公开(公告)号：US20070084629A1

公开(公告)日：2007-04-19

申请号：US11538823

申请日：2006-10-05

Applicant: William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

Inventor： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC: H05K1/16

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US07186456B2

公开(公告)日：2007-03-06

申请号：US10952219

申请日：2004-09-28

Applicant: Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

Inventor： Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

IPC: B32B5/16 ,  B32B15/08 ,  B32B27/08

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190–450° C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5–10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3–0.8 μm and a maximum size of no greater than 2 μm, in at least about 1 μm of the polyimide surface layer.

Abstract translation: 一种容易滑动的聚酰亚胺膜，其具有聚酰亚胺表面层，该聚酰亚胺表面层包含热塑性聚酰亚胺，玻璃化转变温度为190-450℃，其中分散在聚酰亚胺表面层的聚酰亚胺中的比例约为0.5〜 基于聚酰亚胺表面层的聚酰亚胺为10质量％，由包含至少80质量％的均苯四酸酸组分和对苯二胺组分的聚酰亚胺制成的全芳香族聚酰亚胺颗粒，中值粒径为0.3-0.8μm， 最大尺寸不大于2μm，至少约1μm的聚酰亚胺表面层。

公开(公告)号：US20070029107A1

公开(公告)日：2007-02-08

申请号：US11580849

申请日：2006-10-16

Applicant: Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

Inventor： Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

IPC: G03C3/00

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/102 ,  H05K3/4661 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0347 ,  H05K2203/121 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

Abstract: A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Abstract translation: 布线板包括基板; 树脂层，其被选择性地形成在基板的一个主表面上，并且具有包含或粘附到其表面的细金属颗粒; 以及形成在树脂层上的导电金属层，其间插入有金属微粒。

公开(公告)号：US20070025091A1

公开(公告)日：2007-02-01

申请号：US11491604

申请日：2006-07-24

Applicant: Hiroshi Shimada ,  Shigeru Michiwaki ,  Kazuo Shishime

Inventor： Hiroshi Shimada ,  Shigeru Michiwaki ,  Kazuo Shishime

IPC: H05K1/00

CPC classification number: H05K3/4661 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/09518 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/1152

Abstract: A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer. The first and second wiring layers are electrically connected to each other via at least one through hole. The first wiring layer is united with the first insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface. The second wiring layer is united with the second insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface.

Abstract translation: 印刷布线板具有形成在绝缘基板的至少一个表面上的第一布线层，形成为覆盖第一布线层的绝缘层和形成在绝缘层上的第二布线层。 绝缘层由包含树脂的高刚性片状增强材料制成的固化绝缘片形成。 第一和第二布线层通过具有底部的至少一个孔彼此电连接。 第二布线层与绝缘层在其界面处与注入到设置在界面上的凹部中的第二布线层的导电材料相结合。 另一种印刷电路板具有分别具有第一表面和第二表面的绝缘基板，分别形成在第一表面和第二表面上的第一绝缘层和第二绝缘层，以及形成在第一绝缘层上的第一布线层和 形成在第二绝缘层上的第二布线层。 第一和第二布线层经由至少一个通孔彼此电连接。 第一布线层与第一绝缘层在其界面处与注入到设置在界面上的凹部中的第一布线层的导电材料结合。 第二布线层与第二绝缘层的界面处与第一布线层的导电材料的界面结合，注入到设置在界面上的凹部中。

公开(公告)号：US07170187B2

公开(公告)日：2007-01-30

申请号：US10711185

申请日：2004-08-31

Applicant: William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

Inventor： William E. Bernier ,  Marie S. Cole ,  Mukta G. Farooq ,  John U. Knickerbocker ,  Tasha E. Lopez ,  Roger A. Quon ,  David J. Welsh

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US07141873B2

公开(公告)日：2006-11-28

申请号：US10956050

申请日：2004-10-04

Applicant: Akiyoshi Aoyagi

Inventor： Akiyoshi Aoyagi

IPC: H01L23/02

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/094 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external terminals include at least one first external terminal and two or more second external terminals. The first external terminal is formed of a soldering material. Each of the second external terminals includes a soldering material and a plurality of particles formed of a resin and dispersed in the soldering material. The second external terminals are a pair of external terminals among the external terminals, and a distance between the pair of external terminals is greater than a distance between any other pair of external terminals among the external terminals.

Abstract translation: 一种半导体器件，包括：半导体芯片; 其上安装有半导体芯片的布线板; 以及设置在所述布线板上的多个外部端子。 外部端子包括至少一个第一外部端子和两个或更多个第二外部端子。 第一外部端子由焊接材料形成。 每个第二外部端子包括焊接材料和由树脂形成并分散在焊料中的多个颗粒。 第二外部端子是外部端子之间的一对外部端子，并且一对外部端子之间的距离大于外部端子中的任何其它外部端子之间的距离。

公开(公告)号：US20060182881A1

公开(公告)日：2006-08-17

申请号：US11354527

申请日：2006-02-15

Applicant: Joseph Montano ,  Jason Reese ,  Luke Little

Inventor： Joseph Montano ,  Jason Reese ,  Luke Little

IPC: B05D5/06 ,  B05D1/36

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

Abstract translation: 提供了改善金属层与诸如光学衬底之类的衬底的粘附性的方法。 这样的方法在金属沉积之前在基板上使用包含镀催化剂的粘合促进组合物层。 还提供了通过这些过程制造的装置。

公开(公告)号：US20050260430A1

公开(公告)日：2005-11-24

申请号：US10343944

申请日：2001-04-27

Applicant: Hiroshi Kuroda ,  Nobuyuki Okinaga

Inventor： Hiroshi Kuroda ,  Nobuyuki Okinaga

IPC: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32 ,  H05K3/34 ,  B32B15/02

CPC classification number: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10−5 to 7×10−5 (1/K).

Abstract translation: 本发明提供一种具有放松施加到基板的电路等的力的能力的导电细粒。 一种导电细颗粒，其包含由其表面覆盖有至少一个金属层的树脂制成的芯细颗粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -6， -5（1 / K）。

公开(公告)号：US20050255270A1

公开(公告)日：2005-11-17

申请号：US11165345

申请日：2005-06-24

Applicant: Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

Inventor： Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

IPC: B32B27/38 ,  C08G59/62 ,  C08K5/53 ,  C08L63/04 ,  H05K1/00 ,  H05K3/46 ,  B65D1/00

CPC classification number: H05K3/4676 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/1376 ,  Y10T428/236 ,  Y10T428/24157 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

公开(公告)号：US20050224253A1

公开(公告)日：2005-10-13

申请号：US11103462

申请日：2005-04-12

Applicant: Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

Inventor： Hideo Aoki ,  Chiaki Takubo ,  Naoko Yamaguchi

IPC: H05K3/18 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/102 ,  H05K3/4661 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0347 ,  H05K2203/121 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

Abstract: A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Abstract translation: 布线板包括基板; 树脂层，其被选择性地形成在基板的一个主表面上，并且具有包含或粘附到其表面的细金属颗粒; 以及形成在树脂层上的导电金属层，其间插入有金属微粒。