公开(公告)号：US07781850B2

公开(公告)日：2010-08-24

申请号：US11090911

申请日：2005-03-25

Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: H01L27/14

CPC classification number: B81B3/0086 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053 ,  G02B26/001

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上的电荷积累来修改所述第一层的特征机电响应。

公开(公告)号：US07772024B2

公开(公告)日：2010-08-10

申请号：US10554642

申请日：2004-04-26

Applicant: Robert Van Kampen ,  Charles Gordon Smith ,  Jack Luo ,  Andrew John Weeks

Inventor： Robert Van Kampen ,  Charles Gordon Smith ,  Jack Luo ,  Andrew John Weeks

IPC: H01L21/00

CPC classification number: B81C1/0015 ,  B81C2201/0109 ,  B81C2201/0132 ,  H01H59/0009

Abstract: A method of manufacturing a micromechanical element wherein the method comprises the steps of providing a layer of base material, applying at least one at least partly sacrificial layer of an etchable material, patterning the at least partly sacrificial layer, to define at least a portion of the shape of the element, applying at least one structural layer of a mechanical material, patterning the structural layer to form at least a portion of the element, and removing at least partly the patterned at least partly sacrificial layer to release partly free the element. The mechanical material is selected from the group of conductive materials.

Abstract translation: 一种制造微机械元件的方法，其中所述方法包括以下步骤：提供基材层，施加可蚀刻材料的至少一个至少部分牺牲层，图案化所述至少部分牺牲层，以限定至少部分牺牲层 元件的形状，施加机械材料的至少一个结构层，图案化结构层以形成元件的至少一部分，以及至少部分去除图案化的至少部分牺牲层以释放部分地释放元件。 机械材料选自导电材料组。

公开(公告)号：US20100193781A1

公开(公告)日：2010-08-05

申请号：US12514304

申请日：2007-11-09

Applicant: Sudhiranjan Tripathy ,  Vicknesh s/o Sahmuganathan

Inventor： Sudhiranjan Tripathy ,  Vicknesh s/o Sahmuganathan

IPC: H01L29/22 ,  H01L29/20 ,  H01L29/16 ,  H01L21/203

CPC classification number: B81C1/00484 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/017

Abstract: A micromechanical structure and a method of fabricating a micromechanical structure are provided. The micromechanical structure comprises a silicon (Si) based substrate; a micromechanical element formed directly on the substrate; and an undercut formed underneath a released portion of the micromechanical element; wherein the undercut is in the form of a recess formed in the Si based substrate.

Abstract translation: 提供微机械结构和制造微机械结构的方法。 微机械结构包括基于硅（Si）的衬底; 直接形成在基板上的微机械元件; 以及形成在微机械元件的释放部分下方的底切; 其中所述底切为形成在所述Si基衬底中的凹部的形式。

公开(公告)号：US07759609B2

公开(公告)日：2010-07-20

申请号：US10547798

申请日：2004-03-04

Applicant: Micha Asscher ,  Gabriel Kerner

Inventor： Micha Asscher ,  Gabriel Kerner

IPC: G03F7/00 ,  B82B3/00

CPC classification number: G03F7/2051 ,  B23K2103/14 ,  B41M5/24 ,  B81C1/00031 ,  B81C2201/0109 ,  B81C2201/0143 ,  B81C2201/0159 ,  H01L21/0272 ,  H01L21/32131 ,  H01L21/76838 ,  H05K3/027 ,  H05K3/048

Abstract: A method for forming a micro- or nano-pattern of a material on a substrate is presented. The method utilizes a buffer layer assisted laser patterning (BLALP). A layered structure is formed on the substrate, this layered structure being in the form of spaced-apart regions of the substrate defined by the pattern to be formed, each region including a weakly physisorbed buffer layer and a layer of the material to be patterned on top of the buffer layer. A thermal process is then applied to the layered structure to remove the remaining buffer layer in said regions, and thus form a stable pattern of said material on the substrate resulting from the buffer layer assisted laser patterning. The method may utilize either positive or negative lithography. The patterning may be implemented using irradiation with a single uniform laser pulse via a standard mask used for optical lithography.

