公开(公告)号：US20140008105A1

公开(公告)日：2014-01-09

申请号：US14021053

申请日：2013-09-09

Applicant: FURUKAWA AUTOMOTIVE SYSTEMS INC. ,  FURUKAWA ELECTRIC CO., LTD.

Inventor： Kyutaro ABE ,  Hiroyuki FUKAI ,  Yasushi KIHARA ,  Juro UTSUMI ,  Naomi TAKAHASHI

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K1/183 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10409 ,  Y10T29/49144

Abstract: A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part.

Abstract translation: 电路板形成为使得印刷电路板连接到注塑电路板。 内部电路导体在印刷电路板安装部的导体部露出。 印刷电路板上设有通孔。 导体部分基本上垂直于电路板安装部分形成，并被插入到通孔中。 在印刷电路板安装部分中的导体部分附近形成有内螺纹部分。 内螺纹部分可以用作为固定构件的螺栓拧紧在一起。 印刷电路板通过焊料连接到导体部分。 预先在印刷电路板上的焊料附近形成孔。 螺栓穿过孔并固定到内螺纹部分。

公开(公告)号：US08604622B2

公开(公告)日：2013-12-10

申请号：US13495687

申请日：2012-06-13

Applicant: Thorsten Meyer ,  Markus Brunnbauer ,  Jens Pohl

Inventor： Thorsten Meyer ,  Markus Brunnbauer ,  Jens Pohl

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/83101 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/1316 ,  H05K2203/1469 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.

Abstract translation: 公开了一种制造器件，半导体芯片封装和半导体芯片组件的方法。 一个实施例包括在第一成形元件上施加至少一个半导体芯片。 至少一个元素被应用在第二个表单元素上。 在至少一个半导体芯片上和该至少一个元件上施加材料。

公开(公告)号：US20130306356A1

公开(公告)日：2013-11-21

申请号：US13873961

申请日：2013-04-30

Applicant: Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

Inventor： Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

IPC: H01B13/00 ,  H05K1/02

CPC classification number: B32B3/30 ,  A61B5/685 ,  A61B2562/125 ,  A61M37/0015 ,  A61M2037/0053 ,  A61N1/327 ,  C25D1/003 ,  C25D1/10 ,  C25D5/022 ,  H01B13/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/2958 ,  Y10T428/298

Abstract: Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

Abstract translation: 提供用于制造三维导电结构的方法。 还提供三维导电微结构。 该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。 在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

公开(公告)号：US08516693B2

公开(公告)日：2013-08-27

申请号：US12421142

申请日：2009-04-09

Applicant: Jung-Chien Chang

Inventor： Jung-Chien Chang

IPC: H05K3/30

CPC classification number: H05K1/16 ,  H01L27/3297 ,  H01L2227/326 ,  H05K3/205 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1469

Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.

Abstract translation: 本发明公开了一种印刷电路板。 印刷电路板通过提供基板的方法制成; 在衬底上形成第一电路; 在衬底上沉积薄膜; 通过薄膜在基板上构建电子部件，并允许电子部件电连接第一电路; 形成围绕所述电子部件的覆盖介电层; 并去除衬底。

公开(公告)号：US08465666B2

公开(公告)日：2013-06-18

申请号：US13146666

申请日：2010-02-23

Applicant: Toshiyuki Asahi ,  Yukihiro Shimasaki ,  Koji Shimoyama

Inventor： Toshiyuki Asahi ,  Yukihiro Shimasaki ,  Koji Shimoyama

IPC: C09K5/08 ,  C08K3/10 ,  C08K3/14 ,  C08L63/00 ,  H01L23/36 ,  H01L23/373

CPC classification number: C09K5/14 ,  C08G59/64 ,  C08K3/013 ,  C08L55/04 ,  C08L63/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/202 ,  H05K2201/0209 ,  H05K2201/09118 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/24 ,  H01L2924/00

