公开(公告)号：US20160198561A1

公开(公告)日：2016-07-07

申请号：US14907400

申请日：2014-07-17

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Daiki TSUNEMI ,  Masahito MORITA ,  Naoki KITO ,  Tatsuharu IKAWA ,  Hiroyuki KODAMA

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15159 ,  H01L2924/15162 ,  H05K1/0284 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/0919 ,  H01L2924/00

Abstract: A wiring board including a board main body made of an insulating material and having a front surface and rear surface and side surfaces at four sides located between the front and the rear surfaces, and a wiring conductor for plating, an end surface of which is exposed on any side surface of the board main body, wherein the wiring board includes a first insulating layer formed on the side surface on which the end surface of the wiring conductor for plating is exposed to cover the end surface, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and wherein the conductor layer is electrically connected to a ground layer formed inside the board main body.

Abstract translation: 一种布线板，包括由绝缘材料制成并具有前表面和后表面的板主体和位于前表面和后表面之间的四边的侧表面的布线板，以及用于电镀的布线导体，其端表面暴露 在所述板主体的任一侧表面上，所述布线板包括形成在所述侧表面上的用于电镀用布线导体的端面露出以覆盖所述端面的第一绝缘层，以及形成在所述第一绝缘层上的导体层 沿着包括第一绝缘层的表面的侧面的侧面形成有第一绝缘层的板主体的侧面，并且其中导体层电连接到形成在板主体内部的接地层 。

公开(公告)号：US09374886B2

公开(公告)日：2016-06-21

申请号：US13343738

申请日：2012-01-05

Applicant: Noboru Kato ,  Jun Sasaki

Inventor： Noboru Kato ,  Jun Sasaki

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K3/28 ,  H05K3/4635 ,  H05K2201/0715 ,  Y10T29/49155

Abstract: A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.

Abstract translation: 容易弯曲的信号线包括至少包括绝缘体层的层叠体，该绝缘体层包括柔性材料，并且从Z轴方向的正方向侧到其负向侧层叠。 接地导体牢固地固定在绝缘片的正方向侧的主面上，在z轴方向上。 信号线在z轴方向上牢固地固定在绝缘体层的正极侧的主表面上。 接地导体牢固地固定在绝缘体层的正方向侧的主面上，在z轴方向。 接地导体和信号线定义了带状线结构。 与绝缘体层的位置相比，层叠体弯曲，使得绝缘体层位于内周侧。

公开(公告)号：US09362683B2

公开(公告)日：2016-06-07

申请号：US14161914

申请日：2014-01-23

Applicant: Sony Corporation

Inventor： Akira Akiba ,  Mitsuo Hashimoto ,  Shinya Morita ,  Shun Mitarai ,  Mikihiro Taketomo ,  Kazunao Oniki ,  Koichi Ikeda

IPC: H02G15/02 ,  H01R13/6599 ,  H01P3/08 ,  H01P3/12 ,  H05K1/02

CPC classification number: H01R13/6691 ,  H01P3/08 ,  H01P3/085 ,  H01P3/121 ,  H01R13/6599 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.

Abstract translation: 信号传输电缆具有包括电介质层和金属层的电缆。 信号传输电缆还包括具有带终端的芯片的连接器。 连接器包括具有有机层的衬底，并且有机层的一部分从衬底延伸以形成电缆的电介质层。 金属层位于电介质层上，直接连接到端子。

公开(公告)号：US09354255B2

公开(公告)日：2016-05-31

申请号：US13429200

申请日：2012-03-23

Applicant: Adam Albrecht

Inventor： Adam Albrecht

IPC: G01V3/00 ,  G01R1/30 ,  G01R33/34 ,  G01R33/36 ,  G01R21/00

CPC classification number: G01R1/30 ,  G01R21/00 ,  G01R33/34007 ,  G01R33/3403 ,  G01R33/3614 ,  H03F21/00 ,  H05K1/0272 ,  H05K1/0306 ,  H05K2201/064 ,  H05K2201/0715 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: An output stage module for a power amplifier device (e.g., for a power amplifier device of a transmit unit of a magnetic resonance device) includes a housing and a carrier that is arranged within the housing. The carrier is made of a non-electrically-conducting, thermally-conducting material with low electrical losses (e.g., a ceramic carrier). At least two transistor dies are arranged on the carrier. At least one transistor, in each case, is assigned to a phase of a symmetrical input signal. In and/or on the carrier, a first conductor structure connecting (e.g., inductively) a drain output of the at least two transistor dies to an output signal and to second conductor structures each conducting an input signal to at least one gate input of the at least two transistor dies are provided. At least one cooling channel routed adjacent to at least one transistor die of the at least two transistor dies is provided.

