公开(公告)号：US20100319977A1

公开(公告)日：2010-12-23

申请号：US12744054

申请日：2008-12-05

Applicant: Mitja Rateiczak ,  Bernhard Reul ,  Cornelia Retsch

Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Cornelia Retsch

IPC: H01R4/02 ,  H05K1/11

CPC classification number: H05K3/32 ,  H01R4/02 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0306 ,  H05K3/3421 ,  H05K2201/0979 ,  H05K2201/1031 ,  H05K2201/10962 ,  Y02P70/611

Abstract: In a solder connection element (1), which is intended in particular for soldering onto a brittle substrate such as a window pane, for connecting an electrical component, which solder connection element has a body (2) provided for connecting purposes and at least two solder feet (3) protruding therefrom, a respective elastically deformable connecting part which is suitable for accommodating differences in thermal expansion extending between the body and the solder feet, more than two solder feet (3) are provided according to the invention for soldering onto a surface, wherein differences in thermal expansion and effects of mechanical forces from the component to be connected can be accommodated in at least two coordinate directions parallel to the substrate surface by way of resilience of the solder feet (3) and/or the connecting parts relative to the body (2) and/or the solder connection element (1). The body (2) itself can also be configured so as to be resilient by way of incisions (6) and/or equipped with a plug-in lug (5).

Abstract translation: 在焊接连接元件（1）中，其特别地用于焊接到诸如窗玻璃的脆性基板上，用于连接电气部件，该焊料连接元件具有用于连接目的的主体（2）和至少两个 从其突出的焊脚（3），相应的可弹性变形的连接部分，其适于适应在主体和焊脚之间延伸的热膨胀差异，根据本发明提供了多于两个焊脚（3），用于焊接到 表面，其中热膨胀的差异和来自待连接部件的机械力的影响可以通过焊脚（3）和/或连接部件相对的弹性而平行于基板表面的至少两个坐标方向被适应 （2）和/或焊料连接元件（1）。 本体（2）本身也可以被配置为通过切口（6）和/或配备有插入式凸耳（5）而具有弹性。

公开(公告)号：US20100254109A1

公开(公告)日：2010-10-07

申请号：US12727706

申请日：2010-03-19

Applicant: Mikio Nakamura ,  Takanori Sekido

Inventor： Mikio Nakamura ,  Takanori Sekido

IPC: H05K1/14 ,  H01R43/20 ,  H01R12/04

CPC classification number: H01R43/00 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  H05K2201/10962 ,  H05K2201/10977 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49208

Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.

Abstract translation: 安装组件包括其中安装部件安装在构件的至少一个主面上并且形成构件连接电极的构件; 以及连接构件，其具有以使得所述平行部的长度方向平行于所述构件的主面的方式配置的柱状平行部，所述平行部的一端侧与所述构件连接电极连接。

公开(公告)号：US07714598B2

公开(公告)日：2010-05-11

申请号：US12054289

申请日：2008-03-24

Applicant: Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

Inventor： Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

IPC: G01R31/02 ,  G01R31/26

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US20100084760A1

公开(公告)日：2010-04-08

申请号：US12536331

申请日：2009-08-05

Applicant: Kazuaki ONISHI

Inventor： Kazuaki ONISHI

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H05K1/144 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3421 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10424 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor chip mounting substrate, a control circuit board, a power terminal holder and a semi-fixing member. The semiconductor chip mounting substrate includes a substrate, a semiconductor chip provided on a first major surface of the substrate, and a first and second semiconductor chip connection electrodes. The control circuit board is provided generally in parallel to the first major surface and includes a control circuit, a control signal terminal connected to the control circuit, and a through hole extending in a direction generally perpendicular to the first major surface. The power terminal holder is provided on opposite side of the control circuit board from the semiconductor chip mounting substrate and includes a power terminal. The semi-fixing member includes a shank portion and an end portion. The shank portion is fixed to the power terminal holder and penetrates through the through hole. A cross section of the shank portion in a plane orthogonal to the extending direction of the through hole is smaller than a size of the through hole. The end portion is connected to a tip of the shank portion. A cross section of the end portion in the plane is larger than the size of the through hole. The first semiconductor chip connection electrode is connected to a first terminal of the semiconductor chip and the control signal terminal. The second semiconductor chip connection electrode is connected to a second terminal of the semiconductor chip and the power terminal.

