Abstract:
A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.
Abstract:
The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections.
Abstract:
The present disclosure teaches a method and apparatus to gel a dopant material, which may be a low viscosity liquid, and apply it towards beneficially coating dopant liquid in the manufacture of a three-dimensional thin-film solar cell substrate. As an alternate to using high viscosity dopants, a dopant coating liquid, which is typically distributed in low viscosity alcohol based liquid forms, may instead be utilized as a dopant material in a gelatinous state towards the manufacture of a three-dimensional thin-film solar cell substrate. The methods and devices disclosed herein provide for enhancing the high viscosity characteristics of a dopant material. The present disclosure teaches the use of the dopant material in its gelatinous state towards an exemplary cavity filling method. The more cotable dopant material is applied in an exemplary coating layout and an exemplary integrated coating system to achieve improvements in coating coverage with regards to uniformity, which may be, but is not limited to, homogeneity, color uniformity, opacity, and density of the dopant material.
Abstract:
A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.
Abstract:
According to one embodiment, an electrical interconnection system includes a pair of printed wiring boards formed of a printed wiring board material. Each printed wiring board has multiple surface pads formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit coupled to one printed wiring board is electrically coupled to another electrical circuit of the other printed wiring board by contact of the surface pads of each printed wiring board with one another.
Abstract:
In order in particular to allow interconnects to be applied to a component (2) by a thermal spraying process in such a way that they are clearly delimited from one another, before the actual spraying process the surface (8) of the component (2) is treated, in particular laser treated, in such a way that a non-adhering region (14) with a nub-like surface structure is formed.
Abstract:
A component having a ceramic base the surface of which is covered in at least one area by a metalized coating, the ceramic base being spatially structured and the partial discharge resistance between at least two layers of a metalized structure produced from the same or different materials and between the layer of a metalized structure and the ceramic being
Abstract:
A rotation detector includes: a magnet to form a magnetic field between the magnet and a rotary member; a magnetism detection element positioned in the proximity of the magnet to detect a variation in the magnetic field due to a rotation of the rotary member; and a signal processing circuit 3 to process a signal from the magnetism detection element and which is coated and sealed with a resin 7, recess portions 14a, 14b which are lower than electrode forming regions 15 are formed at adjoining regions adjacent to electrode forming regions 15 on which surface electrodes 4 are installed and resin 7 is filled within recess portions 14a, 14b. Thus, the rotation detector which can suppress the deficiency generated at a part mounted on a circuit forming portion, at junctions between the part and surface electrodes, or so forth due to expansion and shrinkage involved in a temperature variation can be provided.
Abstract:
A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.
Abstract:
A method of reducing voids within a bead of encapsulant material deposited on a series of wire bonds connecting a micro-electronic device with die contact pads extending along one edge, and a plurality of conductors on a support structure such that the wire bonds extend across a gap defined between the edge of the micro-electronic device and the plurality of conductors. The method has the steps of depositing at least one transverse bead of encapsulant in the gap extending at an angle to the edge of the micro-electronic device, and, depositing at least one longitudinal bead of encapsulant in the gap extending parallel to the edge of the micro-electronic device.