公开(公告)号：US07815475B2

公开(公告)日：2010-10-19

申请号：US12340144

申请日：2008-12-19

Applicant: Kirk B. Peloza ,  Victor Zaderej ,  John Dolaz ,  Stephen Rushing

Inventor： Kirk B. Peloza ,  Victor Zaderej ,  John Dolaz ,  Stephen Rushing

IPC: H01R13/02 ,  H01R9/24

CPC classification number: H05K1/119 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/185 ,  H05K3/301 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/1059 ,  H05K2203/107 ,  Y10S439/931

Abstract: A connector assembly of complex shape has a connector body with possesses a plurality of distinct surfaces both parallel and intersecting. Laser directed structuring is used to form patterns of conductive traces on the surfaces of the connector body and raised ribs are formed along the traces and interposed between them to form channels that encompass at least portions of the traces. The raised ribs increase the time in which plating solution can dwell over the laser excited areas and also form abrasion barriers to prevent abrasion for the conductive traces during the plating thereof.

Abstract translation: 复杂形状的连接器组件具有连接器主体，其具有平行和相交的多个不同的表面。 激光定向结构用于在连接器主体的表面上形成导电迹线图形，并且沿着迹线形成凸起的肋，并且插入在它们之间以形成包围至少部分迹线的通道。 凸起的肋条增加了电镀溶液可以停留在激光激发区域上的时间，并且还形成磨损屏障以防止在其镀覆期间导电迹线的磨损。

公开(公告)号：US07794234B2

公开(公告)日：2010-09-14

申请号：US12315305

申请日：2008-12-02

Applicant: Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

Inventor： Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H01R12/716 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/027 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09172 ,  H05K2201/09663 ,  H05K2203/0369

Abstract: The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections.

Abstract translation: 本发明提供一种被配置为电连接两个连接对象的连接器。 连接器包括具有放置在弹性构件的表面上的表面和导电膜的弹性构件。 导电膜包括分别与连接对象接触的两个接触部分和连接接触部分的连接部分。 每个接触部分包括至少部分地在突起之间布置的突起和排水。

公开(公告)号：US20100154998A1

公开(公告)日：2010-06-24

申请号：US12626363

申请日：2009-11-25

Applicant: Qing Yuan Ong

Inventor： Qing Yuan Ong

IPC: B01D1/22

CPC classification number: B01D1/22 ,  H01L21/02617 ,  H01L21/6715 ,  H01L22/12 ,  H01L31/035281 ,  H01L31/046 ,  H01L31/1872 ,  H01L31/1892 ,  H01L31/202 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/1258 ,  H05K3/207 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0126 ,  H05K2203/0528 ,  H05K2203/308 ,  Y02E10/50 ,  Y02P70/521

Abstract: The present disclosure teaches a method and apparatus to gel a dopant material, which may be a low viscosity liquid, and apply it towards beneficially coating dopant liquid in the manufacture of a three-dimensional thin-film solar cell substrate. As an alternate to using high viscosity dopants, a dopant coating liquid, which is typically distributed in low viscosity alcohol based liquid forms, may instead be utilized as a dopant material in a gelatinous state towards the manufacture of a three-dimensional thin-film solar cell substrate. The methods and devices disclosed herein provide for enhancing the high viscosity characteristics of a dopant material. The present disclosure teaches the use of the dopant material in its gelatinous state towards an exemplary cavity filling method. The more cotable dopant material is applied in an exemplary coating layout and an exemplary integrated coating system to achieve improvements in coating coverage with regards to uniformity, which may be, but is not limited to, homogeneity, color uniformity, opacity, and density of the dopant material.

Abstract translation: 本发明公开了一种凝胶化掺杂剂材料的方法和装置，其可以是低粘度液体，并且在制造三维薄膜太阳能电池基板时将其施加到有利地涂覆掺杂剂液体。 作为使用高粘度掺杂剂的替代方案，典型地分布在低粘度醇基液体形式中的掺杂剂涂覆液体可以替代地用作凝胶态的掺杂剂材料，以制造三维薄膜太阳能 细胞底物。 本文公开的方法和装置提供了增强掺杂剂材料的高粘度特性。 本公开教导了掺杂剂材料在其凝胶状态下的使用朝向示例性的空腔填充方法。 在一个示例性的涂层布局和一个示例性的整体涂层系统中应用较为可套的掺杂剂材料，以实现关于均匀性的涂层覆盖度的改进，其可以但不限于均匀性，颜色均匀性，不透明度和密度 掺杂剂材料。

公开(公告)号：US20100139962A1

公开(公告)日：2010-06-10

申请号：US12628284

申请日：2009-12-01

Applicant: Kentaro KANEKO

Inventor： Kentaro KANEKO

IPC: H05K1/16 ,  H05K3/00

CPC classification number: H05K3/0014 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/305 ,  H05K3/4682 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09136 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.

