公开(公告)号：US08014159B2

公开(公告)日：2011-09-06

申请号：US12429915

申请日：2009-04-24

Applicant: Drew G. Doblar ,  Gurpreet S. Dayal

Inventor： Drew G. Doblar ,  Gurpreet S. Dayal

IPC: H05K5/00

CPC classification number: H05K7/1454 ,  H05K1/0271 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/2009 ,  H05K2203/167

Abstract: A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.

Abstract translation: 提供了一种安装平面组件（例如背板或中平面），用于互连服务器计算机中的多个子板。 安装平面组件包括印刷电路板（“PCB”），该印刷电路板具有多个共用的安装孔，用于将连接器对准销连接到PCB的正面以及通过其连接到PCB背面的机械支撑元件 安装孔。

公开(公告)号：US20110192641A1

公开(公告)日：2011-08-11

申请号：US13123814

申请日：2009-12-22

Applicant: Hideki Goto

Inventor： Hideki Goto

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/306 ,  H01R12/7082 ,  H01R12/91 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10537 ,  Y10T29/49149

Abstract: A mounting board having a plurality of terminals. The ends of each of the plurality of terminals are inserted into and soldered to through-holes positioned in a printed board, and the terminals are mounted on the printed board. A plurality of pedestals are disposed on one side of the printed board. The pedestals support the terminals. The pedestals are integrally coupled to one another through deformable coupling portions. Mutual displacements among the pedestals are allowed by the coupling portions.

Abstract translation: 具有多个端子的安装板。 将多个端子中的每一个的端部插入并焊接到位于印刷电路板中的通孔中，并将端子安装在印刷电路板上。 多个基座设置在印刷电路板的一侧。 支架支撑端子。 基座通过可变形的联接部分彼此一体地联接。 通过联接部允许基座之间的相互位移。

公开(公告)号：US20110134597A1

公开(公告)日：2011-06-09

申请号：US12630677

申请日：2009-12-03

Applicant: Mark E. Andresen ,  Virginia Ott

Inventor： Mark E. Andresen ,  Virginia Ott

IPC: H05K1/18 ,  G06F1/16 ,  H01R9/00

CPC classification number: H05K3/308 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2201/10871 ,  H05K2203/0207 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Abstract translation: 一种印刷电路板和制造具有一个或多个孔的印刷电路板的方法，所述孔被可控制地钻出以延伸到印刷电路板基板中到第一和第二面之间的预定深度。 机械定位销被接收到一个或多个孔中的每一个中，以机械对准用于与印刷电路板基板电子接口的第一部件。 第二部件安装在与一个或多个孔直接相对的第二面上，使得第二部件与形成在与孔直接相对的第二面上的导电迹线或互连电子连通。

公开(公告)号：US20110110059A1

公开(公告)日：2011-05-12

申请号：US13004327

申请日：2011-01-11

Applicant: Zdenko GRAJCAR

Inventor： Zdenko GRAJCAR

IPC: H01R9/00 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K7/205 ,  H05K2201/10106 ,  H05K2201/10303 ,  H01L2924/00014

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad.

Abstract translation: 公开了一种可以包括印刷电路板（PCB）的装置，并且可以围绕PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。 金属层可以设置在芯部第一表面上。 金属层可以包括适于限定迹线的金属或其它导电材料，其可以是固定到PCB的电子部件的电路路径。 在一些方面，芯可以是非导电的，并且可以是绝热的，并且因此抑制来自电子封装件的热量通过PCB传递。 然而，引脚可以被配置为将包括芯的PCB从芯第一表面通过到芯第二表面，以传导由电子封装件产生的热量用于分散。 在一些实施例中，销可以进入背板。 在一些实施例中，焊盘可以设置在电子封装和芯之间，引脚穿过焊盘。

公开(公告)号：US07888173B2

公开(公告)日：2011-02-15

申请号：US12382412

申请日：2009-03-12

Applicant: Harutaka Taniguchi ,  Yoshinari Ikeda

Inventor： Harutaka Taniguchi ,  Yoshinari Ikeda

IPC: H01L21/00

CPC classification number: H05K3/34 ,  H01L23/5385 ,  H01L24/01 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/157 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/145 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K2203/0405 ,  H01L2924/00 ,  H01L2924/07025 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01028

Abstract: A semiconductor device manufacturing method includes the steps of preparing a semiconductor element having a first electrode, a second electrode, and a third electrode facing the first electrode and second electrode, the first electrode and second electrode being electrically separated by an insulating layer; arranging a first conductive bonding material on a first metal foil and placing the semiconductor element on the first conductive bonding material; supporting a sheet-shape second conductive bonding material by the insulating layer; arranging a first post electrode and a second post electrode above the first and second electrodes respectively with the second conductive bonding material intervening therebetween; and forming a first conductive bonding layer for bonding the first electrode and the first post electrode, a second conductive bonding layer for bonding the second electrode and the second post electrode, and a third conductive bonding layer for bonding the third electrode and the first metal foil.

