公开(公告)号：US09277654B2

公开(公告)日：2016-03-01

申请号：US13318369

申请日：2010-05-27

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H05K1/16 ,  H05K1/11 ,  H05K7/10 ,  H05K7/12 ,  H05K3/32 ,  H01L23/498 ,  H01R12/52

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R12/52 ,  H05K2201/0133 ,  H05K2201/0311 ,  Y10T29/49224 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.

Abstract translation: 一组复合聚合物 - 金属接触构件，适于与第一电路构件形成无焊料电连接。 接触构件包括弹性聚合物基底层和印刷在基底层的选定部分上的金属化迹线阵列。 将导电电镀施加到金属化层以形成导电路径阵列。 弹性聚合物基层，金属化层和导电镀层具有足够的聚集弹簧常数，以使接触构件的远侧部分保持悬臂结构，并且仅在远侧部分和第一电路部件之间形成稳定的电连接 压缩接合。

公开(公告)号：US20160050750A1

公开(公告)日：2016-02-18

申请号：US14818109

申请日：2015-08-04

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. ROGERS ,  Xian HUANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0286 ,  A61B5/686 ,  H05K1/0212 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0386 ,  H05K1/095 ,  H05K1/097 ,  H05K1/144 ,  H05K3/1216 ,  H05K3/207 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K3/4626 ,  H05K2201/0133 ,  H05K2201/0266 ,  H05K2201/041 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0514 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1142 ,  H05K2203/175 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239

Abstract: The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

Abstract translation: 本发明提供瞬时印刷电路板装置，包括在应用至少一个内部和/或外部刺激时电和/或物理变换的有源和无源装置。

公开(公告)号：US20150351221A1

公开(公告)日：2015-12-03

申请号：US14584291

申请日：2014-12-29

Applicant: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sohee KIM ,  Namsun CHOU

IPC: H05K1/02 ,  H05K3/06 ,  H05K1/03

CPC classification number: H05K1/0283 ,  H05K3/38 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09263 ,  H05K2203/1105

Abstract: An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over the substrate; and a conductive wire connecting the first and second pads. One or more regions of the conductive wire may be bent in a vertical or horizontal direction with respect to the substrate.

Abstract translation: 基于弹性体并具有弹性和柔性的电极装置可以包括：弹性体基底; 布置在基板上的第一和第二焊盘; 以及连接第一和第二焊盘的导线。 导线的一个或多个区域可以相对于衬底在垂直或水平方向上弯曲。

公开(公告)号：US20150351217A1

公开(公告)日：2015-12-03

申请号：US14646340

申请日：2013-11-20

Applicant: KANEKA CORPORATION

Inventor： Aki KOUKAMI ,  Kazuo HAGIWARA ,  Keisuke OGUMA

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0204 ,  H01L23/3121 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20463 ,  H05K9/0024 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C).

Abstract translation: 一种散热结构，包括：（A）印刷电路板; （B）发热元件; （C）电磁屏蔽壳; （D）拉伸弹性模量为50MPa以下，热导率为0.5W / m·K以上的橡胶状导热性树脂层; 和（E）导热率低于0.5W / mK的热不导电层，发热元件（B）放置在印刷电路板（A），发热元件（B）和 所述导热性树脂层（D）彼此接触，所述热不导电层（E）设置在所述发热元件（B）和所述电磁屏蔽壳体（C）之间。

公开(公告)号：US09204544B2

公开(公告)日：2015-12-01

申请号：US14202220

申请日：2014-03-10

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Michio Horiuchi ,  Ryo Fukasawa ,  Yuichi Matsuda ,  Yasue Tokutake

IPC: H05K1/11 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40

CPC classification number: H05K1/112 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0133 ,  H05K2201/10378 ,  H05K2203/0315

Abstract: A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers.