Abstract translation: 布线基板包括其中多个布线层一层叠置在其上的绝缘层（树脂层）之间的结构，并且布线层通过形成在每个树脂层中的通孔相互连接 。 凹陷部形成为围绕布线基板的芯片安装面侧的最外层树脂层上的芯片安装区域的环状。 或者，形成突出部分而不是凹部。

公开(公告)号：US20100134995A1

公开(公告)日：2010-06-03

申请号：US12628805

申请日：2009-12-01

Applicant: Julie N. Strickland

Inventor： Julie N. Strickland

IPC: H05K1/11

CPC classification number: H05K3/365 ,  H01R12/721 ,  H01R13/639 ,  H01R24/60 ,  H01R2107/00 ,  H05K1/142 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10409

Abstract: According to one embodiment, an electrical interconnection system includes a pair of printed wiring boards formed of a printed wiring board material. Each printed wiring board has multiple surface pads formed on a surface of the printed wiring board adjacent its outer edge. The surface of each printed wiring board is operable to be placed adjacent to one another such that an electrical circuit coupled to one printed wiring board is electrically coupled to another electrical circuit of the other printed wiring board by contact of the surface pads of each printed wiring board with one another.

Abstract translation: 根据一个实施例，电互连系统包括由印刷线路板材料形成的一对印刷线路板。 每个印刷电路板具有形成在印刷电路板的与其外边缘相邻的表面上的多个表面焊盘。 每个印刷线路板的表面可操作以彼此相邻放置，使得耦合到一个印刷线路板的电路通过每个印刷线路的表面焊盘的接触电耦合到另一个印刷线路板的另一个电路 彼此之间。

公开(公告)号：US07713594B2

公开(公告)日：2010-05-11

申请号：US11645829

申请日：2006-12-26

Applicant: Knuth Götz ,  Robert Süβ-Wolf ,  Marco De Paolis ,  Dieter Geist

Inventor： Knuth Götz ,  Robert Süβ-Wolf ,  Marco De Paolis ,  Dieter Geist

IPC: B05D3/00

CPC classification number: H05K3/14 ,  B23K26/0006 ,  B23K26/352 ,  B23K2103/42 ,  C23C4/01 ,  C23C4/02 ,  H05K3/381 ,  H05K2201/09045 ,  H05K2203/107 ,  H05K2203/1344 ,  Y10T428/24802

Abstract: In order in particular to allow interconnects to be applied to a component (2) by a thermal spraying process in such a way that they are clearly delimited from one another, before the actual spraying process the surface (8) of the component (2) is treated, in particular laser treated, in such a way that a non-adhering region (14) with a nub-like surface structure is formed.

Abstract translation: 为了特别地允许通过热喷涂工艺将互连应用于组件（2），使得它们彼此明确地界定，在实际喷涂过程之前，组件（2）的表面（8） 被特别地经过激光处理，以形成具有类似表面结构的非粘附区域（14）。

公开(公告)号：US20100112372A1

公开(公告)日：2010-05-06

申请号：US12596880

申请日：2008-04-17

Applicant: Claus Peter Kluge

Inventor： Claus Peter Kluge

IPC: B32B3/30 ,  B32B18/00 ,  B32B15/04 ,  B32B3/26 ,  B32B5/18 ,  B32B3/00 ,  C25D7/00 ,  B32B5/00 ,  C04B37/02

CPC classification number: C04B37/02 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/49822 ,  H01L23/49883 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/0254 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/245 ,  H05K2201/0175 ,  H05K2201/09045 ,  Y10T428/12389 ,  Y10T428/12479 ,  Y10T428/12576 ,  Y10T428/12618 ,  Y10T428/24355 ,  Y10T428/249953 ,  Y10T428/26 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component having a ceramic base the surface of which is covered in at least one area by a metalized coating, the ceramic base being spatially structured and the partial discharge resistance between at least two layers of a metalized structure produced from the same or different materials and between the layer of a metalized structure and the ceramic being

