公开(公告)号：US20080265872A1

公开(公告)日：2008-10-30

申请号：US12108780

申请日：2008-04-24

Applicant: Atsushi Nagashima

Inventor： Atsushi Nagashima

IPC: G01R1/20

CPC classification number: H05K3/3421 ,  G01R1/203 ,  H05K1/111 ,  H05K3/222 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09909 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: An object of the present invention is to provide a wiring substrate capable of accurately detecting a potential difference in a shunt resistor and a current to be detected without being influenced by soldering, and a current detection device. A land mounted with a rectangular surface at each end of a shunt resistor is configured by first and second lands each having a rectangular portion and being arranged at a predetermined interval with a central line as a center, and third and fourth lands each having an area smaller than those of the first and second lands and being arranged at one end of the first and second lands to be connected respectively to the first and second lands. A wiring pattern for detecting a potential difference between the both ends of the shunt resistor is configured by a first wiring pattern connected to the third land and pulled out from the third land towards the fourth land, a second wiring pattern connected to the fourth land and pulled out from the fourth land towards the third land, and third and fourth wiring patterns connected respectively to the first and second wiring patterns and pulled out into one direction.

Abstract translation: 本发明的目的是提供一种能够在不受焊接影响的情况下精确地检测分流电阻器和待检测电流的电位差的布线基板和电流检测装置。 在分流电阻器的每一端安装有矩形表面的焊盘由第一和第二焊盘构成，第一焊盘和第二焊盘均具有矩形部分，并且以中心线为中心以预定间隔布置，并且第三和第四焊盘各自具有面积 小于第一和第二平台的布置在第一和第二平台的一端以分别连接到第一和第二平台。 用于检测分流电阻器的两端之间的电位差的布线图案由连接到第三焊盘并从第三焊盘朝向第四焊盘拉出的第一布线图案，连接到第四焊盘的第二布线图案和 从第四面朝向第三平面拉出，第三和第四布线图案分别连接到第一和第二布线图案并拉出到一个方向。

公开(公告)号：US07436268B2

公开(公告)日：2008-10-14

申请号：US11217658

申请日：2005-08-31

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H03H7/38

CPC classification number: H01R12/58 ,  H01R12/7064 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract translation: 提供了用于连接同轴电缆连接器的信号传输结构。 同轴电缆连接器有一个信号引脚。 信号传输结构包括参考平面和导电层，并且导电层位于参考平面的一侧。 此外，导电层包括信号穿孔垫，第一线段，第二线段和补偿垫。 信号针适用于信号穿孔垫的穿线。 第一线段连接到信号穿孔焊盘，补偿焊盘连接在第一线段和第二线段之间。

公开(公告)号：US20080186687A1

公开(公告)日：2008-08-07

申请号：US11765453

申请日：2007-06-20

Applicant: YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/09

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US20080066955A1

公开(公告)日：2008-03-20

申请号：US11901078

申请日：2007-09-13

Applicant: Takamasa Nodo ,  Haruo Takagi

Inventor： Takamasa Nodo ,  Haruo Takagi

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting structure for a surface mounting electronic component comprises an electronic component a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

Abstract translation: 用于表面安装电子部件的表面安装结构包括电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。

公开(公告)号：US20070297161A1

公开(公告)日：2007-12-27

申请号：US11845990

申请日：2007-08-28

Applicant: Kunio YAMAGUCHI ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

Inventor： Kunio YAMAGUCHI ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

IPC: H05K9/00

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded. Furthermore, there is provided a protective member which has a conductive surface and which is in contact with the surface of said filter, and said conductive surface of said protective member which is in contact with the surface of said filter is set so as to be of the same size as the surface of said filter, or so as to be smaller than it.

