公开(公告)号：US20150114690A1

公开(公告)日：2015-04-30

申请号：US14522768

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi ,  Takashi Kariya

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

Abstract translation: 柔性刚性布线板包括柔性基板，非柔性基板，其定位成使得非柔性基板在柔性基板的水平方向上延伸;柔性基板和非柔性基板的第一表面侧上的第一布线层 ，在所述柔性和非柔性基板的第二表面侧上的第二布线层，覆盖所述柔性和非柔性基板的第一侧的第一绝缘层，并且具有暴露柔性基板的第一侧的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二侧面的第二绝缘层，并且具有暴露所述柔性基板的第二侧的一部分的开口。 所述第一布线层包括在所述柔性基板的第一侧上的第一导体图案，并且所述第二布线层包括延伸穿过所述柔性和非柔性基板的第二侧的第二导体图案。

公开(公告)号：US20150107883A1

公开(公告)日：2015-04-23

申请号：US14512514

申请日：2014-10-13

Applicant: TRIPOD TECHNOLOGY CORPORATION

Inventor： Bo-Shiung Huang ,  Wei-Hsiung Yang ,  Han-Ching Shih ,  Cheng-Feng Lin

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01F17/0006 ,  H01F17/06 ,  H01F27/2804 ,  H01F41/046 ,  H05K1/0272 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0275 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/1003 ,  H05K2203/1178 ,  Y10T29/302 ,  Y10T29/49165

Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

Abstract translation: 印刷电路板封装结构包括基板，多个环形磁性元件，支撑层和第一导电层。 基板具有两个相对的第一和第二表面，第一环形凹槽和第一凹槽。 每个第一环形凹槽通过至少一个第一凹槽与另一个第一环形凹槽连通，并且至少两个第一环形凹槽通过第一凹槽与基底的侧表面连通 以形成至少两个开口。 环形磁性元件分别位于第一环形凹部中。 支撑层位于第一表面上，并且覆盖第一环形凹部和第一凹槽。 支撑层和基板具有通孔。 第一导电层分别位于支撑层和面向通孔的基板的表面上。

公开(公告)号：US09013893B2

公开(公告)日：2015-04-21

申请号：US13896436

申请日：2013-05-17

Applicant: Industrial Technology Research Institute

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Cheng-Liang Cheng ,  Li-Duan Tsai

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/64 ,  H05K1/02 ,  H05K1/16 ,  H01L23/50 ,  H01L23/00 ,  H05K3/46 ,  H01G4/33

CPC classification number: H05K1/185 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/4608 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2203/0315

Abstract: An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.

Abstract translation: 嵌入式电容器模块包括电极引出部分和与电极引出部分相邻设置的至少一个固体电解电容器部分。 电极引出部包括第一基板，第二基板，设置在第一基板和第二基板之间的第一绝缘材料，形成在第一基板的至少一个表面上的第一多孔层和设置在第一基板 在第一多孔层上。 固体电解电容器部分包括第一衬底，第二衬底，第一多孔层，第一氧化物层，它们全部从电极引出部分延伸出来，第一导电聚合物层设置在第一氧化物层上， 设置在第一导电聚合物层上的第一碳层和设置在第一碳层上的第一导电粘合剂层。

公开(公告)号：US20150043188A1

公开(公告)日：2015-02-12

申请号：US14452640

申请日：2014-08-06

Applicant: SMR Patents S.A.R.L.

Inventor： Andreas Herrmann

IPC: H05K1/14 ,  H05K3/10 ,  B60R1/12

CPC classification number: H05K1/142 ,  B60R1/12 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/105 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps: manufacturing a plurality of substrate parts (2a, 2b); and selecting at least two of the substrate parts (2a, 2b), and connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Abstract translation: 本发明涉及一种用于制造具有基板（2）和电路（8）的印刷电路板（10）的方法，特别是用于机动车辆的后视装置，该方法包括以下步骤： 多个基板部件（2a，2b）; 以及选择所述基板部分（2a，2b）中的至少两个，并且连接所选择的基板部分（2a，2b）并且将所连接的基板部分（2a，2b）提供给所述电路（8）。