Abstract translation: 用于功率放大器装置（例如，用于磁共振装置的发射单元的功率放大器装置）的输出级模块包括壳体和布置在壳体内的载体。 载体由具有低电损耗的非导电导热材料（例如，陶瓷载体）制成。 在载体上布置至少两个晶体管管芯。 在每种情况下，至少一个晶体管被分配给对称输入信号的相位。 在载体中和/或载体上，将至少两个晶体管管芯的漏极输出连接（例如，感应地）到输出信号的第一导体结构和每个将输入信号传导到至少一个栅极输入的第二导体结构 提供至少两个晶体管管芯。 提供了与至少两个晶体管管芯的至少一个晶体管管芯相邻的至少一个冷却通道。

公开(公告)号：US20160088738A1

公开(公告)日：2016-03-24

申请号：US14956214

申请日：2015-12-01

Applicant: Intel Corporation

Inventor： Digvijay A. RAORANE ,  Kemal AYGUN ,  Daniel N. SOBIESKI ,  Drew W. DELANEY

IPC: H05K3/00 ,  H05K3/02 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K3/007 ,  C23C14/14 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0219 ,  H05K1/185 ,  H05K3/02 ,  H05K3/30 ,  H05K3/4682 ,  H05K2201/0715 ,  H05K2203/1469 ,  H05K2203/308 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/83005

Abstract: An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the die, the build-up carrier including a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die; and an interference shield including a conductive material disposed on the die and a portion of the build-up carrier. The apparatus may be connected to a printed circuit board. A method including forming a build-up carrier adjacent a device side of a die including a plurality of alternating layers of patterned conductive material and insulating material; and forming a interference shield on a portion of the build-up carrier.

公开(公告)号：US09237645B2

公开(公告)日：2016-01-12

申请号：US14113729

申请日：2012-04-26

Applicant: Masayoshi Kido ,  Yoshihide Sekito

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0218 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0373 ,  H05K1/0393 ,  H05K9/003 ,  H05K2201/0715

Abstract: A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.

Abstract translation: 导电层一体化柔性印刷电路板包括：（A）电磁屏蔽导电层; （B）绝缘膜; 和（C）依次层叠电磁屏蔽导电层（A），绝缘体膜（B）和布线图案的膜（C）的布线图案的膜，绝缘膜（B ）包含至少（a）粘合剂聚合物和（b）球形有机珠粒。

公开(公告)号：US20150382460A1

公开(公告)日：2015-12-31

申请号：US14318156

申请日：2014-06-27

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Jack Vasken Ajoian

IPC: H05K1/09 ,  H05K1/03 ,  H05K3/00 ,  C23C28/02 ,  H05K3/46 ,  C25D7/00 ,  C25D5/34 ,  H05K1/02 ,  H05K3/06

CPC classification number: H05K1/09 ,  B32B15/00 ,  C23C28/023 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  C25D7/00 ,  C25D7/123 ,  H01P3/081 ,  H01P11/003 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/0296 ,  H05K1/034 ,  H05K3/0091 ,  H05K3/067 ,  H05K3/108 ,  H05K3/24 ,  H05K3/46 ,  H05K3/4608 ,  H05K2201/015 ,  H05K2201/0715 ,  H05K2203/072 ,  H05K2203/0723

Abstract: A printed circuit board (PCB) includes a wrapped conductor enabling transmission of a radio frequency (RF) signal, the wrapped conductor including a conductor core and a conductive wrap disposed on top and side surfaces of the conductor core. The PCB further includes a top dielectric layer disposed on the conductive wrap of the wrapped conductor, at least partially embedding the wrapped conductor. Resistivity of the conductive wrap is less than resistivity of the conductor core, such that a majority of RF power of the RF signal is propagated through the conductive wrap.