Abstract translation: 在包括硅灰石作为其压电元件的SAW滤波器的嵌合区域中，包括连接到SAW滤波器的输入端子和输出端子的输入侧端子电极和输出侧端子电极。 对于每个端子电极，在与SAW滤波器的嵌合区域分开只有预定距离的位置处连接有沿着与传输方向平行的方向在相互相反的方向上延伸的微带线 的SAW滤波器内的频率信号。 在SAW滤波器的装配区域中设置有狭缝，并且在与SAW滤波器内的频率信号的传输方向相交的方向上延伸。 多个通孔设置在印刷基板中，并将其表面及其背面接地电连接在一起。 此外，提供了具有导电表面并与所述过滤器的表面接触的保护构件，并且与所述过滤器的表面接触的所述保护构件的所述导电表面被设定为 与所述过滤器的表面相同的尺寸，或者比其小。

公开(公告)号：US07291788B2

公开(公告)日：2007-11-06

申请号：US11162411

申请日：2005-09-09

Applicant: Jia-Cheng Chen ,  Yi-Chuan Ding

Inventor： Jia-Cheng Chen ,  Yi-Chuan Ding

IPC: H05K1/03

CPC classification number: H05K3/242 ,  H05K3/0044 ,  H05K3/28 ,  H05K2201/09281 ,  H05K2203/0228 ,  H05K2203/175

Abstract: A circuit substrate includes a base and a plurality of conductive traces. The conductive traces are disposed on the base and on the same layer. The conductive traces include at least one first conductive trace. Wherein, the base has a cut region. The end of the first conductive trace is connected to the end portion of the cut region. The included angle between the rim of the end portion of the cut region and the first conductive trace is 75° to 105°.

Abstract translation: 电路基板包括基底和多个导电迹线。 导电迹线设置在基底和同一层上。 导电迹线包括至少一个第一导电迹线。 其中，基地有一个切割区域。 第一导电迹线的端部连接到切割区域的端部。 切割区域的端部边缘与第一导电迹线之间的夹角为75°至105°。

公开(公告)号：US06459049B1

公开(公告)日：2002-10-01

申请号：US09885299

申请日：2001-06-20

Applicant: Leah M. Miller ,  Farshad Ghahghahi ,  Edwin M. Fulcher ,  Aritharan Thurairajaratnam

Inventor： Leah M. Miller ,  Farshad Ghahghahi ,  Edwin M. Fulcher ,  Aritharan Thurairajaratnam

IPC: H01R909

CPC classification number: H05K1/0216 ,  H01R31/06 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09727

Abstract: A structure for receiving electrical signals near a central portion of the structure and distributing the electrical signals to a peripheral portion of the structure. The structure has a first set of contacts arranged in an array near the central portion of the structure. Electrically conductive traces connect the first set of contacts to a second set of contacts, where each of the electrically conductive traces has at least a first segment, a second segment, and a third segment. The first segment of each of the electrically conductive traces has relatively narrow width and spacing. The first segment of each of the electrically conductive traces is connected on a first end of the first segment to one of the first set of contacts and on a second end of the first segment to the second segment of each of the electrically conductive traces. The second segment of each of the electrically conductive traces has relatively intermediate width and spacing. The second segment of each of the electrically conductive traces is connected on a first end of the second segment to the second end of the first segment and on a second end of the second segment to the third segment of each of the electrically conductive traces. The third segment of each of the electrically conductive traces has relatively wide width and spacing. The third segment of each of the electrically conductive traces is connected on a first end of the third segment to the second end of the second segment and on a second end of the third segment to one of the second set of contacts.

Abstract translation: 一种用于在所述结构的中心部分附近接收电信号并将所述电信号分配到所述结构的外围部分的结构。 该结构具有靠近结构的中心部分排列成阵列的第一组触点。 导电迹线将第一组触点连接到第二组触点，其中每个导电迹线具有至少第一段，第二段和第三段。 每个导电迹线的第一段具有相对较窄的宽度和间隔。 每个导电迹线的第一段在第一段的第一端连接到第一组触点中的一个，并且在第一段的第二端连接到每个导电迹线的第二段。 每个导电迹线的第二段具有相对中间的宽度和间隔。 每个导电迹线的第二段在第二段的第一端连接到第一段的第二端，并且在第二段的第二端连接到每个导电迹线的第三段。 每个导电迹线的第三段具有相对宽的宽度和间隔。 每个导电迹线的第三段在第三段的第一端连接到第二段的第二端，并且在第三段的第二端连接到第二组接触中的一个。

