公开(公告)号：US20180207652A1

公开(公告)日：2018-07-26

申请号：US15936638

申请日：2018-03-27

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yukihiko INAGAKI

IPC: B05B1/24 ,  H01L21/677 ,  H01L21/67 ,  B05C13/00 ,  B05C13/02

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

公开(公告)号：US10022745B2

公开(公告)日：2018-07-17

申请号：US14445736

申请日：2014-07-29

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： William Gilbert Breingan ,  James K. Anders ,  Herman Itzkowitz

IPC: H01L21/683 ,  B05C11/08 ,  B05C13/00 ,  B05D1/00 ,  H01L21/687 ,  B05C1/08 ,  C23C16/458 ,  C23C14/50

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer.

公开(公告)号：US09987653B2

公开(公告)日：2018-06-05

申请号：US15293884

申请日：2016-10-14

Applicant: Board of Regents, The University of Texas System

Inventor： Sidlgata V. Sreenivasan ,  Shrawan Singhal

IPC: B05C5/02 ,  B05D3/06 ,  B05C11/02 ,  B05C13/00 ,  B41J2/01 ,  B81C1/00

CPC classification number: B05C5/0291 ,  B05C11/028 ,  B05C13/00 ,  B41J2/01 ,  B81C1/0038

Abstract: A method for depositing thin films using a nominally curved substrate. Drops of a pre-cursor liquid organic material are dispensed at a plurality of locations on a nominally curved substrate by one or more inkjets. A superstrate is brought down on the dispensed drops to close the gap between the superstrate and the substrate thereby allowing the drops to form a contiguous film captured between the substrate and the superstrate. A non-equilibrium transient state of the superstrate, the contiguous film and the substrate is enabled to occur after a duration of time. The contiguous film is then cured to solidify it into a solid. The solid is separated from the superstrate thereby leaving a polymer film on the substrate. In this manner, such a technique for film deposition has the film thickness range, resolution and variation required to be applicable for a broad spectrum of applications.

公开(公告)号：US09957092B2

公开(公告)日：2018-05-01

申请号：US14269536

申请日：2014-05-05

Applicant: Preddis LLC

Inventor： Michael Worden ,  Nathaniel Hallee ,  George Stickler

IPC: B65D41/56 ,  B65D51/00 ,  B65D17/52 ,  B65D43/26 ,  B65D41/04 ,  B65D83/40 ,  B65D51/24 ,  B65D43/02 ,  B05C13/00 ,  B05B13/02 ,  B29D99/00

CPC classification number: B65D51/24 ,  B05B13/0285 ,  B05C13/00 ,  B29D99/0096 ,  B65D41/0492 ,  B65D43/0214 ,  B65D2543/00231

Abstract: A combination cap and work support system includes a lower section configured to connect to a container and an upper section configured to provide a desired support to an object. The combination cap and work support system may be utilized alone or in multiples to support an object above a work surface during a project. Configurations of the upper section generally include support structures such as ridges and apices in a desired configuration. Configurations of the combination cap and work support system may be separable into individual segments each of which may be separately utilized as a support structure for an object. The combination cap and work support system may be included as part of a kit in conjunction with a compatible container, such as a can of surface coating.

公开(公告)号：US09956565B2

公开(公告)日：2018-05-01

申请号：US15226460

申请日：2016-08-02

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yukihiko Inagaki

IPC: H01L21/67 ,  B05B1/24 ,  B05C13/00 ,  B05C13/02 ,  H01L21/677

CPC classification number: B05B1/24 ,  B05C13/00 ,  B05C13/02 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67745

Abstract: A substrate treating apparatus includes a front heat-treating block, a front relay block and a solution treating block. The front heat-treating block has heat-treating units and main transport mechanisms. The front relay block has receivers and transport mechanisms. The solution treating block has solution treating units and transport mechanisms for solution treatment. The front heat-treating block and front relay block are connected to be able to transport substrates reciprocally. The front relay block and solution treating block are connected to be able to transport the substrates reciprocally. The front relay block is disposed between the solution treating block and front heat-treating block.

公开(公告)号：US09932704B2

公开(公告)日：2018-04-03

申请号：US14525774

申请日：2014-10-28

Applicant: Illinois Tool Works Inc.

