公开(公告)号：US07304370B2

公开(公告)日：2007-12-04

申请号：US11034139

申请日：2005-01-13

Applicant: Norihisa Imaizumi ,  Yuuki Sanada ,  Takeshi Ishikawa

Inventor： Norihisa Imaizumi ,  Yuuki Sanada ,  Takeshi Ishikawa

IPC: H01L23/495 ,  H01L23/02

CPC classification number: H01L25/0652 ,  H01L23/49531 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10924 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

Abstract translation: 电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。 第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。 引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

公开(公告)号：US20070171662A1

公开(公告)日：2007-07-26

申请号：US11656525

申请日：2007-01-23

Applicant: Tsukasa Tokida

Inventor： Tsukasa Tokida

IPC: B60Q1/00

CPC classification number: F21V29/74 ,  F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2224/16225 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/328 ,  H05K2201/09172 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1034

Abstract: A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.

Abstract translation: 光源模块包括其上形成有预定导电图案的电路板，安装在电路板上的半导体发光元件和多个供电端子，用于向半导体发光元件供电的电源线为 连接的。 电路板的整个下表面是电绝缘的，并且多个供电端子固定在电路板上的导电图案上。 多个供电端子从电路板突出。

公开(公告)号：US20070161269A1

公开(公告)日：2007-07-12

申请号：US11715392

申请日：2007-03-08

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H05K1/00

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract translation: 电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。 印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。 当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。 因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

公开(公告)号：US20050252948A1

公开(公告)日：2005-11-17

申请号：US10963504

申请日：2004-10-14

Applicant: Atsushi Oohashi

Inventor： Atsushi Oohashi

IPC: H05K7/12 ,  B23K20/00 ,  B23K26/22 ,  B23K31/02 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K26/22 ,  B23K2101/36 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10757 ,  H01L2224/48 ,  H01L2924/00

Abstract: After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.

Abstract translation: 在导线的相应一端固定到印刷电路板上之后，导线弯曲，将印刷电路板带入壳体中，引线的另一端结合到壳体的端子。 由于在基板进入壳体之前处理引线，所以这消除了在引线的弯曲部分的形成和在壳体的狭窄空间内将引线固定到基板上的必要性，并且允许简化 粘接操作。 因此，提供了一种用于将引线与弯曲部分接合到基板的引线接合方法，这简化了接合操作。

公开(公告)号：US20050236178A1

公开(公告)日：2005-10-27

申请号：US10833711

申请日：2004-04-27

Applicant: Philip Lauriello

Inventor： Philip Lauriello

IPC: H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

Abstract: A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Abstract translation: 信号处理模块可以由多个复合衬底层制造，每个衬底层包括多个单独的处理模块的元件。 当衬底层以堆叠布置融合时，这些层的表面被选择性地金属化以形成信号处理元件。 在接合之前，将衬底层研磨以形成位于处理模块之间的区域的间隙。 在接合之前，引线定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层彼此熔合，使得多个衬底层形成具有从模块内部延伸到间隙区域中的引线的信号处理模块。 然后可以通过研磨衬底层来分离各个模块以使模块脱模。

公开(公告)号：US06900529B2

公开(公告)日：2005-05-31

申请号：US10139597

申请日：2002-05-06

Applicant: Kenneth J. Kledzik ,  Jason C. Engle

Inventor： Kenneth J. Kledzik ,  Jason C. Engle

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/50 ,  H01L23/34 ,  H05K7/06

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/1034 ,  H05K2201/10515 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10924 ,  H01L2924/00

Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. Several different variations of the chip module are disclosed.

Abstract translation: 改进的多芯片模块包括主电路板，其具有安装有多个IC封装单元的电互连焊盘阵列。 每个IC封装单元包括一对IC封装，两者均安装在封装载体的相对侧上。 封装单元可以安装在主电路板的一侧或两侧。 本发明的第一个主要实施例采用具有一对主平面的层状包装载体。 每个平面都包含电接触垫。 通过将封装的引线与平坦表面上的接触焊盘相互连接，将一个IC封装表面安装在每个主平面上，形成IC封装单元。 公开了芯片模块的几种不同的变型。

公开(公告)号：US06813163B2

公开(公告)日：2004-11-02

申请号：US10209593

申请日：2002-08-01

Applicant: Keiji Inoue ,  Yosuo Ohashi

Inventor： Keiji Inoue ,  Yosuo Ohashi

IPC: H05K111

CPC classification number: H05K1/144 ,  H05K1/029 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10416 ,  Y10T307/492

Abstract: A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss. Also, it is possible to mount a plurality of converter circuits without increasing the occupied area of a motherboard to be mated therewith in comparison with a case in which the circuit boards are provided side-by-side.

