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    METHOD OF IMPROVING THIN-FILM ENCAPSULATION FOR AN ELECTROMECHANICAL SYSTEMS ASSEMBLY
    34.
    发明申请
    METHOD OF IMPROVING THIN-FILM ENCAPSULATION FOR AN ELECTROMECHANICAL SYSTEMS ASSEMBLY 审中-公开
    改进电磁系统组装薄膜封装的方法

    公开(公告)号：US20130106875A1

    公开(公告)日：2013-05-02

    申请号：US13287801

    申请日：2011-11-02

    Applicant: Rihui HE ,  Ana Rangelova LONDERGAN ,  Evgeni Petrovich GOUSEV

    Inventor： Rihui HE ,  Ana Rangelova LONDERGAN ,  Evgeni Petrovich GOUSEV

    IPC: G06F13/14 ,  G02B26/00 ,  H05K3/00

    CPC classification number: B81C1/00333 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2203/0145

    Abstract: This disclosure provides systems, methods, and apparatus for fabricating electromechanical systems devices. In one aspect, a method of sealing an electromechanical systems device includes etching a sacrificial layer. The sacrificial layer is formed between a surface of a substrate and a shell layer and is etched through etch holes in the shell layer formed over the electromechanical systems device. The etch holes in the shell layer have a diameter greater than about one micron. The shell layer is then treated. A seal layer is deposited on the treated shell layer. The seal layer hermetically seals the electromechanical systems device.

    Abstract translation: 本公开提供了用于制造机电系统装置的系统，方法和装置。 一方面，密封机电系统装置的方法包括蚀刻牺牲层。 牺牲层形成在基底的表面和壳层之间，并通过在机电系统器件上形成的壳层中的蚀刻孔进行蚀刻。 壳层中的蚀刻孔的直径大于约1微米。 然后对壳层进行处理。 密封层沉积在经处理的壳层上。 密封层密封机电系统装置。

    Method for Electrochemical Fabrication
    35.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号：US20100264037A1

    公开(公告)日：2010-10-21

    申请号：US12789704

    申请日：2010-05-28

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Tear-resistant thin film methods of fabrication
    36.
    发明授权
    Tear-resistant thin film methods of fabrication 有权
    抗撕裂薄膜制造方法

    公开(公告)号：US07763342B2

    公开(公告)日：2010-07-27

    申请号：US11396234

    申请日：2006-03-31

    Applicant: A. David Johnson

    Inventor： A. David Johnson

    IPC: B32B3/26

    CPC classification number: B81B3/0072 ,  A61F2/2403 ,  A61F2/82 ,  A61F2210/0014 ,  B81C2201/0181 ,  B81C2201/038 ,  Y10T428/24479

    Abstract: A thin film device and fabrication method providing optimum tear resistance. A thin film layer is formed with a first and second of rows of holes. The holes in each row are spaced-apart along an axis which extends along an edge of the layer. The holes in one row are in overlapping relationship with adjacent holes in the other row. The holes have a diameter which is sufficiently large so that an imaginary line extending perpendicular from any location along the edge will intersect at least one hole, thus preventing further propagation of any tears or cracks which start from the edge.

    Abstract translation: 薄膜器件和提供最佳抗撕裂性的制造方法。 薄膜层形成有第一排和第二排孔。 沿着沿着该层的边缘延伸的轴线，每行中的孔间隔开。 一排中的孔与另一排中的相邻孔重叠。 这些孔具有足够大的直径，使得从沿着边缘的任何位置垂直延伸的假想线将与至少一个孔相交，从而防止从边缘开始的任何撕裂或裂纹的进一步传播。

    Method for electrochemical fabrication
    37.
    发明授权
    Method for electrochemical fabrication 失效
    电化学制造方法

    公开(公告)号：US07618525B2

    公开(公告)日：2009-11-17

    申请号：US11927287

    申请日：2007-10-29

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures
    38.
    发明申请
    Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开
    具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置

    公开(公告)号：US20090038948A1

    公开(公告)日：2009-02-12

    申请号：US12191258

    申请日：2008-08-13

    Applicant: Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Jeffrey A. Thompson ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D5/02

    CPC classification number: C25D1/003 ,  B81C1/00373 ,  B81C2201/0181 ,  B81C2201/019

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

    PACKAGING MICRO DEVICES
    40.
    发明申请
    PACKAGING MICRO DEVICES 审中-公开
    包装微型器件

    公开(公告)号：US20080116554A1

    公开(公告)日：2008-05-22

    申请号：US11562403

    申请日：2006-11-21

    Applicant: Shaoher X. Pan

    Inventor： Shaoher X. Pan

    IPC: H01L23/02 ,  H01L21/02

    CPC classification number: B81B3/0005 ,  B81C1/00992 ,  B81C2201/0181 ,  B81C2201/112

    Abstract: A method for applying anti-stiction material to a micro device includes encapsulating a micro device in a chamber, vaporizing anti-stiction material in a container to form vaporized anti-stiction material, transferring the vaporized anti-stiction material from the container to the chamber, and depositing the vaporized anti-stiction material on a surface of the micro device.

    Abstract translation: 将抗静电材料施加到微型装置的方法包括将微型装置封装在室中，将容器内的抗静电材料蒸发以形成蒸发的抗静电材料，将蒸发的抗静电材料从容器转移到室 ，并将蒸发的抗静电材料沉积在微型装置的表面上。

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