Abstract translation: 半导体器件包括：半导体芯片安装基板，控制电路板，电源端子保持器和半固定部件。 半导体芯片安装基板包括基板，设置在基板的第一主表面上的半导体芯片以及第一和第二半导体芯片连接电极。 控制电路板大致平行于第一主表面设置，并且包括控制电路，连接到控制电路的控制信号端子以及沿大致垂直于第一主表面的方向延伸的通孔。 电源端子保持器设置在控制电路板的与半导体芯片安装基板相对的一侧，并且包括电源端子。 半固定构件包括柄部和端部。 柄部分固定在电源端子支架上并穿过通孔。 在与通孔的延伸方向正交的平面中的柄部的横截面小于通孔的尺寸。 端部连接到柄部的尖端。 平面中的端部的横截面大于通孔的尺寸。 第一半导体芯片连接电极连接到半导体芯片的第一端子和控制信号端子。 第二半导体芯片连接电极连接到半导体芯片的第二端子和电源端子。

公开(公告)号：US20090291573A1

公开(公告)日：2009-11-26

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调整范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

公开(公告)号：US20090225526A1

公开(公告)日：2009-09-10

申请号：US12195928

申请日：2008-08-21

Applicant: Arash BEHZIZ

Inventor： Arash BEHZIZ

IPC: H05K7/06 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0243 ,  H01R9/0515 ,  H01R43/0221 ,  H01R43/205 ,  H05K3/301 ,  H05K3/328 ,  H05K3/3421 ,  H05K2201/09809 ,  H05K2201/1031 ,  H05K2201/10356 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Methods and apparatus are provided for securely and cost effectively attaching one or more shielded cables to a planar substrate. A cable assembly includes a printed circuit board (PCB) coupled to a distal end of the one or more shielded cables. Perpendicular alignment of the distal cable ends promotes a dense array that is achieved using angular mounting brackets for coupling cable shields to electrical contacts on an engagement surface of the PCB. Mounting brackets are attached between the cable shield and shield contacts using electrically conductive attachment techniques including soldering and laser welding. The PCB also includes one or more signal contacts for each cable. Distal ends of the internal conductors are each bent about 90 degrees from the vertical cable axis to align with the horizontal engagement surface. Internal conductors are surface mounted to their respective signal contact using one or more of soldering and laser welding.

Abstract translation: 提供了方法和装置，用于将一个或多个屏蔽电缆安全且成本有效地连接到平面基板。 电缆组件包括耦合到一个或多个屏蔽电缆的远端的印刷电路板（PCB）。 远端电缆端部的垂直对准促进了使用角度安装支架实现的密集阵列，用于将电缆屏蔽件耦合到PCB接合表面上的电触点。 使用导电附件技术（包括焊接和激光焊接）将安装支架连接在电缆屏蔽和屏蔽触点之间。 PCB还包括每个电缆的一个或多个信号触点。 内部导体的末端各自从垂直电缆轴线弯曲约90度，以与水平接合表面对准。 使用焊接和激光焊接中的一个或多个将内部导体表面安装到它们各自的信号触点。

公开(公告)号：US07579269B2

公开(公告)日：2009-08-25

申请号：US10821715

申请日：2004-04-08

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

IPC: H01L21/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01H1/0036 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/45099 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。 每个弹簧接触元件具有基端，接触端和中心主体部分。 接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。 以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。 在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

公开(公告)号：US07564337B2

公开(公告)日：2009-07-21

申请号：US11072553

申请日：2005-03-03

Applicant: Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

Inventor： Stephen J. Whitney ,  Gordon T. Dietsch ,  Vincent Minh-Tu Tran

IPC: H01H85/143 ,  H01H85/48

CPC classification number: H05K3/301 ,  H01H85/0418 ,  H01H85/202 ,  H01H2085/0414 ,  H01H2085/2085 ,  H05K3/3426 ,  H05K2201/062 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Abstract translation: 在本发明的一个方面，通过连接到保险丝端盖的夹子将超小型保险丝焊接到PCB。 夹子物理连接到PCB焊盘，使熔断器可以更换，如果需要，并提供保险丝和加热焊锡/ PCB焊盘之间的热解耦。 保险丝和夹子也可以被拾取并放置在一个操作中。 在另一方面，提供了改进的熔断器夹，其包括将夹子的壳体部分与加热凹陷焊料/ PCB焊盘分离的突片。 这种改进的夹子进一步增强了热解耦。 在另一方面，提供了一种改进的保险丝，其中刚刚描述的热去耦接头直接与保险丝一起提供。 在另一方面，提供了一种热绝缘熔丝体，以进一步使熔丝元件与其周围环路分离。