Abstract translation: 多个转换器电路并联连接，同时减少传导损耗。 A转换器电路形成在多个电路板中的每一个上，并且在每个电路板的端部上形成包含电力输入端子连接图案和功率输出端子连接图案的多种类型的端子连接图案，其配置 位置基本上彼此匹配。 每个电路板的相同位置处的端子连接图案被公共端子构件的每个夹子夹持，每个电路板被层压和固定，并且每个电路板的转换器电路并联连接。 用于电连接每个电路板的转换器电路的传导路径变短，使得可以减少传导损耗。 此外，与并排设置电路板的情况相比，可以安装多个转换器电路而不增加与其配合的母板的占用面积。

公开(公告)号：US20040191616A1

公开(公告)日：2004-09-30

申请号：US10810212

申请日：2004-03-26

Applicant: KYOCERA CORPORATION

Inventor： Hiroyuki Hirota

IPC: H01M002/30

CPC classification number: H01M10/425 ,  H01M2/0207 ,  H01M2/30 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10189 ,  H05K2201/1034 ,  H05K2201/10446 ,  H05K2203/1316 ,  Y10T29/49114

Abstract: A battery includes a battery cell having a pair of terminals, a circuit board disposed on a side of the battery cell, a pair of connecting members, one end of each connecting member being attached to a respective end of the circuit board, and the other end of each connecting member being attached to the respective terminal of the battery cell, a connector having a resin path, the connector provided on the circuit board, and a molded resin portion continuously formed via the resin path, covering the circuit board and the connecting members disposed on the battery cell.

Abstract translation: 电池包括具有一对端子的电池单元，设置在电池单元一侧的电路板，一对连接构件，每个连接构件的一端安装在电路板的相应端部，另一端连接到电路板的相应端 每个连接构件的端部附接到电池单元的各个端子，具有树脂路径的连接器，设置在电路板上的连接器以及经由树脂路径连续形成的模制树脂部分，覆盖电路板和连接 放置在电池单元上的构件。

公开(公告)号：US20040113258A1

公开(公告)日：2004-06-17

申请号：US10671592

申请日：2003-09-29

Applicant: Mitsubishi Denki Kabushiki Kaisha

Inventor： Junji Yamada ,  Seiji Saiki

IPC: H01L023/52

CPC classification number: H05K1/111 ,  H01L23/488 ,  H01L23/492 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/38 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2201/1034 ,  Y02P70/611 ,  H01L2924/00

Abstract: An insulating substrate (17) includes a surface conductive layer (25) fixedly laminated on a surface of the plate-like semiconductor body (21) via a surface side fixing member (24, 26). The surface side fixing member (24, 26) includes a first fixing portion (26) for fixing one part (25a) of the surface conductive layer (25) located underneath the joint portion (15) of the electrode terminal (14), and a second fixing portion (24) for fixing the other part (25b) of the surface conductive layer (25) which is not located underneath the joint portion (15), and a fixing strength exhibited by the first fixing portion (26) is smaller than that exhibited by the second fixing portion (24).

Abstract translation: 绝缘基板（17）包括经由表面侧固定部件（24,26）固定层压在板状半导体主体（21）的表面上的表面导电层（25）。 表面侧固定部件（24,26）包括用于固定位于电极端子（14）的接合部分（15）下方的表面导电层（25）的一部分（25a）的第一固定部分（26），以及 用于固定不在接合部（15）下方的表面导电层（25）的另一部分（25b）的第二固定部分（24）和由第一固定部分（26）表现的固定强度较小 比第二固定部分（24）所展现的要好。

公开(公告)号：US06665930B2

公开(公告)日：2003-12-23

申请号：US09261844

申请日：1999-03-03

Applicant: Peter Matuschik

Inventor： Peter Matuschik

IPC: H05K346

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0376 ,  H05K2201/09181 ,  H05K2201/1034 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection elements which can be mounted at minimal cost, the printed circuit board is provided with one or more connection elements for making an electric connection to other electric components. These connection elements are journaled in recesses of the printed circuit board and do not project to the exterior via the surface of the printed circuit board on which the SMD components are secured.

Abstract translation: 具有通过回流焊接工艺将印刷电路板与印刷电路板电连接的印刷电路板。 为了向印刷电路板提供可以以最低成本安装的连接元件，印刷电路板设置有用于与其他电气部件电连接的一个或多个连接元件。 这些连接元件被记录在印刷电路板的凹槽中，并且不经由其上固定SMD部件的印刷电路板的表面突出到外部。