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公开(公告)号：US09799421B2
公开(公告)日：2017-10-24
申请号：US14288567
申请日：2014-05-28
Inventor： Virginia C. Garcia , Matthew Sgriccia , Mark Challingsworth
CPC classification number: H01B1/16 , H05K1/092 , H05K3/1291 , H05K3/246 , H05K2201/0338 , H05K2203/1126 , H05K2203/1476
Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.
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公开(公告)号：US09775249B2
公开(公告)日：2017-09-26
申请号：US15240155
申请日：2016-08-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K3/007 , H05K1/0281 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/025 , H05K3/064 , H05K3/188 , H05K3/429 , H05K2201/0338 , H05K2201/0352 , H05K2201/09563 , H05K2203/0152
Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
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公开(公告)号：US20170188456A1
公开(公告)日：2017-06-29
申请号：US15133352
申请日：2016-04-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngjin CHO , Hyeon Cheol PARK , Kwanghee KIM , Weonho SHIN , Daejin YANG
CPC classification number: H05K1/09 , G06F3/041 , G06F3/047 , G06F2203/04102 , H01B1/02 , H01B1/023 , H01B1/026 , H01B1/16 , H01L51/5206 , H01L51/5234 , H01L2251/301 , H01L2251/5338 , H05K1/0274 , H05K2201/0108 , H05K2201/0323 , H05K2201/0338 , H05K2201/0373 , H05K2201/0379 , H05K2201/0391 , H05K2201/09681 , H05K2201/10128
Abstract: A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.
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公开(公告)号：US09668340B1
公开(公告)日：2017-05-30
申请号：US15139122
申请日：2016-04-26
Inventor： Jack Ajoian , Lea-Teng Lee
CPC classification number: H05K1/0298 , H05K1/09 , H05K3/243 , H05K3/4007 , H05K2201/0338 , H05K2201/0376
Abstract: A build-up process for fabricating a multi-layer PCB is provided that prevents, or at least reduces the lengths of, overhangs in the finishing metal layer that is plated onto the electrical contact metal layer. The metal seed layer is etched away prior to plating the finishing metal layer onto the electrical contact metal layer. The electrical contact metal layer is covered with a layer of dielectric material, which is then patterned to selectively expose preselected areas of the electrical contact metal layer. The exposed preselected areas of the electrical contact metal layer are then plated with the finishing layer of metal. The result is that overhangs are eliminated or at least greatly reduced in length. In addition, the dielectric material layer serves a function similar to that of a solder mask and obviates the need to apply the oxide to serve as a solder mask.
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35.发明申请公开(公告)号：US20170145567A1
公开(公告)日：2017-05-25
申请号：US15423324
申请日：2017-02-02
Applicant: UYEMURA INTERNATIONAL CORPORATION
Inventor： JON E. BENGSTON
CPC classification number: C23C18/44 , C23C18/1637 , C23C18/1651 , C23C18/54 , H05K1/09 , H05K1/118 , H05K3/187 , H05K3/244 , H05K2201/0338
Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
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Patent Agency Ranking
36.发明授权公开(公告)号：US09650719B1
公开(公告)日：2017-05-16
申请号：US15423324
申请日：2017-02-02
Applicant: UYEMURA INTERNATIONAL CORPORATION
Inventor： Jon E. Bengston
CPC classification number: C23C18/44 , C23C18/1637 , C23C18/1651 , C23C18/54 , H05K1/09 , H05K1/118 , H05K3/187 , H05K3/244 , H05K2201/0338
Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
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公开(公告)号：US09648749B1
公开(公告)日：2017-05-09
申请号：US14943299
申请日：2015-11-17
Applicant: Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
Inventor： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC classification number: H05K1/181 , H05K1/0203 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K3/303 , H05K3/46 , H05K2201/0338 , H05K2201/068 , H05K2201/09063 , H05K2201/09663 , H05K2201/09672 , H05K2201/09763
Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.
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38.发明授权公开(公告)号：US09648738B2
公开(公告)日：2017-05-09
申请号：US15235363
申请日：2016-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doh Won Jung , Yoon Chul Son , Woojin Lee , Jongmin Lee
CPC classification number: H05K1/09 , H05K1/028 , H05K1/0393 , H05K3/22 , H05K3/24 , H05K2201/0326 , H05K2201/0338 , H05K2203/0108 , H05K2203/0257 , H05K2203/1105
Abstract: An electrical conductor includes a first conductive layer including a plurality of metal oxide nanosheets, wherein a metal oxide nanosheet of the plurality of metal oxide nanosheets includes a proton bonded to a the surface of the metal oxide nanosheet, wherein the metal oxide is represented by Chemical Formula 1: MO2 Chemical Formula 1 wherein M is Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, or Mn, wherein the plurality of metal oxide nanosheets has a content of hydrogen atoms of less than about 100 atomic percent, with respect to 100 atomic percent of metal atoms as measured by Rutherford backscattering spectrometry, and wherein the plurality of metal oxide nanosheets includes an electrical connection between contacting metal oxide nanosheets.
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公开(公告)号：US09634412B2
公开(公告)日：2017-04-25
申请号：US13183920
申请日：2011-07-15
Applicant: Cyprian Uzoh , Craig Mitchell
Inventor： Cyprian Uzoh , Craig Mitchell
CPC classification number: H01R13/03 , H05K1/09 , H05K3/282 , H05K3/4007 , H05K2201/0338 , H05K2201/09745 , Y10T29/49155
Abstract: Electrical contacts comprising a surface with a plurality of cavities therein and their methods of manufacture and use.
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公开(公告)号：US20170098621A1
公开(公告)日：2017-04-06
申请号：US15379895
申请日：2016-12-15
Applicant: Tessera, Inc.
Inventor： Cyprian UZOH , Vage OGANESIAN , Ilyas MOHAMMED , Belgacem HABA , Piyush SAVALIA , Craig MITCHELL
CPC classification number: H01L24/05 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/056 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01074 , H01L2924/013 , H05K1/09 , H05K3/4007 , H05K2201/032 , H05K2201/0326 , H05K2201/0338
Abstract: An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent varies throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.
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