公开(公告)号：US20170025372A1

公开(公告)日：2017-01-26

申请号：US15284714

申请日：2016-10-04

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: H01L23/00 ,  H01L21/48 ,  H01L27/146 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/75 ,  H01L24/81 ,  H01L27/14636 ,  H01L2224/13111 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/50 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/014 ,  H01L2924/12043 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/068

Abstract: A semiconductor module includes an image pickup device on which a bump is disposed, and a flexible wiring board having a flexible resin as a base and including a wire having a bonding electrode at a distal end portion solder-bonded to the bump, in which the bonding electrode is pressed against the bump by bending/deformation of the wiring board caused by application of heat to a solder bonding temperature.

Abstract translation: 半导体模块包括其上设置有凸块的图像拾取装置和具有柔性树脂作为基底的柔性布线板，并且包括具有焊接到凸块的末端部分处的焊接接合的接合电极的导线，其中， 接合电极通过加热引起的焊接接合温度引起的布线板的弯曲/变形而压在凸块上。

公开(公告)号：US20170020637A1

公开(公告)日：2017-01-26

申请号：US15287641

申请日：2016-10-06

Applicant: Align Technology, Inc.

Inventor： Rami Boltanski

IPC: A61C9/00 ,  H05K5/02 ,  H05K5/04 ,  G02B3/00 ,  A61B5/00 ,  G02B26/10 ,  G02B27/12 ,  G01B11/24 ,  A61B1/00 ,  A61B1/247 ,  H05K1/02 ,  G02B7/00

CPC classification number: A61C9/0053 ,  A61B1/00096 ,  A61B1/00172 ,  A61B1/00186 ,  A61B1/128 ,  A61B1/247 ,  A61B5/0062 ,  A61B5/0068 ,  A61B5/0088 ,  A61B5/4547 ,  A61B2562/0233 ,  G01B11/24 ,  G02B3/0006 ,  G02B7/003 ,  G02B7/008 ,  G02B26/10 ,  G02B27/10 ,  G02B27/123 ,  H05K1/0201 ,  H05K1/181 ,  H05K5/0217 ,  H05K5/04 ,  H05K2201/068 ,  H05K2201/10151

Abstract: An optical system comprises a detector to determine one or more intensities of light impinging on one or more locations of the detector and an optical element to redirect light towards the detector along a detection axis. The detector and optical element are coupled together by three or more substantially flat flexures respectively defining three or more flexure planes parallel to the detection axis. The three or more substantially flat flexures prevent rotational movement of the optical element with respect to the detector with changes in temperature

Abstract translation: 光学系统包括检测器，用于确定入射在检测器的一个或多个位置上的一个或多个光的强度，以及光学元件，用于沿着检测轴将光朝向检测器重定向。 检测器和光学元件通过分别限定平行于检测轴线的三个或更多个挠曲平面的三个或更多个基本平坦的挠曲件联接在一起。 三个或更多个基本上平坦的挠曲件防止光学元件相对于具有温度变化的检测器的旋转运动

公开(公告)号：US20170017152A1

公开(公告)日：2017-01-19

申请号：US15124469

申请日：2015-08-17

Applicant: GOO CHEMICAL CO., LTD.

Inventor： Yoshio SAKAI

IPC: G03F7/031 ,  G03F7/038 ,  H05K1/03 ,  G03F7/26 ,  H05K1/02 ,  G03F7/004 ,  G03F7/20

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.

Abstract translation: 该感光性树脂组合物包含：（A）包含光聚合性单体和光聚合性低聚物中的至少一种的光聚合性化合物， （B）二氧化钛; 和（C）光聚合引发剂。 组分（C）包括（C1）含酰基氧化膦的光聚合引发剂和（C2）含苯基乙醛酸的光聚合引发剂。

公开(公告)号：US20160374198A1

公开(公告)日：2016-12-22

申请号：US15002428

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Heung-Kyu KIM ,  Suk-Hyeon CHO ,  Chil-Woo KWON ,  Yul-Kyo CHUNG ,  Going-Sik KIM

IPC: H05K1/03

CPC classification number: H05K3/4605 ,  H05K1/0271 ,  H05K3/46 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09136

Abstract: A printed circuit board includes a core layer including a glass core, a first resin layer disposed on a first surface of the glass core, and a second resin layer formed on a second surface of the glass core; build-up layers disposed on the first and second surfaces of the core layer; and a conductive pattern formed in multiple layers on the build-up layers, wherein the core layer has asymmetric coefficients of thermal expansion opposing sides thereof with respect to a center of the glass core in a thickness direction.

Abstract translation: 印刷电路板包括芯层，其包括玻璃芯，设置在玻璃芯的第一表面上的第一树脂层和形成在玻璃芯的第二表面上的第二树脂层; 设置在芯层的第一和第二表面上的堆积层; 以及形成在所述积层层上的多层的导电图案，其中所述芯层相对于所述玻璃芯的中心在厚度方向上相对侧面具有不对称的热膨胀系数。

公开(公告)号：US09510441B2

公开(公告)日：2016-11-29

申请号：US14642945

申请日：2015-03-10

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chin-Tang Hsieh ,  Fei-Jain Wu ,  Chia-Jung Tu

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0209 ,  H05K1/0203 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/066 ,  H05K2201/068

Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

Abstract translation: 柔性基板包括电路板，柔性散热结构和粘合剂。 电路基板具有形成在基板顶面的基板和电路层，柔性散热结构具有柔性支撑板和形成在柔性支撑板的表面上的柔性散热金属层。 柔性散热结构的柔性散热金属层通过粘合剂与基板的底面连接。 电路层和柔性散热金属层由相同的材料制成。