Abstract translation: 一种具有陶瓷基体的部件，其表面通过金属化涂层在至少一个区域中被覆盖，陶瓷基体是空间结构的，并且由相同或不同材料制成的至少两层金属化结构之间的部分放电电阻和 在金属化结构层和陶瓷之间<20pC。

公开(公告)号：US07688066B2

公开(公告)日：2010-03-30

申请号：US11722152

申请日：2006-01-11

Applicant: Yuhide Aoki

Inventor： Yuhide Aoki

IPC: G01B7/30

CPC classification number: H05K1/0271 ,  G01D11/245 ,  H05K1/0284 ,  H05K1/111 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10151 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A rotation detector includes: a magnet to form a magnetic field between the magnet and a rotary member; a magnetism detection element positioned in the proximity of the magnet to detect a variation in the magnetic field due to a rotation of the rotary member; and a signal processing circuit 3 to process a signal from the magnetism detection element and which is coated and sealed with a resin 7, recess portions 14a, 14b which are lower than electrode forming regions 15 are formed at adjoining regions adjacent to electrode forming regions 15 on which surface electrodes 4 are installed and resin 7 is filled within recess portions 14a, 14b. Thus, the rotation detector which can suppress the deficiency generated at a part mounted on a circuit forming portion, at junctions between the part and surface electrodes, or so forth due to expansion and shrinkage involved in a temperature variation can be provided.

Abstract translation: 旋转检测器包括：磁体，用于在磁体和旋转部件之间形成磁场; 位于所述磁体附近的磁检测元件，用于检测由所述旋转部件的旋转引起的所述磁场的变化; 以及信号处理电路3，用于处理来自磁检测元件的信号，并用树脂7进行了涂布和密封，低于电极形成区域15的凹部14a，14b形成在与电极形成区域15相邻的邻接区域 在其上安装有表面电极4，树脂7填充在凹部14a，14b内。 因此，可以提供能够抑制由于与温度变化有关的膨胀和收缩而在安装在电路形成部分上的部分，部件和表面电极之间的接合处产生的不足的旋转检测器。

公开(公告)号：US20100075466A1

公开(公告)日：2010-03-25

申请号：US12364517

申请日：2009-02-03

Applicant: Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

Inventor： Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

IPC: H01L21/00

CPC classification number: H01L21/56 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/20753 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.

Abstract translation: 在将微电子器件电连接到一系列导体的一系列引线键合上形成不对称密封剂珠的方法，该微电子器件具有平坦的有源表面。 该方法具有以下步骤：将管芯和引线接合在密封剂喷射器下方，将密封剂滴喷射到引线键合上，密封剂液滴沿垂直轨迹移动，倾斜模具使得活性表面倾斜于水平 并且，喷射所述密封剂滴以形成覆盖所述一系列引线接合的密封剂材料珠，所述珠具有围绕平行于所述活性表面的法线的轴线不对称的横截面轮廓。

公开(公告)号：US20100075465A1

公开(公告)日：2010-03-25

申请号：US12364516

申请日：2009-02-03

Applicant: Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

Inventor： Nadine Lee-Yen Chew ,  Elmer Dimaculangan Perez ,  Kiangkai Tankongchumruskul

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20753 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2203/049 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20754 ,  H01L2224/05599

Abstract: A method of reducing voids within a bead of encapsulant material deposited on a series of wire bonds connecting a micro-electronic device with die contact pads extending along one edge, and a plurality of conductors on a support structure such that the wire bonds extend across a gap defined between the edge of the micro-electronic device and the plurality of conductors. The method has the steps of depositing at least one transverse bead of encapsulant in the gap extending at an angle to the edge of the micro-electronic device, and, depositing at least one longitudinal bead of encapsulant in the gap extending parallel to the edge of the micro-electronic device.

Abstract translation: 一种减少沉积在一系列引线上的密封剂材料珠内的空隙的方法，所述一系列引线键将微电子器件与沿着一个边缘延伸的管芯接触焊盘连接，并且在支撑结构上延伸多个导体， 限定在微电子设备的边缘与多个导体之间的间隙。 该方法具有以下步骤：在与微电子器件的边缘成一定角度延伸的间隙中沉积至少一个密封剂的横向珠缘，并且将至少一个密封剂的纵向焊珠沉积在平行于 微电子设备。