公开(公告)号：US20090161333A1

公开(公告)日：2009-06-25

申请号：US12002910

申请日：2007-12-19

Applicant: Kevin Yang

Inventor： Kevin Yang

IPC: H05K7/18

CPC classification number: H05K7/02 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: Automatic clinging leads of an electric device are provided for an unassisted mounting on thru-holes of a printed circuit board. Each of the leads of the device has three continuous right-angled sections including a longitudinal proximal end section extending from the terminal region of the electric element, a latitudinal distal end section extending at right angle with respect to the proximal end section, and a bent midsection for connecting the proximal and distal end sections at the diametrically opposite right angle to the angle between the proximal and distal end sections to provide a generally laterally extending lead with three alternating bends between the three sections. The device leads can be inserted into the thru-holes of the circuit board through a 90-degree swivel motion that causes a secure flush cling of the leads and in turn a low profile mounting of the device onto the circuit board around thru-holes.

Abstract translation: 提供电气设备的自动粘贴引线用于在印刷电路板的通孔上的无辅助安装。 设备的每个引线具有三个连续的直角部分，包括从电气元件的端部区域延伸的纵向近端部分，相对于近端部分以直角延伸的纬向远端部分，以及弯曲 用于将近端部分和远端部分以与近端部分和远端部分之间的角度成直角相对的直角连接以提供在三个部分之间具有三个交替弯曲部的大致横向延伸的引线。 器件引线可以通过90度的旋转运动插入到电路板的通孔中，这导致引线的安全冲洗粘附，从而将器件的薄型安装在通孔周围的电路板上。

公开(公告)号：US20090146274A1

公开(公告)日：2009-06-11

申请号：US12259824

申请日：2008-10-28

Applicant: Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

Inventor： Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

IPC: H01L23/495

CPC classification number: H01L23/49555 ,  H01L23/49575 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3426 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y02P70/613 ,  H01L2924/00

Abstract: Integrated circuit packages include an integrated circuit mounting substrate having a hole that defines an inner wall of the integrated circuit mounting substrate. An integrated circuit is provided in the hole. A sinuous lead frame extends from the integrated circuit and is connected to the inner wall. The sinuous lead frame extends back and forth along a given direction, and may include a U- and/or V-shape, and round and/or jagged portions. Related packaging methods are also disclosed.

Abstract translation: 集成电路封装包括具有限定集成电路安装基板的内壁的孔的集成电路安装基板。 在孔中设置集成电路。 引线框架从集成电路延伸并连接到内壁。 弯曲的引线框架沿着给定的方向来回延伸，并且可以包括U形和/或V形，以及圆形和/或锯齿形部分。 还公开了相关的包装方法。

公开(公告)号：US20080308913A1

公开(公告)日：2008-12-18

申请号：US12140190

申请日：2008-06-16

Applicant: Sang-Wook PARK ,  Min-Young SON ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

Inventor： Sang-Wook PARK ,  Min-Young SON ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

IPC: H01L23/495

CPC classification number: H01L23/49555 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove.

Abstract translation: 叠层半导体封装包括第一半导体封装，第二半导体封装和导电连接构件。 第一半导体封装包括第一半导体芯片，具有与第一半导体芯片电连接的第一外部引线的第一引线框架和形成在第一半导体芯片和第一引线框架上以暴露第一外部引线的第一模制构件 。 第二半导体封装包括第二半导体芯片，形成在第一模制构件上的第二引线框架，并且具有可与第二半导体芯片电连接的第二外部引线，以及形成在第二半导体芯片上的第二模制构件和第二半导体芯片 引线框架露出第二个外引线。 导电连接构件可以将第一外引线和第二外引线彼此电连接。 此外，导电连接构件可以具有防裂槽。

公开(公告)号：US20080132096A1

公开(公告)日：2008-06-05

申请号：US11935784

申请日：2007-11-06

Applicant: Hidehisa Yamagami

Inventor： Hidehisa Yamagami

IPC: H01R13/60

CPC classification number: H01R4/024 ,  H01R12/716 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10909

Abstract: A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector; and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

Abstract translation: 电路板安装的连接器配备有绝缘壳体，其保持多排触点并安装在电路板上。 每个触点具有接触部分，用于接触另一连接器; 以及连接到电路板的腿部。 每个腿部具有从绝缘壳体的后壁延伸的延伸部分; 柔性部分，其与所述延伸部分连续形成; 以及从柔性部分沿基本上垂直于电路板的方向延伸并且连接到电路板的孔的直线部分。 在多排触点中，至少最靠近电路板的行具有远离电路板延伸的延伸部分，直到柔性部分。 每个腿部的直线部分是部分镀锡的。

公开(公告)号：US20080102663A1

公开(公告)日：2008-05-01

申请号：US11671707

申请日：2007-02-06

Applicant: Shuhei Sakai

Inventor： Shuhei Sakai

IPC: H01R13/648

CPC classification number: H01R12/7011 ,  H01R12/58 ,  H01R12/712 ,  H01R13/6594 ,  H05K1/0243 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/1446

Abstract: A shield plate arranged between a connector and a circuit board for covering and shielding parts of metal pins sticking out from the circuit board when a connector provided with a board mounting surface having a plurality of metal pins and a connector connection surface is mounted at an end of the circuit board, provided with an connector-engagement part, a shield part of the metal pins, a mounting part having press-fit pins for insertion, and support parts of the press-fit pins and flexible parts at a part between the shield part and the mounting part, the press-fit pins becoming vertical to the circuit board in the state with the engagement part engaged with the connector and the free end parts of the press-fit pins provisionally inserted into the engagement holes, thereby enabling the press-fit pins to be press-fit into the engagement holes all at once by a pushing action of the support parts.