Abstract translation: 布线基板包括：绝缘基板，其中设置有多个贯穿导体，穿透导体沿着绝缘基板的厚度方向贯穿;布置在绝缘基板的一个面上的第一连接焊盘，布置成 对应于绝缘基板的另一面上的第一连接焊盘，布置成围绕第一连接焊盘的第一金属层，布置成对应于第一金属层的第二金属层，围绕第二连接焊盘的第二金属层， 连接第一连接焊盘和第二连接焊盘并连接第一金属层和第二金属层的多个穿透导体以及形成在第一和第二连接焊盘之间的绝缘基板的一部分中的弹性体， 和第二金属层。

公开(公告)号：US09177821B2

公开(公告)日：2015-11-03

申请号：US14259042

申请日：2014-04-22

Applicant: Electronics and Telecommunications Research Institute

Inventor： Soon-Won Jung ,  Jae Bon Koo ,  Chan Woo Park ,  Bock Soon Na ,  Sang Chul Lim ,  Sang Seok Lee ,  Kyoung Ik Cho ,  Hye Yong Chu

IPC: H01L21/338 ,  H01L21/311 ,  H01L29/66

CPC classification number: H01L21/311 ,  G09F9/301 ,  H01L29/66477 ,  H01L51/0023 ,  H01L51/0055 ,  H01L51/0525 ,  H01L51/102 ,  H05K1/0283 ,  H05K1/0333 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/308

Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.

Abstract translation: 提供一种制造电子电路的方法。 该方法包括制备基底，在基底上形成聚合物膜，图案化聚合物膜以形成聚合物图案，并在聚合物图案上形成电子器件。

公开(公告)号：US09159658B2

公开(公告)日：2015-10-13

申请号：US14005105

申请日：2012-03-16

Applicant: Reimund Oberschmid

Inventor： Reimund Oberschmid

IPC: H05K1/02 ,  H01L23/498 ,  H01L33/62 ,  H01L33/64 ,  H05K1/11

CPC classification number: H01L23/498 ,  H01L23/49811 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/81385 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/111 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A connection carrier for at least one semiconductor chip is disclosed. The connection carrier has a carrier body having a main surface. A first connection area and a second connection area at a distance from the first connection area are formed on the main surface. The connection carrier has a mechanical decoupling device which is intended to reduce transmission of mechanical forces from the carrier body to at least one region of the first connection area. A semiconductor component having such a connection carrier is also stated.

Abstract translation: 公开了一种用于至少一个半导体芯片的连接载体。 连接托架具有主体，主体具有主表面。 在主表面上形成有距离第一连接区域一定距离的第一连接区域和第二连接区域。 连接载体具有机械解耦装置，其旨在减少机械力从载体主体到第一连接区域的至少一个区域的传递。 还描述了具有这种连接载体的半导体部件。

公开(公告)号：US20150240132A1

公开(公告)日：2015-08-27

申请号：US14189302

申请日：2014-02-25

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  C09J163/00 ,  H05K3/30 ,  C09K5/14 ,  B32B37/12 ,  B32B37/18

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Abstract translation: 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：US20150181698A1

公开(公告)日：2015-06-25

申请号：US14579108

申请日：2014-12-22

Applicant: NIKON CORPORATION

Inventor： Ryoichi SUGANUMA ,  Hirofumi ARIMA ,  Satoru SUZUKI ,  Takuya SATO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05 ,  H05K1/03 ,  H01L27/146 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

Abstract translation: 基板包括：第一绝缘层; 具有与第一绝缘层的弹性模量不同的弹性模量的第二绝缘层; 以及由第一绝缘层和第二绝缘层夹持的芯层，并且比第一绝缘层和第二绝缘层更刚性。

公开(公告)号：US09062172B2

公开(公告)日：2015-06-23

申请号：US12967344

申请日：2010-12-14

Applicant: Shigeo Nakamura

Inventor： Shigeo Nakamura

IPC: H05K1/03 ,  C08J5/24 ,  B32B7/12 ,  C08G59/24 ,  C08L63/00 ,  H05K3/46

CPC classification number: C08J5/24 ,  B32B7/12 ,  B32B2559/00 ,  B32B2605/08 ,  C08G59/245 ,  C08G59/4215 ,  C08G59/4276 ,  C08J2363/00 ,  C08J2379/04 ,  C08L63/00 ,  H05K1/0373 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/287 ,  C08L79/04 ,  C08L67/00

Abstract: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.

Abstract translation: 公开了一种树脂组合物，其具有绝缘层表面粗糙度并且能够在湿粗粗化步骤中形成具有足够剥离强度的电镀导体层，并且其介电特性和热膨胀系数优异。 树脂组合物含有氰酸酯树脂和特定的环氧树脂。