公开(公告)号：US3991347A

公开(公告)日：1976-11-09

申请号：US545939

申请日：1975-01-31

Applicant: Robert David Hollyday

Inventor： Robert David Hollyday

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K3/341 ,  H05K1/0243 ,  H05K3/3415 ,  H05K2201/0305 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09572 ,  H05K2201/1006 ,  H05K2201/10659 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  Y02P70/613

Abstract: A method of one step soldering of the outer diameter of a filter sleeve to a printed circuit board while soldering the leads thereto simultaneously as well as the completed filter assembly. The method comprises provided a printed circuit board having an electrically conductive coating on at least the upper surface with a portion of the conductor removed in the regions where leads from the filter to be positioned on the top surface of the printed circuit board are to extend through the printed circuit board for soldering. The printed circuit board includes apertures extending entirely therethrough, not only for the leads from the components positioned on the surface thereof, but also beneath filter sleeves positioned on the printed circuit board. The apertures in the printed circuit board are preferably coated with an electrically conductive material to provide better adherence for the solder during the soldering operation. In the event a conductive ground plane is to be utilized on the upper and lower surfaces of the printed circuit board, it is essential that the apertures beneath the filter sleeves be plated through.

Abstract translation: 将过滤器套筒的外径一步焊接到印刷电路板，同时将引线同时焊接到完整的过滤器组件上的方法。 该方法包括提供一种印刷电路板，其至少在上表面上具有导电涂层，其中一部分导体在位于印刷电路板的顶表面上的来自过滤器的引线延伸穿过的区域中被去除 用于焊接的印刷电路板。 印刷电路板包括完全贯穿其中的孔，不仅用于来自定位在其表面上的部件的引线，而且位于布置在印刷电路板上的过滤器套筒下方。 印刷电路板中的孔优选地涂覆有导电材料，以在焊接操作期间为焊料提供更好的附着性。 在印刷电路板的上表面和下表面上要使用导电接地平面的情况下，过滤器套筒下方的孔口必须通过电镀。

公开(公告)号：US11864317B2

公开(公告)日：2024-01-02

申请号：US17107953

申请日：2020-12-01

Applicant: NICHIA CORPORATION

Inventor： Masaaki Katsumata ,  Koji Taguchi ,  Norifumi Sasaoka ,  Yosuke Noda

IPC: H01L23/48 ,  H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H01L21/48

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49822 ,  H01L33/62 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/4038 ,  H05K3/4069 ,  H01L2933/0066 ,  H05K1/112 ,  H05K2201/09454 ,  H05K2201/09572 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.

公开(公告)号：US20180270952A1

公开(公告)日：2018-09-20

申请号：US15694962

申请日：2017-09-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiroshi OTA ,  Daigo SUZUKI ,  Yasutomo SAKURAI ,  Hitoshi SAITOU

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/1283 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2201/098 ,  H05K2201/09854 ,  H05K2201/10303

Abstract: A module includes a substrate, a first wiring, a second wiring, and an interlayer connection section. The substrate includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and an inner surface of a hole extending between the first surface and the second surface. The first wiring is provided on the first surface. The second wiring is provided on the second surface. The interlayer connection section includes a first conductor provided on the inner edge, connected to the first wiring and the second wiring, thinner than the first wiring, and thinner than the second wiring, and a second conductor disposed in the hole and electrically connected to the first conductor.

公开(公告)号：US20180007780A1

公开(公告)日：2018-01-04

申请号：US15461861

申请日：2017-03-17

Applicant: NGK INSULATORS, LTD.

Inventor： Hiroshi TAKEBAYASHI ,  Natsuki HIRATA ,  Rishun KIN

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/028 ,  H05K1/0281 ,  H05K1/113 ,  H05K1/116 ,  H05K3/363 ,  H05K3/4038 ,  H05K2201/09027 ,  H05K2201/09572 ,  H05K2201/09909

Abstract: A connection FPC 75 includes a plurality of metal wires 750 between a support layer 751 and a covering layer 752, and an exposed region including contacts 753 serving as end portions of the metal wires 750 is exposed from the covering layer 752. A bending-position guide 760 is provided on the surface of the support layer 751 opposite from the surface on which the metal wires 750 are provided. An edge 760a of the bending-position guide 760 serves as a bending line along which the connection FPC 75 is bent and is disposed in a covering-layer projection area E where the covering layer 752 is projected on the support layer 751. The connection FPC 75 is bent at portions of the metal wires 750 covered with the covering layer 752, that is, at reinforced portions.

公开(公告)号：US20170139160A1

公开(公告)日：2017-05-18

申请号：US15339979

申请日：2016-11-01

Applicant: Oclaro Japan, Inc.

Inventor： Daisuke NOGUCHI ,  Sachiko MIZUSEKI ,  Norimichi SHIBUYA ,  Hiroshi YAMAMOTO

IPC: G02B6/42 ,  G01J1/44

CPC classification number: G02B6/428 ,  G01J1/44 ,  G02B6/4279 ,  G02B6/4283 ,  H05K1/0274 ,  H05K1/115 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09572

Abstract: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.

公开(公告)号：US20170062100A1

公开(公告)日：2017-03-02

申请号：US14833191

申请日：2015-08-24

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kuniaki YOSUI

IPC: H01B13/00 ,  H01B13/06

CPC classification number: H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/115 ,  H05K3/246 ,  H05K3/363 ,  H05K3/4069 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/09181 ,  H05K2201/09527 ,  H05K2201/09572

Abstract: In a method for manufacturing a multilayer substrate, first, a via hole is formed in a first insulating layer and a second insulating layer and filled with conductive paste. Subsequently, the first insulating layer and the second insulating layer are stacked on each other. Next, the conductive paste is cured to form a via conductor while the first insulating layer and the second insulating layer are integrated through thermal pressing. Then, a penetrating hole that penetrates the via conductor in the laminating direction is formed.