Abstract translation: 一种屏蔽板，其布置在连接器和电路板之间，用于在设置有具有多个金属销和连接器连接表面的板安装表面的连接器安装在端部的情况下覆盖和屏蔽从电路板伸出的金属销的部分 设置有连接器接合部分，金属销的屏蔽部分，具有用于插入的压配销的安装部分，并且在屏蔽件之间的部分处支撑压配合销和柔性部件的部分 部分和安装部分，压配合销在接合部与连接器接合的状态下变得垂直于电路板，并且压配合销的自由端临时插入到接合孔中，从而使得压配合 - 通过支撑部件的推动动作一次压配合到接合孔中。

公开(公告)号：US07341385B2

公开(公告)日：2008-03-11

申请号：US11537645

申请日：2006-09-30

Applicant: Donald A. Ice

Inventor： Donald A. Ice

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4245 ,  G02B6/4278 ,  G02B6/428 ,  H05K1/182 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10757 ,  Y10T29/49117 ,  Y10T29/49131 ,  Y10T29/49133

Abstract: An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract translation: 光学子组件与具有成形引线配置的光电封装件结合使用。 引线配置使得成形引线能够与限定在印刷电路板中的通孔通孔电连接，同时最小化空间要求并为引线提供应力消除。 在一个实施例中，公开了一种光学子组件，其包括包含光电子部件的头部以及可与光电子部件可操作地连通的多个导电引线。 每个引线包括从集管的表面延伸的直线部分，端部被定向成由印刷电路板中限定的通孔通道接收，以及插入在直线部分和端部之间的成形部分，并且具有 在第一平面中限定的至少一个弯曲。 光学子组件还包括具有多个空腔的夹子组件，每个腔体接收相应的一个引线。

公开(公告)号：US07309243B2

公开(公告)日：2007-12-18

申请号：US11129779

申请日：2005-05-16

Applicant: Hidehisa Yamagami

Inventor： Hidehisa Yamagami

IPC: H01R12/00

CPC classification number: H01R4/024 ,  H01R12/716 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10909

Abstract: A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector, and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

Abstract translation: 电路板安装的连接器配备有绝缘壳体，其保持多排触点并安装在电路板上。 每个触点具有用于接触另一个连接器的接触部分和连接到电路板的脚部分。 每个腿部具有从绝缘壳体的后壁延伸的延伸部分; 柔性部分，其与所述延伸部分连续形成; 以及从柔性部分沿基本上垂直于电路板的方向延伸并且连接到电路板的孔的直线部分。 在多排触点中，至少最靠近电路板的行具有远离电路板延伸的延伸部分，直到柔性部分。 每个腿部的直线部分是部分镀锡的。

公开(公告)号：US20070281507A1

公开(公告)日：2007-12-06

申请号：US11810243

申请日：2007-06-05

Applicant: Fang-Jwu Liao ,  Hao-Yun Ma

Inventor： Fang-Jwu Liao ,  Hao-Yun Ma

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: An IC contact (1) for use in an LGA socket includes a retention portion (10), a contact portion (11) extending from the retention portion, a solder terminal portion (12) extending opposite to the contact portion, and a connecting section (13) connected between the retention portion and the solder terminal portion. The connecting section is bent from a sheet of material and configured to have a multi-curved shape. Such a multi-curved connecting section does provide a high contact force for deflection, and is capable of attaining high compliance, thereby having no portion cracked during a reflow solder process.

Abstract translation: 用于LGA插座的IC触点（1）包括保持部分（10），从保持部分延伸的接触部分（11），与接触部分相对延伸的焊接端子部分（12）和连接部分 （13），其连接在所述保持部和所述焊接端子部之间。 连接部分从一片材料弯曲并且被配置为具有多弧形的形状。 这种多弯曲连接部确实提供了高的挠曲接触力，并且能够获得高柔顺性，从而在回流焊接过程中没有部分破裂。

公开(公告)号：US20070228110A1

公开(公告)日：2007-10-04

申请号：US11758479

申请日：2007-06-05

Applicant: Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

IPC: B23K20/00

CPC classification number: H01L24/72 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2224/85 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01048 ,  H01L2224/72 ,  H01L2924/00012

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

公开(公告)号：US20070176619A1

公开(公告)日：2007-08-02

申请号：US11697643

申请日：2007-04-06

Applicant: Igor Khandros ,  Gaetan Mathieu

Inventor： Igor Khandros ,  Gaetan Mathieu

IPC: G01R31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。