Inventor： Mel Steven Lessley ,  Edward Wayne Bolyard, Jr.

IPC: D06M23/00 ,  B05B13/02 ,  B05B3/02 ,  B05D1/02 ,  B05C13/00 ,  B05C5/02

CPC classification number: D06M23/00 ,  B05B3/02 ,  B05B13/0214 ,  B05C5/0241 ,  B05C5/0245 ,  B05C5/027 ,  B05C13/00 ,  B05D1/02

Abstract: A fluid application device, strand engagement device, and method of controlling the same are provided. The fluid application device includes an applicator head and a nozzle assembly. The nozzle assembly includes a guide slot configured to receive a strand of material and an orifice configured to discharge a first fluid on to the strand. The strand engagement device is secured to the applicator head and includes an actuating assembly and an engagement arm connected to the actuating assembly. The engagement arm is configured to engage the strand and move between a first position and a second position in response to actuation of the actuating assembly. The method of controlling the strand engagement device includes receiving an input signal including content, determining the content of the input signal and operating the strand engagement device in response to, and based on the content of, the input signal.

公开(公告)号：US20180036761A1

公开(公告)日：2018-02-08

申请号：US15562006

申请日：2016-03-23

Applicant: OBDUCAT AB

Inventor： Pirmin MUFFLER

IPC: B05C13/00 ,  B05C11/08 ,  B05D1/00 ,  H01L21/683 ,  H01L21/687

CPC classification number: B05C13/00 ,  B05C11/08 ,  B05D1/005 ,  H01L21/6838 ,  H01L21/68742

Abstract: A rotary plate for holding a substrate for a coating device, which rotary plate comprises a plurality of suction points, is intended to be characterized by an annular elevation, wherein a diameter of the annular elevation substantially corresponds to a diameter of the substrate.

公开(公告)号：US09861998B2

公开(公告)日：2018-01-09

申请号：US14679764

申请日：2015-04-06

Applicant: Oria Collapsibles, LLC

Inventor： Miguel A. Linares

IPC: B05C13/02 ,  B05B13/02 ,  B05B13/04 ,  B25J9/00 ,  B05C15/00 ,  B05C13/00

CPC classification number: B05B13/0264 ,  B05B13/0431 ,  B05B13/0457 ,  B05C13/00 ,  B05C15/00 ,  B25J9/0093 ,  Y10S901/31 ,  Y10S901/43

Abstract: A process and assembly for mass producing a plasticized coated and structurally supporting insert including a first conveyor for advancing a plurality of lay-flat inserts and at least one lift and transfer mechanism for transferring the inserts between the first conveyor and a second overhead conveyor. A dual function robot is positioned aside the first conveyor and has a first numerically controlled gripping portion for engaging and raising a selected one of the lay flat supported inserts. The robot further has a second numerically controlled and articulating arm for spray coating a plasticized material upon the insert.

公开(公告)号：US09768014B2

公开(公告)日：2017-09-19

申请号：US14658102

申请日：2015-03-13

Applicant: Applied Materials, Inc.

Inventor： Jungrae Park ,  Wei-Sheng Lei ,  Prabhat Kumar ,  James S. Papanu ,  Brad Eaton ,  Ajay Kumar

IPC: B05C11/08 ,  B05C11/02 ,  B05C13/02 ,  B05C13/00 ,  H01L21/02 ,  B05B1/00 ,  B05B3/10 ,  H01L21/308 ,  H01L21/683 ,  H01L21/78 ,  H01L21/67

CPC classification number: H01L21/02282 ,  B05B1/00 ,  B05B3/1014 ,  B05B3/1035 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/6715 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327

Abstract: Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.

公开(公告)号：US09713822B2

公开(公告)日：2017-07-25

申请号：US14535916

申请日：2014-11-07

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Masahiro Miyagi ,  Koji Hashimoto ,  Toru Endo

IPC: B05C11/08 ,  B05C11/10 ,  B05C5/02 ,  H01L21/67 ,  B05B1/00 ,  B05C13/00 ,  B05D1/02

CPC classification number: B05C11/08 ,  B05B1/00 ,  B05C5/0225 ,  B05C11/10 ,  B05C11/1036 ,  B05C11/1039 ,  B05C13/00 ,  B05D1/02 ,  H01L21/67051

Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.