公开(公告)号：US09943018B2

公开(公告)日：2018-04-10

申请号：US15045841

申请日：2016-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik Park ,  Seung-Ki Choi ,  Joon Heo ,  Hyun-Ju Hong

IPC: H05K9/00 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K9/002 ,  H01L2224/16225 ,  H05K1/0218 ,  H05K1/0259 ,  H05K5/0004 ,  H05K5/0017 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

公开(公告)号：US20170303389A1

公开(公告)日：2017-10-19

申请号：US15480920

申请日：2017-04-06

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Norikazu MOTOHASHI ,  Tomohiro NISHIYAMA ,  Tadashi SHIMIZU ,  Shinji NISHIZONO

IPC: H05K1/02 ,  H05K1/11 ,  H01F27/42 ,  H05K7/14

CPC classification number: H05K1/0215 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/116 ,  H05K5/0065 ,  H05K9/0039 ,  H05K2201/0723 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2201/10409

Abstract: An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.

公开(公告)号：US20170118834A1

公开(公告)日：2017-04-27

申请号：US15169311

申请日：2016-05-31

Applicant: LG Display Co., Ltd.

Inventor： UnSeung PYUN

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/0259 ,  G02F1/13 ,  G02F1/133617 ,  G02F1/13452 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/10128 ,  H05K2201/10409

Abstract: A PCB underneath the display panel includes a plurality of insulation layers and one or more metal layers disposed between two adjacent insulation layers out of the plurality of insulation layers. A lower structure is disposed between the display panel and the PCB. At least a portion of a metal layer among the one or more metal layers that is most adjacent to the lower structure is exposed, and the lower structure is electrically connected to the exposed portion of the metal layer. Such exposed portion of the metal layer is electrically connected to the lower structure, so that the area where the PCB is referenced to the ground potential is increased. As a result, residual voltage, residual current in the PCB and noise caused by electromagnetic fields generated thereby can be reduced.

公开(公告)号：US09491851B2

公开(公告)日：2016-11-08

申请号：US14339470

申请日：2014-07-24

Applicant: WINTEK CORPORATION

Inventor： Jung-Sung Lin ,  Hsua-Yun Lee ,  Pin-Hao Chi ,  Chih-Yuan Lin ,  Ming-Chuan Lin

IPC: H02H9/00 ,  H05K1/02 ,  H05F3/00 ,  H05F3/02 ,  H01R13/648 ,  H01R12/71 ,  H01R12/70 ,  H01R12/77 ,  H05K1/11

CPC classification number: H05K1/0259 ,  H01R12/7005 ,  H01R12/714 ,  H01R12/775 ,  H01R13/6485 ,  H05F3/00 ,  H05F3/02 ,  H05K1/111 ,  H05K1/113 ,  H05K2201/09354 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/097

Abstract: A connection structure of an electronic device includes a circuit board, a plurality of conductive contact pads and a conductive pattern. The conductive contact pads and the conductive pattern are disposed on the circuit board. The conductive contact pads are electrically insulated from one another. The conductive pattern is electrically insulated from the conductive contact pads. The conductive pattern is disposed on at least three sides of the conductive contact pads so as to generate an electrostatic discharge protection effect for the conductive contact pads.

Abstract translation: 电子设备的连接结构包括电路板，多个导电接触焊盘和导电图案。 导电接触焊盘和导电图案设置在电路板上。 导电接触垫彼此电绝缘。 导电图案与导电接触垫电绝缘。 导电图案设置在导电接触焊盘的至少三个侧面上，以便为导电接触焊盘产生静电放电保护效果。

公开(公告)号：US09433090B2

公开(公告)日：2016-08-30

申请号：US14224863

申请日：2014-03-25

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： Peter Atkinson ,  Chee Fong ,  Mark Casebolt ,  Ying Liang

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0298 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0218 ,  H05K3/403 ,  H05K9/0015 ,  H05K2201/09354

Abstract: An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.

Abstract translation: 边缘电镀印刷电路板（PCB）通过增强PCB上的接地屏蔽并改善PCB和外部EMI抑制组件（包括EMI机箱和垫圈）之间的物理和电气连接来提高辐射发射性能。 多层PCB内部的接地层被配置为物理地延伸到使用铜电镀进行电镀的PCB的边缘，使得设置在PCB的顶表面和底表面处的铜接地条和内部接地层都是 电耦合到电镀边缘。 在一些实施例中，与常规布置相比，接地条可以做得更薄，或者由于边缘电镀PCB和外部EMI屏蔽之间的直接连接而完全消除接地条。

公开(公告)号：US09277649B2

公开(公告)日：2016-03-01

申请号：US13644092

申请日：2012-10-03

Applicant: Jason John Ellison

Inventor： Jason John Ellison

IPC: H05K1/11 ,  H01R12/52 ,  H01R13/6471 ,  H05K1/02

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R13/6471 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09781

Abstract: An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary electrical connector. The printed circuit board includes a ground coupling assembly that electrically connects at least a pair of the ground conductors.

