公开(公告)号：US20020012096A1

公开(公告)日：2002-01-31

申请号：US09853083

申请日：2001-05-10

Inventor： Kenji Uchiyama

IPC: G02F001/13

CPC classification number: G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/068 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate 6a having terminals 9 thereon is bonded to a wiring board 11 having output terminals 11c thereon through an ACP 20. The pitch P2 of the output terminals 11c is different from the pitch P1 of the terminals 9 taking into account deformation of the substrate 6a or the wiring board 11 during bonding. When the substrate 6a or the wiring board 11 deforms during the bonding, the both terminals are connected with the pitch P1null of the terminals 9 and the pitch P2null of the output terminals 11c becoming approximately equal to each other.

Abstract translation: 其上具有端子9的基板6a通过ACP 20与其上具有输出端子11c的布线板11接合。考虑到基板6a的变形，输出端子11c的间距P2与端子9的间距P1不同 或布线基板11。 当接合时基板6a或布线基板11发生变形时，两端子与端子9的间距P1'和输出端子11c的间距P2'大致相等。

公开(公告)号：US06335222B1

公开(公告)日：2002-01-01

申请号：US09157047

申请日：1998-09-18

Applicant: Thomas H. DiStefano

Inventor： Thomas H. DiStefano

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/742 ,  H01L24/94 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1184 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/18301 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/0248 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/0465 ,  H05K2203/074 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A soldered assembly such as a packaged semiconductor chip includes elongated solder columns connected to the pads on the chip and a dielectric sheet having pads connected to the distal ends of the solder columns remote from the chip. Terminals on the sheet are connected to the pads of the sheet. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

Abstract translation: 诸如封装半导体芯片的焊接组件包括连接到芯片上的焊盘的细长焊料柱和具有连接到远离芯片的焊料柱的远端的焊盘的电介质片。 纸张上的端子连接到纸张的垫。 组件可以使用传统的表面贴装技术进行处理和安装，但提供耐热疲劳性能。 焊料柱可以相对于芯片表面倾斜，并且可以包含沿着柱的纵向轴线优先取向的长的柱状夹杂物。

公开(公告)号：US06330166B1

公开(公告)日：2001-12-11

申请号：US09399166

申请日：1999-09-20

Applicant: Masayuki Aoyama ,  Yasuaki Matsunaga ,  Tomoyuki Hiramatsu ,  Naoyuki Akita ,  Koji Kondo

Inventor： Masayuki Aoyama ,  Yasuaki Matsunaga ,  Tomoyuki Hiramatsu ,  Naoyuki Akita ,  Koji Kondo

IPC: H05K702

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K2201/0394 ,  H05K2201/09427 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively. An outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) extends outward of an outer edge (Y1) of a corresponding first outermost electrode (1b) with respect to the first and second arrays. A distance between an outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) and an outer edge (Y1) of a corresponding first outermost electrode (1b) is greater than a distance between an inner edge (X2, Z2) of the second outermost electrode (3b, 3c) and an inner edge (Y2) of the corresponding first outermost electrode (1b) with respect to the first and second arrays.

Abstract translation: 在电子部件安装结构中，电子部件（2）具有表面。 设置在电子部件（2）的表面上的第一电极（1）以第一阵列布置。 设置在基板（4）上的第二电极（3）以对应于第一阵列的第二阵列布置。 第二电极（3）分别对应于第一电极（1）。 焊接凸块（9）分别连接第一电极（1）和第二电极（3）。 第一电极（1）包括位于第一阵列的外部区域中的第一最外电极（1b）。 第二电极（3）包括位于第二阵列的外部区域中的第二最外电极（3b，3c）。 第二最外电极（3b，3c）分别对应于第一最外电极（1b）。 每个第二最外电极（3b，3c）的外边缘（X1，Z1）相对于第一和第二阵列延伸到对应的第一最外电极（1b）的外边缘（Y1）的外侧。 每个第二最外电极（3b，3c）的外边缘（X1，Z1）与对应的第一最外电极（1b）的外边缘（Y1）之间的距离大于内边缘（X2 ，Z2）和相应的第一最外电极（1b）的内边缘（Y2）相对于第一和第二阵列。

公开(公告)号：US06310403B1

公开(公告)日：2001-10-30

申请号：US09652620

申请日：2000-08-31

Applicant: Chunsheng Zhang ,  Jong-Kai Lin ,  Scott E. Lindsey ,  Yifan Guo ,  Li Li

Inventor： Chunsheng Zhang ,  Jong-Kai Lin ,  Scott E. Lindsey ,  Yifan Guo ,  Li Li

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/13111 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/381 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/09427 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2224/05541 ,  H01L2224/05005

Abstract: A method of manufacturing components includes providing a substrate (110, 531, 631, 700) having a first coefficient of thermal expansion (CTE), having a first surface (111), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (190) having a second CTE, having a second surface (195), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30° C.

