公开(公告)号：US20180228027A1

公开(公告)日：2018-08-09

申请号：US15886276

申请日：2018-02-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Suguru UCHIYAMA

IPC: H05K1/14 ,  H01L23/50 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01L23/50 ,  H05K1/0203 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/042

Abstract: A first mounting substrate and a second mounting substrate connected to the electro-optical panel have all the same configurations including mounting positions of a first drive IC and a second drive IC for the first flexible wiring substrate and the second flexible wiring substrate. A total sum of thicknesses of the first flexible wiring substrate, the second flexible wiring substrate, the first drive IC, and the second drive IC is equal to or less than a thickness of an electro-optical panel. A first heat dissipating plate portion and a second heat dissipation plate portion are provided on both sides of a part where the first drive IC and the second drive IC are mounted, in a thickness direction.

公开(公告)号：US20180184537A1

公开(公告)日：2018-06-28

申请号：US15469798

申请日：2017-03-27

Applicant: Shannon Systems Ltd.

Inventor： Xinglong WANG ,  Jia HE ,  Xiaoyan CHEN

IPC: H05K7/02 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K7/026 ,  G06F1/20 ,  G11C5/02 ,  H01L23/367 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/20409 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.

公开(公告)号：US20180173042A1

公开(公告)日：2018-06-21

申请号：US15629660

申请日：2017-06-21

Applicant: Samsung Display Co., Ltd.

Inventor： Minseok KIM ,  Jonghwan KIM ,  Youngmin CHO

IPC: G02F1/1345 ,  G02F1/1368 ,  H01L51/00 ,  H01L27/32 ,  H01L23/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18

CPC classification number: G02F1/13452 ,  G02F1/1368 ,  H01L24/16 ,  H01L24/27 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L27/3276 ,  H01L51/0096 ,  H01L2224/14131 ,  H01L2224/16155 ,  H01L2224/27312 ,  H01L2224/29499 ,  H01L2224/30505 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/9211 ,  H05K1/147 ,  H05K1/181 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10136 ,  Y02E10/549

Abstract: A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

公开(公告)号：US09994153B2

公开(公告)日：2018-06-12

申请号：US15520371

申请日：2015-10-20

Applicant: Connaught Electronics Ltd.

Inventor： Martin Oliver Coleman

IPC: B60R1/00 ,  H01R13/66 ,  H04N5/225 ,  H01R13/658 ,  H05K1/02 ,  H05K1/14

CPC classification number: B60R1/00 ,  H01R13/658 ,  H01R13/66 ,  H01R13/6625 ,  H01R2201/26 ,  H04N5/225 ,  H04N5/2257 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/10121

Abstract: The invention relates to a camera (2) for a motor vehicle (1), which includes a printed circuit board (16), on which a current connector (29) and a communication bus connector (30) and a video interface connector (31) each for connecting to the motor vehicle (1) are disposed, wherein the video interface connector (31) is connected to a capacitor (25) and a parallel-to-serial converter (26), wherein the video interface connector (31) and/or the capacitor (25) and/or the parallel-to-serial converter (26) are surrounded by a device (32) shielding electromagnetic radiation.

公开(公告)号：US20180153040A1

公开(公告)日：2018-05-31

申请号：US15818204

申请日：2017-11-20

Applicant: FUJITSU LIMITED

Inventor： Akihiro WAKABAYASHI

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A joining part disposed between a first board and a second board and joined to the first board and the second board, the joining part being insertion-mounted by inserting at least one of one end and a remaining end thereof into a through hole formed in at least one of the first board and the second board, the joining part includes a body portion disposed between the first board and the second board and having a width larger than a width of the through hole, and an insertion portion having a width smaller than the width of the through hole and inserted into the through hole, wherein, in a step formed by the body portion and the insertion portion, a notch opened to a side surface of the body portion is formed in a step surface that crosses the side surface of the body portion.

公开(公告)号：US20180145435A1

公开(公告)日：2018-05-24

申请号：US15816724

申请日：2017-11-17

Applicant: Raytheon Company

Inventor： Carlos Peralta ,  Kevin M. Nakano ,  Christal J. Sumner ,  John P. Norbutas

IPC: H01R12/79 ,  H01R12/71 ,  H05K1/14

CPC classification number: H01R12/79 ,  H01R12/716 ,  H01R12/73 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.

公开(公告)号：US09917383B1

公开(公告)日：2018-03-13

申请号：US15494398

申请日：2017-04-21

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jui Lin Chen

IPC: H01R12/00 ,  H01R12/70 ,  G06F1/18 ,  H05K7/20 ,  H01R12/67 ,  H05K3/00 ,  C25D17/08 ,  B23K101/42

CPC classification number: H01R12/7005 ,  B23K2101/42 ,  C25D17/08 ,  G06F1/183 ,  H01R12/675 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/368 ,  H05K5/0282 ,  H05K7/20436 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2036

Abstract: Examples herein relate to printed circuit assemblies (PCA's). In one example, a PCA comprises a printed circuit board (PCB) having an elongated cut-out, the cut-out defining a first and a second opposite elongated edges on the PCB, a movable bracket having a standoff established on a surface of the movable bracket, the movable bracket connecting to the first and the second opposite elongated edges and a platform connector established on the PCB.

公开(公告)号：US09913387B1

公开(公告)日：2018-03-06

申请号：US15418836

申请日：2017-01-30

Applicant: Honeywell International Inc.

Inventor： Balaji Prasad Muttam ,  Jaison Cherian ,  Ajit Deshpande

IPC: H05K1/14 ,  H05K5/00 ,  H01R4/02 ,  H01R12/71 ,  H01R43/20 ,  H05K1/11 ,  H05K7/14 ,  H05K3/40

CPC classification number: H05K3/40 ,  G01D11/245 ,  H01R12/73 ,  H05K1/115 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/042

Abstract: A field device apparatus includes a field device that includes a first PCB (Printed Circuit Board) based on a PCB outline of a PWA (Printed Wiring Assembly) and a second PCB based on the PCB outline. One or more pass-through-hole standoffs can be configured with respect to the first and second PCB's in a configuration, wherein the PCB outline is extended to mount the pass-through-hole standoff to the first PCB and the second PCB. The pass-through-hole standoff can be soldered to the first PCB which is connected to a chassis ground that allows a mounting screw to make contact from a top side of the field device to a field mount housing through the pass-through-hole standoff, thereby effectively providing chassis ground connection through mounting screws to the external world. The pass-through-hole standoff can include a through-hole, but does not contain a thread therein.

公开(公告)号：US09899358B2

公开(公告)日：2018-02-20

申请号：US15163197

申请日：2016-05-24

Applicant: Intel Corporation

Inventor： Alan W. Tate ,  Andrew F. Thompson

IPC: H05K7/00 ,  H01L25/10 ,  H05K1/18 ,  H01L25/00 ,  H05K3/30

CPC classification number: G06F1/185 ,  G11C5/04 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1082 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

公开(公告)号：US09867296B2

公开(公告)日：2018-01-09

申请号：US14753087

申请日：2015-06-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Sun Kim ,  Sung Wuk Ryu ,  Hyun Seok Seo ,  Ji Haeng Lee

IPC: H05K7/10 ,  H05K7/12 ,  H05K3/40 ,  H01L23/498 ,  H01L25/10 ,  H01L25/00 ,  H05K1/14 ,  H01L23/00

CPC classification number: H05K3/4007 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/144 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2203/1383 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.