Abstract translation: 半导体器件制造方法包括以下步骤：制备具有第一电极，第二电极和与第一电极和第二电极相对的第三电极的半导体元件，第一电极和第二电极通过绝缘层电隔离; 在第一金属箔上布置第一导电接合材料并将半导体元件放置在第一导电接合材料上; 通过绝缘层支撑片状第二导电接合材料; 在所述第一和第二电极上方分别设置第一电极和第二电极，所述第二电极和第二电极分别与所述第二电极和所述第二电极之间插入所述第二电极和第二电极。 以及形成用于接合所述第一电极和所述第一电极的第一导电接合层，用于接合所述第二电极和所述第二电极的第二导电接合层，以及用于接合所述第三电极和所述第一金属箔的第三导电接合层 。

公开(公告)号：US07875811B2

公开(公告)日：2011-01-25

申请号：US12010335

申请日：2008-01-24

Applicant: David V. Caletka ,  Frank D. Egitto

Inventor： David V. Caletka ,  Frank D. Egitto

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0219 ,  H01R12/523 ,  H01R13/2414 ,  H05K1/113 ,  H05K3/4046 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0959 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/10378 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.

Abstract translation: 高速插入器，其包括具有交替取向的介电层和导电层的基板，其形成基板，从基板的一个相对表面延伸到第二相对表面的开口，定位在开口内并且还从表面延伸到表面的导电构件 并且在一些实施例中超越）以及基本上围绕导电构件定位的多个屏蔽构件，从而在高频信号通过导电构件期间提供屏蔽。

公开(公告)号：US20100294544A1

公开(公告)日：2010-11-25

申请号：US11989679

申请日：2006-07-28

Applicant: Atsushi Momota ,  Ichiro Terunuma ,  Takeshi Hasegawa ,  Yasuo Takemura ,  Yoshifumi Hatakeyama ,  Hiroshi Harada ,  Makoto Katoh

Inventor： Atsushi Momota ,  Ichiro Terunuma ,  Takeshi Hasegawa ,  Yasuo Takemura ,  Yoshifumi Hatakeyama ,  Hiroshi Harada ,  Makoto Katoh

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/036 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/10303 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.

Abstract translation: 本发明提供一种能够容易地实现电气部件的安装的弯曲型刚性印刷电路板（能够实现具有高生产率和组装性能的电镀电路），可以实现节省空间，并且可以实现容易的制造。 弯曲型刚性印刷线路板包括具有插入其中的空间部分（1A）的硬固化材料（1）。 在该硬质材料（1）的表面上叠层耐热树脂层（31），同时在该空间部（1A）的上表面上层叠耐热树脂层。 除了空间部分（1A）之外，在芯材（1）的背面上堆叠耐热树脂层（32）。 此外，导体层（4）通过耐热树脂层（31,32）堆叠并固定。 导体层（4）已被蚀刻以形成电路。

公开(公告)号：US07790985B2

公开(公告)日：2010-09-07

申请号：US12136308

申请日：2008-06-10

Applicant: Joseph P. Palmeri ,  Vincent P. Mulligan

Inventor： Joseph P. Palmeri ,  Vincent P. Mulligan

IPC: H05K1/00

CPC classification number: H05K3/225 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/0242 ,  Y10T29/49174 ,  Y10T29/49179

Abstract: Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

Abstract translation: 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和肩部，其连接杆和头部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。

公开(公告)号：US07679923B2

公开(公告)日：2010-03-16

申请号：US11550527

申请日：2006-10-18

Applicant: Tatsuya Inagaki ,  Toshio Kohno

Inventor： Tatsuya Inagaki ,  Toshio Kohno

IPC: H05K7/00

CPC classification number: H05K3/284 ,  H05K1/144 ,  H05K3/3447 ,  H05K5/0043 ,  H05K5/061 ,  H05K5/064 ,  H05K2201/10303 ,  Y10T29/49192

Abstract: A method for easily applying a coating agent to an electronic circuit board accommodated in a housing without leaving uncoated portions. The method includes mounting the electronic circuit board to the housing, performing an electrical connection process in the electronic circuit board, and filling the housing with the coating agent (anti-moisture agent) to immerse the electronic circuit board in the coating agent.

Abstract translation: 一种容易地将涂布剂涂覆在容纳在壳体中的电子电路板上而不留下未涂覆部分的方法。 该方法包括将电子电路板安装到壳体上，在电子电路板中进行电连接处理，并用涂覆剂（防潮剂）填充壳体以将电子电路板浸入涂覆剂中。

公开(公告)号：US20100029103A1

公开(公告)日：2010-02-04

申请号：US12182819

申请日：2008-07-30

Applicant: Brian Patrick Costello

Inventor： Brian Patrick Costello

IPC: H01R13/10

CPC classification number: H05K13/0015 ,  H05K3/306 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: A fixture is provided for installing a guide pin to a substrate. The fixture includes an elongate body extending a length along a longitudinal axis between a mounting end portion and a receiving end portion. The mounting end portion is configured to be mounted on a support member. An opening extends into the body through the receiving end portion of the body and along the longitudinal axis. The opening is configured to receive at least a portion of the guide pin therein.

Abstract translation: 提供了一种用于将引导销安装到基板上的夹具。 该固定装置包括细长主体，其在安装端部与接收端部之间沿着纵向轴线延伸长度。 安装端部构造成安装在支撑构件上。 开口通过主体的接收端部并且沿着纵向轴线延伸进入主体。 开口构造成在其中容纳至少一部分引导销。