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    Base of surface-mount electronic component package, and surface-mount electronic component package
    42.
    发明授权
    Base of surface-mount electronic component package, and surface-mount electronic component package 有权
    表面贴装电子元件封装的基座和表面贴装电子元器件封装

    公开(公告)号：US08796558B2

    公开(公告)日：2014-08-05

    申请号：US13497831

    申请日：2011-03-24

    Applicant: Minoru Iizuka ,  Yuka Kojo

    Inventor： Minoru Iizuka ,  Yuka Kojo

    IPC: H05K5/00

    CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

    Abstract translation: 表面安装电子部件封装的基座保持电子元件，并且将被安装在具有导电接合材料的电路板上。 基座具有主电路表面和与电路板电连接的外部连接端子。 外部连接端子形成在主面上。 底座包括形成在外部连接端子上的凸块。 凸块小于外部连接端子。 底座在外部连接端子的应力的衰减方向上具有外部连接端子的外周端边缘与突起的外周端边缘之间的距离d。 电路板。 距离d大于0.00mm且等于或小于0.45mm。

    ELECTRONIC COMPONENT PACKAGE AND BASE OF THE SAME
    43.
    发明申请
    ELECTRONIC COMPONENT PACKAGE AND BASE OF THE SAME 有权
    电子组件包装及其相同的基础

    公开(公告)号：US20120152585A1

    公开(公告)日：2012-06-21

    申请号：US13392540

    申请日：2011-03-11

    Applicant: Yoshiki Maeda ,  Tsuyoshi Kusai

    Inventor： Yoshiki Maeda ,  Tsuyoshi Kusai

    IPC: H05K5/06 ,  H05K1/11

    CPC classification number: H03H9/1021 ,  H01L23/053 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/10068 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.

    Abstract translation: 电子部件组件的基座保持电子部件元件。 底座在平面图中具有矩形形状的底面。 底座包括在底面上具有矩形形状的一对端子电极。 该一对端子电极用导电接合材料接合在外部电路基板上。 该对端子电极具有相互对称的形状。 每个端子电极具有与底面的长边相邻或在其长边的边缘上的长边。 每个端子电极的长边平行于底面的长边设置。 每个端子电极的长边长度大于底面长边长度的一半。

    Crystal oscillator device and electronic apparatus using the same
    46.
    发明授权
    Crystal oscillator device and electronic apparatus using the same 有权
    晶体振荡器及使用其的电子设备

    公开(公告)号：US07142065B2

    公开(公告)日：2006-11-28

    申请号：US10725131

    申请日：2003-12-01

    Applicant: Akira Kato

    Inventor： Akira Kato

    IPC: H03B5/32

    CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10068 ,  H05K2201/10515 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: A crystal oscillator device includes a resonator having a plate-shaped resonator package and a plate-shaped circuit board having at least an oscillator circuit. The resonator package is supported above the circuit board such that the resonator package is substantially parallel to the circuit board, and supporting members which support the resonator package are arranged on a straight line on the bottom surface of the resonator package, the straight line being parallel to and near one of the sides of the bottom surface of the resonator package.

    Abstract translation: 晶体振荡器装置包括具有板状谐振器封装的谐振器和至少具有振荡电路的板状电路板。 谐振器封装被支撑在电路板上方，使得谐振器封装基本上平行于电路板，并且支撑谐振器封装的支撑构件布置在谐振器封装的底表面上的直线上，该直线是平行的 到谐振器封装的底表面的一个侧面附近。

    Constant temperature type crystal oscillator
    47.
    发明申请
    Constant temperature type crystal oscillator 失效

    公开(公告)号：US20050258913A1

    公开(公告)日：2005-11-24

    申请号：US11129959

    申请日：2005-05-16

    Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

    Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

    IPC: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/02 ,  H05K3/30 ,  H03B1/00

    CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

    Abstract: The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate. As a result, a lead wire led-out type crystal oscillator of constant temperature type for high stability wherein the structure is simplified, and in particular the height dimension is reduced can be provided. Moreover, the present invention is a constant temperature type surface mounting type crystal oscillator which uses a crystal resonator for surface mounting which is mounted on the circuit board together with the oscillating elements and temperature control elements, and is constructed such that the crystal resonator is arranged on a ceramic substrate, and at least a chip resistor for heat generation and a highly temperature-dependent highly heat sensitive element are arranged on the ceramic substrate. The structure is such that the crystal resonator is arranged on one principal plane of the ceramic substrate, and the chip resistor and the temperature sensitive element are arranged on the other principal plane of the ceramic substrate, and the other principal plane of the ceramic substrate is positioned facing one principal plane of the circuit board, and heat conductive resin is interposed between the chip resistor and the circuit board. A surface mounted crystal oscillator of constant temperature type in which miniaturization is advanced, and the structure is simplified, is provided.