公开(公告)号：US09472479B2

公开(公告)日：2016-10-18

申请号：US14608537

申请日：2015-01-29

Applicant: CORNING INCORPORATED

Inventor： Satish Chandra Chaparala ,  Scott Christopher Pollard

IPC: H01L21/00 ,  H01L23/15 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/068 ,  H01L2924/00

Abstract: Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

Abstract translation: 提供了用于将一个或多个半导体芯片与半导体封装中的有机衬底互连的插入件的方法和装置，所述插入器包括：具有第一和第二相对主表面的第一玻璃衬底，所述第一玻璃衬底具有第一热导率 扩展（CTE1）; 具有第一和第二相对主表面的第二玻璃基板，所述第二玻璃基板具有第二热膨胀系数（CTE2）; 以及设置在第一和第二玻璃基板之间并且将第一玻璃基板的第二主表面接合到第二玻璃基板的第一主表面的接口，其中CTE1小于CTE2，第一玻璃基板的第一主表面操作 以接合一个或多个半导体芯片，并且第二玻璃基板的第二主表面操作以接合有机基板。

公开(公告)号：US09462693B2

公开(公告)日：2016-10-04

申请号：US14455204

申请日：2014-08-08

Applicant: FUJITSU LIMITED

Inventor： Keishiro Okamoto ,  Seiki Sakuyama

IPC: H05K1/18 ,  H05K3/34 ,  B23K1/20 ,  H01L23/00 ,  H05K3/30 ,  H01L23/498 ,  H01L23/04 ,  H01L21/50 ,  H05K1/02 ,  H01L23/367 ,  H01L23/40

CPC classification number: H05K1/181 ,  B23K1/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/81007 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92 ,  H01L2224/9221 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/305 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

Abstract: An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that include outside surfaces configured to face diagonally upward with respect to the first surface; a second electronic component provided above the first surface; second members that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.

Abstract translation: 电子设备包括：第一电子部件; 第一构件，其设置在第一电子部件的第一表面上，并且包括被配置为相对于第一表面对角地面对的外表面; 设置在所述第一表面上方的第二电子部件; 第二构件，其对应于第二电子部件的面对第一表面的第二表面上的第一构件，并且包括构造成相对于第二表面对角地向下面并且构造成面向外表面的内表面; 以及设置在第一表面和第二表面之间并且电连接第一电子部件和第二电子部件的焊料。

公开(公告)号：US09460990B1

公开(公告)日：2016-10-04

申请号：US14830955

申请日：2015-08-20

Applicant: SK hynix Inc.

Inventor： Ki Jun Sung

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/3436 ,  H05K3/4015 ,  H05K3/4673 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2203/1316

Abstract: A substrate may include a body having a first surface and a second surface opposite to each other, at least one first wiring pattern disposed on the first surface of the body to include a bonding finger, an upper insulating pattern disposed on the first surface of the body to cover the overall surface of the at least one first wiring pattern except the bonding finger, and a second wiring pattern disposed on the second surface of the body. The substrate may include a lower insulating pattern disposed on the second surface of the body to cover the second wiring pattern, and a first via electrode penetrating the body from the first surface to the second surface and coupling the at least one first wiring pattern to the second wiring pattern. The body may include a first film and the upper and lower insulating patterns may include second films.

Abstract translation: 衬底可以包括具有彼此相对的第一表面和第二表面的主体，设置在主体的第一表面上的至少一个第一布线图案，以包括接合指状物，上绝缘图案设置在第一表面上 主体覆盖除了接合手指之外的至少一个第一布线图案的整个表面，以及布置在主体的第二表面上的第二布线图案。 衬底可以包括布置在主体的第二表面上以覆盖第二布线图案的下绝缘图案，以及从第一表面穿过主体到第二表面的第一通孔电极，并将至少一个第一布线图案耦合到 第二布线图。 主体可以包括第一膜，并且上和下绝缘图案可以包括第二膜。

公开(公告)号：US20160242283A1

公开(公告)日：2016-08-18

申请号：US15029335

申请日：2014-10-29

Applicant: KYOCERA CORPORATION

Inventor： Katsura HAYASHI

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K1/11 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2201/068

Abstract: A wiring board excellent in electrical reliability is provided. A wiring board includes a first resin layer; an inorganic insulating layer disposed on the first resin layer; a second resin layer disposed on the inorganic insulating layer; and a conductive layer disposed on the second resin layer. The inorganic insulating layer has a first region located in a vicinity of the second resin layer and a second region located on a side opposite to a second resin layer side of the first region. A content ratio of second inorganic insulating particles in the first region is lower than a content ratio of second inorganic insulating particles in the second regions.

Abstract translation: 提供了电气可靠性优异的接线板。 布线基板包括第一树脂层; 设置在所述第一树脂层上的无机绝缘层; 设置在无机绝缘层上的第二树脂层; 以及设置在第二树脂层上的导电层。 无机绝缘层具有位于第二树脂层附近的第一区域和位于与第一区域的第二树脂层侧相反一侧的第二区域。 第一区域中的第二无机绝缘粒子的含有率低于第二区域中的第二无机绝缘粒子的含有比例。

公开(公告)号：US09408295B2

公开(公告)日：2016-08-02

申请号：US14701792

申请日：2015-05-01

Applicant: NGK Insulators, Ltd.

Inventor： Shinsuke Yano ,  Makoto Tani ,  Hirokazu Nakanishi

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H01L33/62 ,  H01L33/64 ,  H05K1/05

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过实现低热阻作为整个基板的总热阻而可以显示出高散热能力而不降低基板的绝缘可靠性和高湿度可靠性的发光二极管的基板。