Heat shock resistant printed circuit board assemblies
    41.
    发明授权
    Heat shock resistant printed circuit board assemblies 失效
    耐热冲击印刷电路板组件

    公开(公告)号:US4303798A

    公开(公告)日:1981-12-01

    申请号:US34210

    申请日:1979-04-27

    Applicant: Milan Paunovic

    Inventor: Milan Paunovic

    Abstract: The heat shock resistance of plated through holes in printed circuit assemblies is significantly increased by using as the through hole plating a special multi-layered arrangement comprising at least two layers of an electrically conductive metal in combination with at least one intermediate layer of a different electrically conductive metal. In preferred embodiments, the through hole plating comprises at least two layers of a stressed metal together with at least one intermediate layer of a metal having a stress in counteraction to that of one or more of the other metal layers. These through hole platings are capable of exposure to conditions of heat shock, such as encountered during high temperature soldering, without developing cracks resulting in breaks in the conducting pathways and failures.

    Abstract translation: 通过使用特殊的多层布置,包括至少两层导电金属与至少一个不同电学中间层的组合,使用印刷电路组件中电镀通孔的耐热冲击性 导电金属。 在优选实施例中,通孔镀层包括至少两层应力金属以及至少一个金属中间层,其具有与一个或多个其它金属层的应力相反的应力。 这些通孔电镀能够暴露于热冲击的条件下,例如在高温焊接期间遇到的,而不会产生导致导电路径和故障中断的裂纹。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    48.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20170034909A1

    公开(公告)日:2017-02-02

    申请号:US15223241

    申请日:2016-07-29

    Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.

    Abstract translation: 在基底绝缘层上形成导体迹线。 导体迹线包括两个端子部分和一个布线部分。 布线部形成为将两个端子部彼此连接并从各端子部延伸。 形成金属覆盖层以覆盖导体迹线的端子部分和布线部分并且从端子部分的表面连续地延伸到布线部分的表面。 金属覆盖层由具有低于镍的磁性的金属制成,例如由金制成。 在绝缘层上形成覆盖绝缘层,以覆盖形成在导体迹线上的金属覆盖层的覆盖布线部分的部分,而不覆盖覆盖端子部分的金属覆盖层的一部分。

    Printed wiring board and method for manufacturing the same
    50.
    发明授权
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号:US09538651B2

    公开(公告)日:2017-01-03

    申请号:US14820978

    申请日:2015-08-07

    Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

    Abstract translation: 印刷布线板包括绝缘层,第一导体层,其嵌入绝缘层的第一表面中,并且包括用于连接电子部件的连接部分,从绝缘层的第二表面突出的第二导体层,阻焊层 覆盖第一导体层并具有露出连接部分的开口结构,形成在连接部分上的阻挡金属层,使得阻挡层从绝缘层的第一表面突出,以及形成在阻挡层上的金属柱,使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度,并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

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