Abstract translation: 提出了在衬底上形成材料的微观或纳米图案的方法。 该方法利用缓冲层辅助激光图案化（BLALP）。 在基板上形成层状结构，该分层结构是由要形成的图案限定的基板的间隔开的区域的形式，每个区域包括弱物理缓冲层和待图案化的材料层 缓冲层顶部。 然后将热处理施加到层状结构以去除所述区域中的剩余缓冲层，从而由缓冲层辅助激光图案化形成在衬底上的所述材料的稳定图案。 该方法可以利用正光刻或负光刻。 可以通过使用用于光学光刻的标准掩模的单个均匀激光脉冲的照射来实现图案化。

公开(公告)号：US20090250430A1

公开(公告)日：2009-10-08

申请号：US11278137

申请日：2006-03-30

Applicant: Gang Zhang

Inventor： Gang Zhang

IPC: B32B38/10 ,  C23F1/02

CPC classification number: B32B38/10 ,  B81C1/00119 ,  B81C2201/0109 ,  B81C2201/0197 ,  C23C28/322 ,  C23C28/325 ,  C23C28/345 ,  C25D1/003 ,  C25D5/022

Abstract: A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed. In another embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) attaching a layer of a material to a substrate or a previously formed layer; 2) machining the attached layer to form a layer that comprises at least two materials; and 3) repeating the operations of 1) and 2) a plurality of times to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure to form a desired three-dimensional structure.

Abstract translation: 提供了一种用于制造三维结构的多层制造方法。 在一个实施例中，多层三维结构的形成包括：1）制造多层，每层包含至少两种材料; 2）对齐层; 3）将层连接在一起以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分。 还公开了制备所需层的制造方法。 在另一个实施方案中，多层三维结构的形成包括：1）将材料层附着到基底或预先形成的层上; 2）加工附着层以形成包含至少两种材料的层; 和3）重复操作1）和2）多次以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分以形成所需的三维结构。

公开(公告)号：US07541280B2

公开(公告)日：2009-06-02

申请号：US10917362

申请日：2004-08-13

Applicant: Ching-Heng Po ,  Shen-Ping Wang ,  Chia-Chiang Chen

Inventor： Ching-Heng Po ,  Shen-Ping Wang ,  Chia-Chiang Chen

IPC: H01L21/4763 ,  H01L21/44

CPC classification number: B81C1/0038 ,  B81C2201/0109

Abstract: A method of forming a micromechanical structure, wherein at least one micromechanical structural layer is provided above a substrate. The micromechanical structural layer is sustained between a lower sacrificial silicon layer and an upper sacrificial silicon layer, wherein a metal silicide layer is formed between the lower and upper sacrificial silicon layers to increase interface adhesion therebetween. The upper sacrificial silicon layer, the metal silicide layer and the lower sacrificial silicon layer are then removed to release the micromechanical structural layer.

Abstract translation: 一种形成微机械结构的方法，其中至少一个微机械结构层设置在基板上。 微机械结构层维持在下牺牲硅层和上牺牲硅层之间，其中在下牺牲硅层和上牺牲硅层之间形成金属硅化物层以增加它们之间的界面粘合。 然后去除上牺牲硅层，金属硅化物层和下牺牲硅层以释放微机械结构层。

公开(公告)号：US07422928B2

公开(公告)日：2008-09-09

申请号：US10572554

申请日：2004-09-12

Applicant: Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

Inventor： Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

IPC: H01L21/00 ,  H02N1/00

CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

Abstract: A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

Abstract translation: 一种用于制造由固定地支撑在下基板上的固定部件和可移动地支撑在下基板上的可移动部件的微机电系统（MEMS）的制造方法。 该方法利用与下基板分开的上基板。 在其顶层中选择性地蚀刻上基板，以在其中形成多个从上基板的底层共同突出的柱。 支柱包括要固定到下基板的固定部件和仅弹性地支撑到一个或多个固定部件以相对于固定部件可移动的可动部件。 下基板在其顶表面上形成有至少一个凹部。 然后将上基板以这样的方式上下连接到下基板的顶部，以将固定部件直接放置在下基板上并将可移动部件放置在凹部的上方。 最后，去除上基板的底层以从底层释放可移动部件，用于使可移动部件浮动在凹部上方并允许​​它们相对于下基板移动，同时保持固定部件固定在 下基板。