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract translation: 导热组合物被制成含有含有结晶环氧树脂组分的固化的热固性树脂和无机填料。 导热组合物中无机填料的含量百分比为66体积％以上且90体积％以下。 该导热性组合物具有主要由无机填料形成的主体部分和主要由结晶环氧树脂组分形成的表面层部分，并形成在与主要部分连续的主要部分上。

公开(公告)号：US20130135578A1

公开(公告)日：2013-05-30

申请号：US13482094

申请日：2012-05-29

Applicant: Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

Inventor： Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

IPC: G02C7/04

CPC classification number: H05K3/301 ,  G02C7/04 ,  G02C7/083 ,  G02C7/101 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10727 ,  H05K2201/10916 ,  H05K2201/10984

Abstract: Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

Abstract translation: 包括隐形眼镜在内的眼科镜片可以通过并入有源和无源电气元件来增强。 需要电互连和管芯附接配置以确保部件和透镜的光学部分之间的电连接以及提供用于将平面器件安装在球形表面上的装置。 用于动力眼科装置（包括隐形眼镜）的电互连和芯片附件包括在光学塑料上实现导电迹线，将平面裸片附接到球形表面和底部填充，包覆成型和遮光以完成透镜。

公开(公告)号：US20130130089A1

公开(公告)日：2013-05-23

申请号：US13743244

申请日：2013-01-16

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01M2/30 ,  H01M2/00

CPC classification number: H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C48/022 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US08441806B2

公开(公告)日：2013-05-14

申请号：US12894968

申请日：2010-09-30

Applicant: Kiyotaka Tsukada ,  Tetsuya Muraki

Inventor： Kiyotaka Tsukada ,  Tetsuya Muraki

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board comprises a first conductive post for electrically connecting to the first electrode of the semiconductor device, a first metal plate connecting to the first conductive post, a second conductive post for electrically connecting to the second electrode of the semiconductor device, a second metal plate connecting to the second conductive post, a third conductive post for electrically connecting to the third electrode of the semiconductor device, and a third metal plate connecting to the third conductive post.

Abstract translation: 电路板包括用于电连接到半导体器件的第一电极的第一导电柱，连接到第一导电柱的第一金属板，用于电连接到半导体器件的第二电极的第二导电柱，第二金属 板，连接到第二导电柱，用于电连接到半导体器件的第三电极的第三导电柱，以及连接到第三导电柱的第三金属板。

公开(公告)号：US08436254B2

公开(公告)日：2013-05-07

申请号：US13301812

申请日：2011-11-22

Applicant: Cheng-Po Yu ,  Han-Pei Huang

Inventor： Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K1/00

CPC classification number: H05K1/11 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Abstract translation: 一种制造电路板结构的方法，包括提供电路板主体，通过封装所述电路板主体的至少一部分来形成具有非板型，立体结构和至少一个刮痕表面的模制的不规则塑料体 并且在所述模制的不规则塑料体上形成第一三维电路图案，从而限定三维电路装置。

公开(公告)号：US20130101871A1

公开(公告)日：2013-04-25

申请号：US13554811

申请日：2012-07-20

Applicant: Bohyun Byun

Inventor： Bohyun Byun

IPC: H05K7/06 ,  H01M2/00

CPC classification number: H01M10/42 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/425 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/09118 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014

Abstract: A protective circuit module includes a printed circuit board; and an electronic device on the printed circuit board, the electronic device including: an integrated circuit chip; at least one electrical component electrically coupled to the integrated circuit chip; and an encapsulating portion, the encapsulating portion encapsulating the integrated circuit chip and a portion of the at least one electrical component, wherein another portion of the at least one electrical component is outside the encapsulating portion.

Abstract translation: 保护电路模块包括印刷电路板; 以及印刷电路板上的电子设备，所述电子设备包括：集成电路芯片; 电耦合到所述集成电路芯片的至少一个电部件; 以及封装部分，所述封装部分封装所述集成电路芯片和所述至少一个电气部件的一部分，其中所述至少一个电气部件的另一部分在所述封装部分的外部。