Abstract translation: 在多层基板的制造方法中，首先，在第一绝缘层和第二绝缘层中形成通孔，并填充导电性糊料。 随后，第一绝缘层和第二绝缘层彼此堆叠。 接下来，通过热压将第一绝缘层和第二绝缘层一体化，使导电膏固化，形成通路导体。 然后，形成在层叠方向上贯通通孔导体的贯通孔。

公开(公告)号：US20150325543A1

公开(公告)日：2015-11-12

申请号：US14275514

申请日：2014-05-12

Applicant: Invensas Corporation

Inventor： Rajesh KATKAR ,  Cyprian Emeka UZOH

IPC: H01L23/00 ,  B23K26/32 ,  H05K1/14 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01L24/14 ,  B23K1/0016 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/0266 ,  B23K2101/40 ,  H01L21/02225 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0391 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1405 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/115 ,  H05K1/144 ,  H05K3/341 ,  H05K2201/09572 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2224/81 ,  H01L2224/83

Abstract: In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

Abstract translation: 在一些实施例中，为了增加将不同结构与一个或多个焊球连接的焊料连接的高度与间距比，当连接形成在一个结构上时和/或当 连接正在附加到另一个结构。 在一些实施例中，非焊球通过中间焊球（140i）连接。 焊料连接可以被焊料锁定层（1210）包围，并且可以凹陷在该层中的孔（1230）中。 还提供其他功能。

公开(公告)号：US08243468B2

公开(公告)日：2012-08-14

申请号：US11910433

申请日：2006-04-03

Applicant: Christian Val

Inventor： Christian Val

IPC: H01R12/16

CPC classification number: H01L23/4985 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/09663 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electronic module comprising a stack of n packages of predetermined thickness E, which are provided on a lower surface with connection balls of predetermined thickness eb, said connection balls being connected to a printed circuit for interconnecting the package. The printed circuit is placed on the lower surface of the package level with the balls, is drilled with metallized holes, in which the balls are located and to which they are connected, and has a thickness eci less than eb so as to obtain a module with a total thickness not exceeding n (E+10% eb).

Abstract translation: 本发明涉及一种电子模块，其包括具有预定厚度E的n个封装的堆叠，其在具有预定厚度eb的连接球的下表面上提供，所述连接球连接到用于互连封装的印刷电路。 印刷电路被放置在具有滚珠的包装水平的下表面上，钻有金属化的孔，其中滚珠位于其中并且它们被连接，并且具有小于eb的厚度eci以获得模块 总厚度不超过n（E + 10％eb）。

公开(公告)号：US20120176785A1

公开(公告)日：2012-07-12

申请号：US12987212

申请日：2011-01-10

Applicant: Hung-Tsung HSU

Inventor： Hung-Tsung HSU

IPC: F21V29/00

CPC classification number: H05K1/0206 ,  F21K9/27 ,  F21V29/508 ,  F21V29/70 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/4053 ,  H05K2201/09572 ,  H05K2201/10106

Abstract: The invention provides a LED lamp comprising a circuit board and a tube body. The circuit board has a plurality of LED chips and a first heat dissipation body connecting to each LED chip on one surface thereof. Also, the circuit board provides a through hole thereon and has a heat conductor inserting the through hole for connecting the first heat dissipation body to a second heat dissipation body on the other surface. The tube body has a hollow casing for seal packing the circuit board. The LED lamp of the invention has a heat dissipation body with large surface area and seal packing the circuit board in the tube body made of high heat conducting plastics so that it may have effect of heat dissipation and prevent from moisture and dust.

Abstract translation: 本发明提供了一种包括电路板和管体的LED灯。 电路板具有多个LED芯片和连接到其一个表面上的每个LED芯片的第一散热体。 此外，电路板在其上提供通孔，并且具有插入用于将第一散热体连接到另一表面上的第二散热体的通孔的导热体。 管体具有用于密封电路板的中空壳体。 本发明的LED灯具有具有大表面积的散热体，并将电路板密封在由高导热塑料制成的管体中，使其具有散热效果，防止湿气和灰尘。

公开(公告)号：US08218333B2

公开(公告)日：2012-07-10

申请号：US12401247

申请日：2009-03-10

Applicant: Masato Udaka ,  Seiji Tokii

Inventor： Masato Udaka ,  Seiji Tokii

IPC: H05K1/18

CPC classification number: H05K3/3436 ,  H01R12/523 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09572 ,  Y02P70/613 ,  Y10T29/49213

Abstract: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

Abstract translation: 本发明提供了一种印刷电路板，其能够在安装表面安装装置时足以确保接合强度和接头可靠性，以及使用印刷电路板的表面安装装置的安装结构。 作为表面安装器件的BGA封装包括布置在其上的多个焊球，并且印刷电路板包括分别对应于多个焊球的多个安装焊盘。 BGA封装由于焊球的熔化而连接到印刷电路板上的安装焊盘，从而安装在印刷电路板上。 在具有圆形表面形状的每个安装焊盘上形成凹通孔，并且焊球的一部分在凸通孔中。 这里，凸通孔的中心至少与凹通孔的直径相距离每个安装焊盘的中心。