Abstract translation: 电连接器包括印刷电路板，其包括承载限定各个接地焊盘的多个接地导体的本体，以及限定相应的信号接触焊盘的多个信号导体。 接触垫被配置成与互补的电连接器的电触点配合。 印刷电路板包括电连接至少一对接地导体的接地耦合组件。

公开(公告)号：US20150264797A1

公开(公告)日：2015-09-17

申请号：US14445583

申请日：2014-07-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Akihiko HAPPOYA ,  Yuichi SATO ,  Daigo SUZUKI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0222 ,  H01L23/3128 ,  H01L23/552 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/113 ,  H05K2201/0715 ,  H05K2201/09354 ,  H05K2201/09618

Abstract: An electronic apparatus includes a first substrate, an electronic component mounted on a first surface of the first substrate, a plurality of first lands on a second surface of the first substrate that is opposite the first surface, the first lands electrically connected to the electronic component and arranged at a first interval, and a plurality of second lands on the second surface of the first substrate and surrounding the first lands, the second lands arranged at a second interval that is smaller than the first interval.

Abstract translation: 电子设备包括第一基板，安装在第一基板的第一表面上的电子部件，与第一表面相对的第一基板的第二表面上的多个第一焊盘，第一焊盘电连接到电子部件 并且以第一间隔布置，并且在所述第一基板的第二表面上的多个第二平台，并且围绕所述第一平台，所述第二平台以小于所述第一间隔的第二间隔布置。

公开(公告)号：US08487638B2

公开(公告)日：2013-07-16

申请号：US13023012

申请日：2011-02-08

Applicant: Takuya Osaki ,  Masahiro Kondo ,  Koji Sakiyama

Inventor： Takuya Osaki ,  Masahiro Kondo ,  Koji Sakiyama

IPC: G01R27/26

CPC classification number: H03K17/955 ,  H01R12/69 ,  H01R13/6683 ,  H03K2017/9602 ,  H03K2217/94094 ,  H03K2217/960705 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/09318 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10189

Abstract: Disclosed is an electrical capacitance sensor comprising: a board 10 having a one main surface and an other main surface; a sensor electrode 26 formed on the one main surface of the board 10 and detecting an electrical capacitance between the sensor electrode 26 and an object; a first guard electrode 25 formed on the one main surface of the board 10 and in a vicinity of the sensor electrode 26; and a second guard electrode 27 formed on the other main surface of the board 10, wherein a first terminal connecting portion 21 for the first guard electrode 25 and a second terminal connecting portion 23 for the second guard electrode 27 are provided at positions opposing each other.

Abstract translation: 公开了一种电容传感器，包括：板10，其具有一个主表面和另一个主表面; 形成在板10的一个主表面上并检测传感器电极26和物体之间的电容的传感器电极26; 形成在板10的一个主表面上并在传感器电极26附近的第一保护电极25; 以及形成在板10的另一个主表面上的第二保护电极27，其中第一保护电极25的第一端子连接部分21和第二保护电极27的第二端子连接部分23设置在彼此相对的位置 。

公开(公告)号：US20110036618A1

公开(公告)日：2011-02-17

申请号：US12745667

申请日：2008-12-01

Applicant: Kwang Tae Lee ,  Sung Gue Lee ,  Jae Bong Choi

Inventor： Kwang Tae Lee ,  Sung Gue Lee ,  Jae Bong Choi

IPC: H05K1/00 ,  H05K3/10 ,  B23Q41/00

CPC classification number: H05K3/0097 ,  H05K1/0271 ,  H05K3/0052 ,  H05K2201/09354 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0169

Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.

Abstract translation: 公开了一种印刷电路板，包括：绝缘部件，其上限定有第一区域和第二区域;形成在第一区域上的电路图案;以及形成在第二区域上的支撑部件。

公开(公告)号：US07880193B2

公开(公告)日：2011-02-01

申请号：US12617577

申请日：2009-11-12

Applicant: Ken M. Lam

Inventor： Ken M. Lam

IPC: H01L21/50

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09354 ,  H01L2924/00

Abstract: A method and system for fabricating an integral electromagnetic radiation shield for an electronic package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least one ground contact feature to form at least one trench above the at least one ground contact feature; depositing electromagnetic radiation shield material in the at least one trench to substantially fill the at least one trench with a trench deposit; and depositing additional electromagnetic radiation shield material over a substantial portion of the electronic package, wherein the electromagnetic radiation shield material in the trench and over the substantial portion of the electronic package form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.

Abstract translation: 公开了一种用于制造电子封装的集成电磁辐射屏蔽的方法和系统。 各种实施例包括通过去除至少一个接地接触特征之上的电子封装的一部分来暴露电子封装中的至少一个接地接触特征的一部分，以在至少一个接地接触特征之上形成至少一个沟槽; 在所述至少一个沟槽中沉积电磁辐射屏蔽材料以基本上填充所述至少一个具有沟槽沉积物的沟槽; 以及在所述电子封装的主要部分上沉积附加的电磁辐射屏蔽材料，其中所述沟槽中的电磁辐射屏蔽材料和所述电子封装的主要部分上的电磁辐射屏蔽材料形成电气连接到所述至少一个地面的整体电磁辐射屏蔽 联系方式。