公开(公告)号：US20090181562A1

公开(公告)日：2009-07-16

申请号：US12351658

申请日：2009-01-09

Applicant: Jean-Luc CROY ,  Robert ARNOULD ,  Genevieve GRANDJEAN ,  Benoit BOX ,  Jean-Marie BARILLER ,  Herve MATHIEU

Inventor： Jean-Luc CROY ,  Robert ARNOULD ,  Genevieve GRANDJEAN ,  Benoit BOX ,  Jean-Marie BARILLER ,  Herve MATHIEU

IPC: H01R12/00

CPC classification number: H05K3/325 ,  H05K3/301 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10598 ,  H05K2201/10969 ,  Y02P70/611

Abstract: The invention relates to an electronics card (1) comprising a printed circuit board (2) and a piece of equipment (3) such as a motor or a loudspeaker fastened to said printed circuit board (2). The piece of equipment (3) is fastened to a face (4) of the printed circuit board (2) by snap-fastening in metal clips (6, 7) that project from said face (4), each clip (6, 7) having a first end (8, 9) fastened to said face (4) of the printed circuit board (2) by soldering, and a second end (11, 12) bearing resiliently on a corresponding portion of the piece of equipment (3) for holding it pressed against said face (4) of the printed circuit board (2). The invention applies in particular to electronics cards for motor vehicles.

Abstract translation: 本发明涉及一种电子卡（1），其包括印刷电路板（2）和固定到所述印刷电路板（2）上的马达或扬声器等设备（3）。 通过卡扣紧固在从所述面（4）突出的金属夹（6,7）中，将所述设备（3）紧固到所述印刷电路板（2）的表面（4），每个夹子 ）具有通过焊接固定到印刷电路板（2）的所述面（4）的第一端（8,9）和弹性地支承在所述设备（3）的相应部分上的第二端（11,12） ），用于将其按压在印刷电路板（2）的所述面（4）上。 本发明特别适用于机动车辆的电子卡片。

公开(公告)号：US20090057002A1

公开(公告)日：2009-03-05

申请号：US12273094

申请日：2008-11-18

Applicant: Wataru Kakinoki

Inventor： Wataru Kakinoki

IPC: H05K9/00

CPC classification number: H05K9/0035 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/10371 ,  Y02P70/611 ,  Y02P70/613

Abstract: A shield structure having a plurality of hollow columnar base members arranged with intervals therebetween along the periphery of a section to be shielded on a surface of a circuit board, and a shield cover with a peripheral wall having insertion pieces arranged along the edge thereof at positions corresponding to the positions where the base members are arranged. Each base member has a cut in at least a top surface thereof. The cut forms an elastically deformable tongue portion having a free end at a position where the corresponding insertion piece of the shield cover is inserted. The tongue portion is elastically deformed toward the inner space of the base member by an insertion force applied when the corresponding insertion piece of the shield cover is inserted into the cut at the free end. The tongue portion functions as an elastic holding portion that retains and fixes the shield cover on the base member by applying an elastic resilient force such that the free end thereof presses against the insertion piece of the shield cover.

Abstract translation: 一种屏蔽结构，具有多个中空柱状基体部件，沿着要屏蔽在电路板表面上的部分的周边间隔设置，以及具有周壁的屏蔽罩，所述屏蔽罩具有沿其边缘布置的位置 对应于配置基座的位置。 每个基底件至少在其顶表面上具有切口。 切口形成弹性变形的舌部，该舌部在其中插入有屏蔽罩的相应插入件的位置具有自由端。 当将屏蔽罩的相应插入件插入到自由端的切口中时，舌部通过施加的插入力朝向基部构件的内部空间弹性变形。 舌部用作弹性保持部分，其通过施加弹性弹力使得屏蔽盖保持并固定在基部构件上，使得其自由端压靠屏蔽罩的插入件。