公开(公告)号：US20080026328A1

公开(公告)日：2008-01-31

申请号：US11830750

申请日：2007-07-30

Applicant: Mark Miles

Inventor： Mark Miles

IPC: G03C5/00

CPC classification number: G02B26/001 ,  B81B2201/042 ,  B81B2203/0315 ,  B81C1/00396 ,  B81C2201/0109 ,  B81C2203/0136

Abstract: The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.

Abstract translation: 本发明提供了可用于制造MEMS装置的微细加工方法。 该方法包括在基底层上沉积一层或一叠层，所述层中的所述一层或最上层为牺牲层; 图案化所述一层或一叠层以提供穿过其中的所述基层暴露的至少一个孔; 在所述一层或一叠层上沉积感光层; 并使光通过所述至少一个孔以暴露所述感光层。

公开(公告)号：US20070284682A1

公开(公告)日：2007-12-13

申请号：US11723514

申请日：2007-03-20

Applicant: Richard Laming ,  Mark Begbie ,  Anthony Traynor

Inventor： Richard Laming ,  Mark Begbie ,  Anthony Traynor

IPC: H01L29/84 ,  H01L21/00 ,  H01L21/31

CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11, and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1, for example a silicon wafer. A back-volume 33 is provided below the membrane 11, and is formed using a “back-etch” through the substrate 1. A first cavity 9 is located directly below the membrane 11, and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes 15 connect the first cavity 9 and the second cavity 17. Acoustic holes 31 are arranged in the back-plate 14 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 17. The first and second cavities 9 and 17 in association with the back-volume 33 allow the membrane 11 to move in response to the sound waves entering via the acoustic holes 31 in the back-plate 14. The provision of first and second sacrificial layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes 15 aid with the removal of the first and second sacrificial layers. The bleed holes 15 also contribute to the operating characteristics of the microphone.

Abstract translation: MEMS器件，例如电容麦克风，包括响应于由声波产生的压力差而自由移动的柔性膜11。 第一电极13机械耦合到柔性膜11，并且一起形成电容式麦克风装置的第一电容板。 第二电极23机械地耦合到大致刚性的结构层或背板14，它们一起形成电容式麦克风装置的第二电容板。 电容麦克风形成在基板1上，例如硅晶片。 背部体积33设置在膜11下方，并且通过基底1的“背蚀刻”形成。第一腔9位于膜11的正下方，并且在制造期间使用第一牺牲层形成 处理。 介于第一和第二电极13和23之间的是第二腔17，其在制造过程中使用第二牺牲层形成。 多个排放孔15连接第一腔9和第二腔17.声孔31布置在背板14中，以便允许空气分子的自由运动，使得声波可以进入第二腔17。 与背容积33相关联的第一和第二空腔9和17允许膜11响应于通过背板14中的声孔31进入的声波而移动。提供第一和第二牺牲层具有 在制造过程中保护膜的优点，以及使背蚀刻工艺与膜的定义分离。 排出孔15有助于去除第一和第二牺牲层。 排放孔15也有助于麦克风的操作特性。

公开(公告)号：US20070279753A1

公开(公告)日：2007-12-06

申请号：US11445529

申请日：2006-06-01

Applicant: Ming-Hau Tung ,  Wonsuk Chung

Inventor： Ming-Hau Tung ,  Wonsuk Chung

IPC: G02B27/14

CPC classification number: G02B26/001 ,  B81B2201/047 ,  B81C1/00666 ,  B81C2201/0109

Abstract: A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.

Abstract translation: 制造MEMS器件的方法包括在柱的边缘处形成具有水平翼部的支撑柱。 机械层沉积在支撑柱上，并且除了水平翼部分之外的覆盖支撑柱的部分的机械层的部分被蚀刻掉。 所得到的MEMS器件包括覆盖下面的支撑结构的水平翼部分的至少一部分的机械层。