公开(公告)号：US08952260B1

公开(公告)日：2015-02-10

申请号：US13434386

申请日：2012-03-29

Applicant: Boris Reynov ,  Shreeram Siddhaye ,  Venkata Penmetsa ,  John Cleveland ,  Madhavi Rajan ,  John Tran

Inventor： Boris Reynov ,  Shreeram Siddhaye ,  Venkata Penmetsa ,  John Cleveland ,  Madhavi Rajan ,  John Tran

IPC: H05K1/00 ,  H01K3/10 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/024 ,  H05K1/0353 ,  H05K2201/0187 ,  Y10T29/49165

Abstract: In some embodiments, a printed circuit board, configured to be coupled to electronic components, includes a first material portion and any number of second material portions. Each second material portion is sized and spaced apart from an adjacent second material portion such that electromagnetic waves associated with the operation of the electronic components are substantially not reflected. The first material portion defines a first dielectric constant and the second material portion defines a second dielectric constant that is different than the value of the first dielectric constant.

Abstract translation: 在一些实施例中，被配置为耦合到电子部件的印刷电路板包括第一材料部分和任何数量的第二材料部分。 每个第二材料部分的尺寸和间隔距离相邻的第二材料部分，使得与电子部件的操作相关联的电磁波基本上不被反射。 第一材料部分限定第一介电常数，第二材料部分限定不同于第一介电常数值的第二介电常数。

公开(公告)号：US20150022286A1

公开(公告)日：2015-01-22

申请号：US14509290

申请日：2014-10-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Jun SASAKI

IPC: H01P1/203 ,  H01P3/00 ,  H01P1/201 ,  H01P3/08

CPC classification number: H01P1/2039 ,  H01P1/2013 ,  H01P3/003 ,  H01P3/08 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/028 ,  H05K2201/0187 ,  H05K2201/09727

Abstract: A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer.

Abstract translation: 高频信号线包括包括第一和第二主表面的基底层，设置在第一主表面上的信号线，沿着信号线设置在第一主表面上的接地导体，以及多个高电容率部分， 沿着信号线并且与信号线和接地导体的一部分接触，每个高介电常数部分具有比基层更高的比介电常数。

公开(公告)号：US08925194B2

公开(公告)日：2015-01-06

申请号：US13219169

申请日：2011-08-26

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01K3/10 ,  H05K3/00 ,  H01L23/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that an end of the substrate is positioned adjacent to an end of the board and forms boundary between the board and the substrate with respect to the end of the board, covering the boundary between the board and the substrate with an insulating layer such that the insulating layer is positioned on the board and the substrate across the boundary, forming a second conductor pattern on the insulating layer, forming a via hole which passes through the insulating layer and reaches a first conductor pattern of the board, and plating the via hole such that a via conductor connecting the first and second patterns. The flexible board includes a flexible substrate and the first pattern formed over the substrate.

Abstract translation: 制造柔性刚性布线板的方法包括在基板和板的水平方向上并排设置非柔性基板和柔性基板，使得基板的端部邻近板的端部定位， 在板和基板之间形成相对于板的端部的边界，用绝缘层覆盖板和基板之间的边界，使得绝缘层位于板上并且基板跨越边界，形成第二个 形成绝缘层上的导体图案，形成穿过绝缘层并到达板的第一导体图形的通孔，并且对通孔进行电镀，使得连接第一和第二图案的通孔导体。 柔性板包括柔性基板和形成在基板上的第一图案。

公开(公告)号：US08917107B2

公开(公告)日：2014-12-23

申请号：US13563258

申请日：2012-07-31

Applicant: Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G01R31/00 ,  G01R31/28 ,  H01L23/538 ,  H05K1/02 ,  H01L21/66 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：US08913398B2

公开(公告)日：2014-12-16

申请号：US14016707

申请日：2013-09-03

Applicant: Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

Inventor： Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

IPC: H05K7/00 ,  H05K3/00 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract translation: 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。

公开(公告)号：US20140355232A1

公开(公告)日：2014-12-04

申请号：US14461245

申请日：2014-08-15

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Tatsuro SAWATARI ,  Yuichi SUGIYAMA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10522

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.