Abstract translation: 印刷电路板（PCB）包括能够传输射频（RF）信号的封装导体，所述缠绕导体包括布置在导体芯的顶表面和侧表面上的导体芯和导电封套。 PCB还包括设置在包裹的导体的导电外皮上的顶部介电层，至少部分地包埋被包裹的导体。 导电膜的电阻率小于导体芯的电阻率，使得RF信号的大部分RF功率通过导电封套传播。

公开(公告)号：US20150374254A1

公开(公告)日：2015-12-31

申请号：US14790541

申请日：2015-07-02

Applicant: MEDIGUIDE LTD.

Inventor： Lior Sobe

IPC: A61B5/042 ,  A61B5/06 ,  H05K3/46

CPC classification number: A61B5/0422 ,  A61B5/0402 ,  A61B5/062 ,  A61B5/068 ,  A61B5/6847 ,  A61B5/6851 ,  A61B5/6852 ,  A61B6/12 ,  A61B6/487 ,  A61B2562/0223 ,  A61B2562/125 ,  A61B2562/182 ,  A61B2562/222 ,  A61B2562/227 ,  H05K1/0245 ,  H05K3/4685 ,  H05K9/0073 ,  H05K2201/0715 ,  H05K2201/097 ,  H05K2203/0548 ,  H05K2203/30

Abstract: An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

Abstract translation: 公开了一种用于发送电信号的装置。 该装置包括基板和位于基板上的双绞导线。 所述双绞线导体具有包括导电材料的第一层，包含非导电材料的第二层和包含导电材料的第三播放器。 第一层具有由多个间隙隔开的多个段。 第二层定位在所述间隙中并且电绝缘位于间隙内的段的一部分。 第三层位于第二层之上。 第三层被配置为将一个段的末端电连接到另一段的末端。 由三维结构形成的双绞导体包括两个彼此扭曲的电隔离导体。

公开(公告)号：US09198304B2

公开(公告)日：2015-11-24

申请号：US13441932

申请日：2012-04-09

Applicant: Biao Li

Inventor： Biao Li

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/308 ,  Y10T29/49155

Abstract: A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.

Abstract translation: 制造刚性柔性印刷电路板的方法包括以下步骤。 首先，提供柔性PCB。 柔性PCB包括底座和底座上的电迹线层。 柔性PCB包括连接到第一区域的第一区域和第二区域。 第一个和第二个区域定义了一个边界。 其次，在第一区域和第二区域的一部分中的电迹线层上依次形成保护膜和可剥离层。 第三，铜线圈，胶带和柔性电路板层压在一起。 第四，蚀刻第二区域中的铜线圈以形成外部电迹线层。 最后，去除第一区域中的铜线圈，并剥离可剥离层和胶带，从而获得R-F PCB。

公开(公告)号：US20150282395A1

公开(公告)日：2015-10-01

申请号：US14227929

申请日：2014-03-27

Applicant: Digvijay A. RAORANE ,  Kemal AYGUN ,  Daniel N. SOBIESKI ,  Drew W. DELANEY

Inventor： Digvijay A. RAORANE ,  Kemal AYGUN ,  Daniel N. SOBIESKI ,  Drew W. DELANEY

IPC: H05K9/00 ,  C23C14/14 ,  H05K3/00 ,  H05K1/02 ,  C23C14/34

CPC classification number: H05K3/007 ,  C23C14/14 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0219 ,  H05K1/185 ,  H05K3/02 ,  H05K3/30 ,  H05K3/4682 ,  H05K2201/0715 ,  H05K2203/1469 ,  H05K2203/308 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/83005

Abstract: An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the die, the build-up carrier including a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die; and an interference shield including a conductive material disposed on the die and a portion of the build-up carrier. The apparatus may be connected to a printed circuit board. A method including forming a build-up carrier adjacent a device side of a die including a plurality of alternating layers of patterned conductive material and insulating material; and forming a interference shield on a portion of the build-up carrier.

Abstract translation: 一种包括模具的装置，包括具有限定模具的厚度的接触点和侧壁的装置侧; 耦合到管芯的积聚载体，所述堆积载体包括多个图案化导电材料和绝缘材料的交替层，其中图案化导电材料层中的至少一层耦合到 死; 以及包括设置在管芯上的导电材料和积聚载体的一部分的干涉屏蔽。 该装置可以连接到印刷电路板。 一种方法，包括在包括图案化导电材料和绝缘材料的多个交替层的模具的器件侧附近形成堆积载体; 以及在积聚载体的一部分上形成干涉屏蔽。