    Surface mounting package
    48.
    发明申请
    Surface mounting package 失效
    表面安装包装

    公开(公告)号：US20040173371A1

    公开(公告)日：2004-09-09

    申请号：US10486849

    申请日：2004-02-12

    Inventor： Daisuke Fukushima

    IPC: H05K005/06

    CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

    Abstract: A surface mounting package includes a metal base (1) with a lower surface having a through hole, a metal lead (2) arranged to be inserted into the through hole, an insulating material (3) filling in an internal space defined by the metal base (1), a cap (30) covering the metal base (1) as a lid, and an electronic part component arranged at a surface (2i) on the internal space side of the metal lead (2). The internal space is held at an air-tight atmosphere. The metal base (1) has a lower surface positioned on the same plane as a lower surface of the metal lead (2) or the insulating material (3), the same plane (P) forming a plane to be attached to a mounting board.

    Abstract translation: 表面安装封装包括具有通孔的下表面的金属基底（1），布置成插入通孔的金属引线（2），填充在由金属限定的内部空间中的绝缘材料（3） 基部（1），覆盖作为盖的金属基座（1）的盖（30）和布置在金属引线（2）的内部空间侧的表面（2i）的电子部件部件。 内部空间保持在气密的气氛中。 金属基体（1）具有位于与金属引线（2）或绝缘材料（3）的下表面相同的平面上的下表面，形成要附接到安装板的平面的相同平面（P） 。

    Automated dielectric resonator placement and attachment method and apparatus
    50.
    发明申请
    Automated dielectric resonator placement and attachment method and apparatus 审中-公开
    自动介质谐振器的放置和安装方法及装置

    公开(公告)号：US20040021535A1

    公开(公告)日：2004-02-05

    申请号：US10209709

    申请日：2002-07-31

    Inventor： Kenneth Buer ,  Ramanamurthy V. Darapu ,  John Decamp ,  Deborah Dendy ,  Phillip Denisuk ,  Noel Lopez ,  Edwin Stanfield

    IPC: H01P007/10

    CPC classification number: H05K1/0243 ,  H01P1/20309 ,  H01P7/10 ,  H05K3/341 ,  H05K2201/10068 ,  H05K2201/2036

    Abstract: A method for affixing a resonator to a printed circuit board is provided. The method uses a thin metal film which may be affixed to a surface of a stand off, or directly to a surface of a resonator. The metalized surface may be affixed to a printed circuit board using a molten agent with a surface tension which withstands the downward force exerted by the puck's weight. The metalized surface may be affixed to a printed circuit board using a solder paste and the solder is allowed to reflow. The surface tension of the molten solder causes the resonator (or resonator puck) to self-center, ensuring proper placement and eliminating the need for repositioning. Since the resonator is not positioned using traditional glues which are subject to shifting during transportation or curing, then the resonator is not subject to shifting, eliminating the need to reposition the resonator after the resonator becomes fixed.

    Abstract translation: 提供了一种将谐振器固定在印刷电路板上的方法。 该方法使用可以固定在支架表面上或直接连接到谐振器表面的薄金属膜。 金属化表面可以使用具有表面张力的熔化剂固定到印刷电路板上，该表面张力可承受由游击盘重量施加的向下的力。 金属化表面可以使用焊膏固定到印刷电路板上，并允许焊料回流。 熔融焊料的表面张力导致谐振器（或谐振器圆盘）自我中心，确保正确放置，并消除对重新定位的需要。 由于谐振器不是使用在运输或固化期间经受移动的传统胶水定位，所以谐振器不会发生偏移，从而消除了在谐振器固定之后重新定位谐振器的需要。

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