substrate includes securing a first portion of an elongate tube having a non-circular outer perimeter to an engagement member configured to be rotated by a first motor, such that the elongate tube can be rotated in unison with the engagement member, operating the first motor to rotate the elongate tube, operating a second motor of to change the relative displacement between the elongate tube and a dispensing conduit along a longitudinal axis of the elongate tube, and expelling a conductive adhesive from a fluid dispenser through the dispensing conduit to form a predetermined pattern of the conductive adhesive on a surface of the elongate tube, the predetermined pattern of the conductive adhesive covering at least 180 degrees of the surface along the non-circular outer perimeter over a width of at least two millimeters along the longitudinal axis.

公开(公告)号：US11946131B2

公开(公告)日：2024-04-02

申请号：US15982187

申请日：2018-05-17

Applicant: Universal Display Corporation

Inventor： Gregory McGraw ,  Edwin Van Den Tillaart ,  William E. Quinn ,  Sven Pekelder ,  Matthew King

IPC: C23C14/24 ,  C23C14/12 ,  C23C14/22 ,  H10K50/11 ,  H10K50/15 ,  H10K50/16 ,  H10K50/18 ,  H10K50/81 ,  H10K50/82 ,  B05D1/00 ,  H10K71/16

CPC classification number: C23C14/243 ,  C23C14/12 ,  C23C14/228 ,  H10K50/11 ,  H10K50/15 ,  H10K50/16 ,  H10K50/18 ,  H10K50/81 ,  H10K50/82 ,  B05D1/60 ,  H10K71/16

Abstract: Designs and arrangements for sublimation cells are provided, which enriches an inert carrier gas with organic vapor such that the partial pressure of the organic vapor is highly stable in time. Stability is achieved by controlling the local rates of evaporation along the solid-gas interface through one or more crucibles, thereby reducing the effects of greater headspace and lowering interfacial area as the source depletes. Local evaporation rates also can be controlled using either temperature distribution or convective flow fields.