Abstract translation: 制造部件的方法包括提供具有第一热膨胀系数（CTE）的衬底（110,531,631,700），其具有第一表面（111），并且支撑位于第一表面上方的第一多个互连 第一预定模式。 该方法还包括提供具有第二CTE的另一衬底（190），其具有第二表面（195），并且以第二预定图案支撑位于第二表面上的第二多个互连。 该方法还包括在大约25至30℃的温度范围之外的第一温度下将两个基板组装在一起。

公开(公告)号：US20010029118A1

公开(公告)日：2001-10-11

申请号：US09821799

申请日：2001-03-30

Inventor： Tsutomu Ota

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K3/363 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/09427

Abstract: In a structure for connecting terminals on wiring boards, lands on a wiring board are respectively connected with lead terminals on another wiring board through solder. Outline of each land has a bump and a recess respectively on edges facing to terminal arranging direction. Meanwhile the lead terminals are rectangular. In plan view, the recess protrudes from an edge of respective lead terminal while protrusions on ends of the recess protrude from another edge of the respective lead terminal. Even when position of the each land to the respective lead terminal deviates not so excessively, the bump and the protrusion protrude from outline of the lead terminal. Thus, on each of such protruding portions, visible fillets of the solder are formed.

Abstract translation: 在用于连接布线板上的端子的结构中，布线板上的焊盘分别通过焊料与另一布线板上的引线端子相连。 每个地面的轮廓分别在面向端子排列方向的边缘上具有凸块和凹槽。 同时引线端子为矩形。 在平面图中，凹部从各个引线端子的边缘突出，而凹部的端部的突起从相应的引线端子的另一个边缘突出。 即使在各引脚端子的位置偏离不大的情况下，突起和突起从引线端子的轮廓突出。 因此，在每个这样的突出部分上形成焊料的可见的焊片。

公开(公告)号：US6143992A

公开(公告)日：2000-11-07

申请号：US160105

申请日：1998-09-24

Applicant: Shingo Sato ,  Seigo Matsuzono ,  Kenshi Nakamura

Inventor： Shingo Sato ,  Seigo Matsuzono ,  Kenshi Nakamura

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/11 ,  H05K3/34 ,  H01R12/04

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/52 ,  H01R12/57 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10734 ,  H05K2203/0465 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board of the invention comprises: an insulating base, which has a semiconductor element mounting portion on an top or bottom side thereof, and on which wiring patterns led out of the semiconductor element mounting portion are installed; and a plurality of substantially circular terminal pads, which are formed on the bottom side of the insulating base, which are connected to the wiring patterns, and to which solder terminals will be joined, wherein each of the terminal pads is provided with a solder lead portion which projects from a center side toward a perimeter side of the insulating base in a diametrical direction of the terminal pad. A part of the solder terminal is pulled out at the solder lead portion, whereby it is possible to prevent a fatigue failure of a joint of the terminal pad and the solder terminal due to a concentration of thermal stress, to electrically connect the solder terminal to the terminal pad in a stable manner for a long time period.