公开(公告)号：US06441493B1

公开(公告)日：2002-08-27

申请号：US09955245

申请日：2001-09-17

Applicant: Hyeong-Scob Kim

Inventor： Hyeong-Scob Kim

IPC: H01L2348

CPC classification number: H05K1/114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/09281 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A circuit board and a ball grid array (BGA) package having a solder joint with improved reliability are disclosed. The circuit board has a chip mounting surface in which wiring patterns are formed and a solder ball mounting surface in which a plurality of solder balls are mounted and electrically interconnected to the wiring patterns. The circuit board comprises a plurality of ball lands connected to the solder balls. The circuit board further includes solder ball opening area defined by a solder ball mask on the solder ball mounting surface and exposing the ball land from the solder ball mask, a plurality of pattern connecting portions each connected to corresponding one of the ball lands, and conductive wiring patterns linked together with the pattern connecting portions and electrically interconnected to the solder balls. The plurality of pattern connecting portions are aligned radially inwardly toward substantially a center point of the solder ball mounting surface.

Abstract translation: 公开了具有提高可靠性的焊点的电路板和球栅阵列（BGA）封装。 电路板具有其中形成布线图案的芯片安装表面和安装多个焊球并电连接到布线图案的焊球安装面。 电路板包括连接到焊球的多个球场。 电路板还包括由焊球安装表面上的焊球掩模限定的焊球开口区域，并且将焊球从焊球掩模露出，多个图案连接部分各自连接到对应的一个球场，并且导电 布线图案与图案连接部分连接在一起并电连接到焊球。 多个图案连接部分朝向焊球安装表面的大致中心点径向向内对准。

公开(公告)号：US20020066948A1

公开(公告)日：2002-06-06

申请号：US09955245

申请日：2001-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeong-Scob Kim

IPC: H01L023/02

CPC classification number: H05K1/114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/09281 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A circuit board and a ball grid array (BGA) package having a solder joint with improved reliability are disclosed. The circuit board has a chip mounting surface in which wiring patterns are formed and a solder ball mounting surface in which a plurality of solder balls are mounted and electrically interconnected to the wiring patterns. The circuit board comprises a plurality of ball lands connected to the solder balls. The circuit board further includes solder ball opening area defined by a solder ball mask on the solder ball mounting surface and exposing the ball land from the solder ball mask, a plurality of pattern connecting portions each connected to corresponding one of the ball lands, and conductive wiring patterns linked together with the pattern connecting portions and electrically interconnected to the solder balls. The plurality of pattern connecting portions are aligned radially inwardly toward substantially a center point of the solder ball mounting surface.

公开(公告)号：US20020053466A1

公开(公告)日：2002-05-09

申请号：US09504712

申请日：2000-02-16

Inventor： Masaaki Kusui

IPC: H05K007/06 ,  H01L023/48 ,  H01L023/488

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/17104 ,  H01L2224/26175 ,  H01L2224/81385 ,  H01L2924/12044 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09281 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/163 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A printed-circuit board of the present invention, comprises a circuit substrate 1; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1; a plurality of lands 2, each land 2 connected to at least one of said patterned wires 3 through an end portion 3a thereof; and a protection layer 6 with a plurality of openings 7, covering the surface of said circuit substrate 1, wherein said land 2 and said end portion 3a connected thereto are exposed in the associated opening 7 of said protection layer 6.

Abstract translation: 本发明的印刷电路板包括电路基板1， 形成在所述电路基板1的表面上的多个图案布线3; 多个焊盘2，每个焊盘2通过其端部3a连接到所述图案化焊丝3中的至少一个; 以及保护层6，其具有覆盖所述电路基板1的表面的多个开口7，其中，所述接地区2和与其连接的所述端部3a暴露在所述保护层6的相关开口7中。