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公开(公告)号：US3383564A
公开(公告)日：1968-05-14
申请号：US50119965
申请日：1965-10-22
Applicant: SANDERS ASSOCIATES INC
Inventor： HAROLD LALMOND , GOODY LEWIS B
CPC classification number: H05K3/4691 , H05K1/118 , H05K3/181 , H05K3/4611 , H05K3/4644 , H05K2201/09109 , H05K2201/09509 , H05K2203/063
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公开(公告)号：US20180103538A1
公开(公告)日：2018-04-12
申请号：US15835569
申请日：2017-12-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. Brodsky , James A. Busby , Zachary T. Dreiss , Michael J. Fisher , David C. Long , William Santiago-Fernandez , Thomas Weiss
CPC classification number: H05K1/0213 , G06F21/87 , H05K1/0275 , H05K1/028 , H05K1/0393 , H05K1/183 , H05K5/0208 , H05K2201/091 , H05K2201/09109 , H05K2201/09263 , H05K2201/0999 , H05K2201/10151
Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).
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公开(公告)号：US09491854B2
公开(公告)日：2016-11-08
申请号：US13865730
申请日：2013-04-18
Applicant: RAYTHEON COMPANY
Inventor： Clifton Quan , Hee Kyung Kim , Fangchou Yang , Kevin C. Rolston , Edward Marsh Jackson
CPC classification number: H05K1/028 , H05K1/024 , H05K1/144 , H05K1/147 , H05K3/361 , H05K3/4069 , H05K3/4614 , H05K3/4635 , H05K2201/055 , H05K2201/058 , H05K2201/09109 , H05K2201/09318 , H05K2201/10378 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.
Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。
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34.发明授权Compact rigid-flexible printed circuit board and method for manufacturing same 有权紧凑型柔性柔性印刷电路板及其制造方法公开(公告)号：US09210811B2
公开(公告)日：2015-12-08
申请号：US14095878
申请日：2013-12-03
Inventor： Biao Li
CPC classification number: H05K1/14 , H05K3/361 , H05K3/4691 , H05K2201/0909 , H05K2201/09109 , H05K2201/09127 , Y10T29/302
Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.
Abstract translation: 紧凑的刚性柔性板包括两个柔性PCB，两个刚性基板，第三轨迹层和第四轨迹层。 第一柔性PCB包括第一按压部分，第一暴露部分和第三按压部分，以及分离的第二暴露部分。 第二柔性PCB包括第四和第五按压部分和第二暴露部分。 第一刚性基板包括第六，第七和第八按压部分。 第二刚性基板包括第九和第十按压部。 第三迹线层，第六，第一，第四和第九按压部分和第四迹线层依次层叠。 第三迹线层，七，第二，第五和第十按压部分和第四迹线层依次层叠。 第三迹线层和第八和第三按压部分依次层叠。
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35.发明申请Flexible Printed Circuit Cables With Service Loops and Overbending Prevention 有权柔性印刷电路电缆与服务循环和过度弯曲预防公开(公告)号：US20150070840A1
公开(公告)日：2015-03-12
申请号：US14224892
申请日：2014-03-25
Applicant: Apple Inc.
Inventor： Benjamin M. Rappoport , Justin R. Wodrich , Santhana Balaji , Shayan Malek
CPC classification number: G06F1/1633 , G06F1/1656 , H05K1/0281 , H05K3/0064 , H05K2201/09109 , H05K2201/2009
Abstract: An electronic device may have a signal cable formed from a flexible printed circuit. A service loop may be formed in the signal cable. The bend may be formed in a desired location on the flexible printed circuit by contraction of an elastic member having ends attached to the flexible printed circuit. The elastic member may be conductive to carry signals and provide shielding. Structures may be attached to the flexible printed circuit to promote bending in a desired location and direction. A crease or other bending promotion feature may be applied to the flexible printed circuit at a desired bend location. Overbending prevention structures such as overmolded elastomeric structures may be applied to the flexible printed circuit at the bend. Integral strain relief features may prevent overbending of the flexible printed circuit upon exiting the elastomeric structures. Overmolded structures may serve as protective bumpers.
Abstract translation: 电子设备可以具有由柔性印刷电路形成的信号电缆。 可以在信号电缆中形成服务环路。 可以通过具有连接到柔性印刷电路的端部的弹性构件的收缩，在柔性印刷电路上的期望位置处形成弯曲部。 弹性构件可以是导电的以携带信号并提供屏蔽。 结构可以附接到柔性印刷电路以促进在期望的位置和方向上的弯曲。 折痕或其他弯曲促进特征可以在期望的弯曲位置应用于柔性印刷电路。 过度弯曲预防结构例如包覆成型的弹性体结构可以在弯曲处施加到柔性印刷电路。 积分应变消除特征可以防止柔性印刷电路在离开弹性体结构时过度弯曲。 包覆成型结构可用作保护性保险杠。
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Patent Agency Ranking
公开(公告)号：US20130319732A1
公开(公告)日：2013-12-05
申请号：US13865730
申请日：2013-04-18
Applicant: RAYTHEON COMPANY
Inventor： Clifton Quan , Hee Kyung Kim , Fangchou Yang , Kevin C. Rolston , Edward Marsh Jackson
IPC: H05K1/02
CPC classification number: H05K1/028 , H05K1/024 , H05K1/144 , H05K1/147 , H05K3/361 , H05K3/4069 , H05K3/4614 , H05K3/4635 , H05K2201/055 , H05K2201/058 , H05K2201/09109 , H05K2201/09318 , H05K2201/10378 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.
Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。
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37.发明申请CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEASURING KIT, SENSOR SUBSTRATE, AND SENSOR SUBSTRATE INTERPOLATED CYLINDER 有权凹槽连接器基板，其制造方法，测量套件，传感器基板和传感器基板插入式气缸公开(公告)号：US20130318786A1
公开(公告)日：2013-12-05
申请号：US13963463
申请日：2013-08-09
Applicant: Hitachi Chemical Company, Ltd.
Inventor： Hidehiro NAKAMURA
IPC: H05K13/00
CPC classification number: H05K13/00 , G01D1/00 , G01D15/00 , H05K1/028 , H05K1/118 , H05K3/3447 , H05K3/365 , H05K3/4602 , H05K3/4635 , H05K2201/09063 , H05K2201/09081 , H05K2201/091 , H05K2201/09109 , H05K2201/09127 , H05K2201/09163 , H05K2201/09318 , H05K2201/0969 , H05K2201/10151 , H05K2201/10189 , H05K2201/10598 , H05K2203/061 , H05K2203/167
Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.
Abstract translation: 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。
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38.发明授权Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board 有权柔性印刷线路板，多层柔性印刷线路板和采用多层柔性印刷线路板的移动电话终端公开(公告)号：US08383230B2
公开(公告)日：2013-02-26
申请号：US11805972
申请日：2007-05-24
Applicant: Kazuhide Kita , Hirokazu Hirai , Shuichi Fujita , Takashi Miwa
Inventor： Kazuhide Kita , Hirokazu Hirai , Shuichi Fujita , Takashi Miwa
CPC classification number: H05K1/028 , H05K1/0373 , H05K3/281 , H05K3/381 , H05K3/386 , H05K3/4611 , H05K3/4635 , H05K3/4691 , H05K2201/0209 , H05K2201/09109 , H05K2203/025 , Y10T428/12549 , Y10T428/12569 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
Abstract: An object of the present invention is to provide a flexible printed wiring board and multilayered flexible printed wiring board in which, in methods of laminating substrates comprising a non-adhering section and an adhering section, adhesion of the FPC substrates of the flexure part can be prevented and adequate flex resistance can be maintained.The present invention provides a flexible printed wiring board comprising at least an electric insulating layer and a conductor layer wherein the surface of the electric insulating layer has a 10-point average roughness of at least 1.5 μm and less than 2.0 μm and contact angle of at least 60° and less than 120°, or has a 10-point average roughness of at least 2.0 μm and less than 4.0 μm, and also provides a multilayered flexible printed wiring board formed by the lamination of two or more of the flexible printed wiring boards in which the surface of the electric insulating layers of the two or more flexible printed wiring boards exposed in a bendable state are opposing in a non-adhered state, and a part of the wiring boards is laminated on each of a first multilayered flexible printed wiring board and a second multilayered flexible printed wiring board.
Abstract translation: 本发明的目的是提供一种柔性印刷布线板和多层柔性印刷布线板，其中在包括非粘合部分和粘合部分的基板的层压方法中，柔性部件的FPC基板的粘附可以是 防止并且可以保持足够的抗弯曲性。 本发明提供一种柔性印刷布线板，其至少包括电绝缘层和导体层，其中电绝缘层的表面具有至少1.5μm且小于2.0μm的10点平均粗糙度和在 至少60°且小于120°，或者具有至少2.0μm且小于4.0μm的10点平均粗糙度，并且还提供通过层压两个或更多个柔性印刷布线而形成的多层柔性印刷布线板 其中以可弯曲状态暴露的两个或多个柔性印刷电路板的电绝缘层的表面在非粘合状态下相对的板，并且一部分布线板层叠在第一多层柔性印刷 接线板和第二多层柔性印刷线路板。
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公开(公告)号：US08345431B2
公开(公告)日：2013-01-01
申请号：US12317754
申请日：2008-12-29
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
IPC: H05K1/00
CPC classification number: H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
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40.发明授权Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device 有权印刷电路板，制造印刷电路板的方法，传感器模块和感测装置公开(公告)号：US08193628B2
公开(公告)日：2012-06-05
申请号：US12557020
申请日：2009-09-10
Applicant: Toshihiko Makino , Atsushi Koyanagi
Inventor： Toshihiko Makino , Atsushi Koyanagi
IPC: H01L23/12
CPC classification number: H05K1/189 , H01L27/14618 , H01L27/14806 , H01L2924/0002 , H05K1/0271 , H05K3/0058 , H05K3/386 , H05K2201/09109 , H05K2201/10121 , H05K2201/10727 , H05K2201/2009 , Y10T156/10 , H01L2924/00
Abstract: A printed wiring board on which a package to be arranged, including: a first layer that is relatively rigid; and a second layer that is relatively flexible and on which the package is to be soldered, wherein an area other than a package arrangement area of the second layer is joined to the first layer by an adhesion layer.
Abstract translation: 一种印刷线路板，其上设置有一个包装件，包括：第一层相对刚性; 以及第二层，其相对柔性并且其上将要焊接所述封装，其中除了所述第二层的封装布置区域之外的区域通过粘合层接合到所述第一层。
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