Abstract translation: 本发明的电路板包括：绝缘基座，其顶部或底部具有半导体元件安装部分，并且其上布置有从半导体元件安装部分引出的布线图案; 以及多个基本上圆形的端子焊盘，其形成在绝缘基底的底侧上，其连接到布线图案，并且焊接端子将被接合，其中每个端子焊盘设置有焊料引线 该部分在端子垫的直径方向上从绝缘基体的中心侧朝向周边侧突出。 焊锡端子的一部分在焊锡引线部分被拉出，由此可以防止由于热应力集中而导致端子焊盘和焊接端子的接头的疲劳破坏，从而将焊接端子电连接到 终端板以稳定的方式长时间。

公开(公告)号：US5107078A

公开(公告)日：1992-04-21

申请号：US569397

申请日：1990-08-17

Applicant: Francois Marion ,  Michel Ravetto

Inventor： Francois Marion ,  Michel Ravetto

IPC: H05K1/11 ,  H01H37/76 ,  H01L21/82 ,  H01L23/538 ,  H05K1/00 ,  H05K3/34

CPC classification number: H05K3/3436 ,  H01L23/5382 ,  H01L24/98 ,  H05K1/0293 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0305 ,  H05K2201/09427 ,  H05K2201/10181 ,  H05K2201/10363 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/0545 ,  H05K3/3484 ,  Y02P70/613

Abstract: An electric connection of disconnection element is described as well as the corresponding connection or disconnection method and integrated circuits using such elements.The disconnection element consists of a disk or ingot joining two conductive tracks whose extremities are laid on wettable surfaces. Melting of the disk frees surface tension forces which separate its material into two balls centered on the wettable surfaces.The connection element is formed of two separate disks and, from the wettable surface pads, these disks are disposed opposite each other so that their material, once melted, unites to form a single droplet.A process is also disclosed for using these connection and disconnection elements for repairing defective integrated circuits.

Abstract translation: 描述断开元件的电连接以及使用这些元件的相应的连接或断开方法以及集成电路。 断开元件由连接两个导电轨道的圆盘或锭组成，其四肢铺设在可润湿的表面上。 盘的熔化释放表面张力，将其材料分离成两个以可润湿表面为中心的球。 连接元件由两个分离的盘形成，并且从可湿性表面垫片中，这些盘彼此相对设置，使得它们的材料一旦熔化就结合形成单个液滴。 还公开了使用这些连接和断开元件来修复有缺陷的集成电路的过程。

公开(公告)号：US4127321A

公开(公告)日：1978-11-28

申请号：US718830

申请日：1976-08-30

Applicant: Masaharu Koyama ,  Tadashi Ishibashi ,  Hironari Tanaka

Inventor： Masaharu Koyama ,  Tadashi Ishibashi ,  Hironari Tanaka

IPC: G09F9/00 ,  G02F1/1345 ,  G09F9/30 ,  H05K3/34 ,  G02F1/16 ,  H01L39/02 ,  H05K1/00

CPC classification number: H05K3/3442 ,  G02F1/1345 ,  H05K2201/09427 ,  H05K2201/10136 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The display apparatus comprises a liquid crystal display element, a circuit board and electroconductive members interconnecting them. External terminals are formed on one substrate of the display element and input terminals are formed on the circuit board. The external terminals are electrically and mechanically interconnected by rigid electroconductive members through conductive films.

Abstract translation: 显示装置包括液晶显示元件，电路板和将它们互连的导电元件。 外部端子形成在显示元件的一个基板上，并且在电路板上形成输入端子。 外部端子通过导电膜通过刚性导电构件电气和机械地互连。

公开(公告)号：US12101888B2

公开(公告)日：2024-09-24

申请号：US17770384

申请日：2020-09-07

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Hideo Takahashi ,  Shinichi Takase ,  Hiroki Shimoda ,  Tsutomu Kitajima ,  Yoshiro Adachi ,  Yuuki Oohashi ,  Manabu Sudou

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/189 ,  H05K1/11 ,  H05K2201/09281 ,  H05K2201/09427 ,  H05K2201/10916

Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.

公开(公告)号：US12082340B2

公开(公告)日：2024-09-03

申请号：US17685853

申请日：2022-03-03

Applicant: KIOXIA CORPORATION

Inventor： Yuta Tsubouchi

IPC: H05K1/18 ,  H01L25/065

CPC classification number: H05K1/181 ,  H01L25/0652 ,  H01L25/0655 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: According to one embodiment, a semiconductor device includes receiving terminals on a surface of a substrate to receive first signals and transmitting terminals on the surface of the substrate to transmit second signals. The transmitting terminals are symmetrically positioned on the surface of the substrate with respect to the receiving terminals at a substantially 90 degree rotation about a rotation center position. The ordering of the transmitting terminals along the surface of the substrate from the rotation center position matches the ordering of the receiving terminals along the surface of the substrate from the rotation center position.