公开(公告)号：US20150034364A1

公开(公告)日：2015-02-05

申请号：US14162769

申请日：2014-01-24

Applicant: Zhen Ding Technology Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

Inventor： MING-JAAN HO ,  XIAN-QIN HU ,  SHAO-HUA WANG ,  FU-YUN SHEN

IPC: H05K1/02

CPC classification number: H05K1/0215 ,  H05K1/0216 ,  H05K1/0393 ,  H05K3/288 ,  H05K2201/0116 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/2009 ,  H05K2203/0221 ,  H05K2203/095 ,  H05K2203/1194

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract translation: FPCB包括柔性基底，形成在基底的顶表面上的布线层，形成在布线层上的覆盖层和形成在覆盖层的一部分上的屏蔽层。 布线层包括接地线。 覆盖层限定了将接地线暴露于外部的开口。 屏蔽层的一部分填充到开口中。 屏蔽层通过开口与接地线电连接。

公开(公告)号：US20140347828A1

公开(公告)日：2014-11-27

申请号：US14059839

申请日：2013-10-22

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shinya Hayashiyama ,  Makoto Tanaka

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2924/15311 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: According to one embodiment, an electronic apparatus includes a substrate with a plurality of conductors, a component with a plurality of first terminals, and a deformation suppressing member attached to the substrate. The first terminals of the component are arranged in a first direction and connected to the conductors. When a certain bending deformation occurs in the substrate, the deformation suppressing member is configured to convert the certain bending deformation into a bending deformation in a direction perpendicular with the first direction.

Abstract translation: 根据一个实施例，电子设备包括具有多个导体的基板，具有多个第一端子的部件和附接到基板的变形抑制部件。 元件的第一端子被布置在第一方向上并连接到导体。 当基板发生一定的弯曲变形时，变形抑制部件被构造成将一定的弯曲变形转换成与第一方向垂直的方向的弯曲变形。

公开(公告)号：US08824150B2

公开(公告)日：2014-09-02

申请号：US13408821

申请日：2012-02-29

Applicant: JungYoul Kang ,  SeongHun Kim

Inventor： JungYoul Kang ,  SeongHun Kim

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H05K1/00 ,  H05K1/18 ,  H01R12/00 ,  H05K1/02 ,  G02F1/133 ,  G02F1/13

CPC classification number: H05K1/0271 ,  G02F1/13 ,  G02F1/133 ,  H05K1/00 ,  H05K1/02 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K2201/0154 ,  H05K2201/058 ,  H05K2201/09681 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/2009

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract translation: 本公开公开了一种用于显示装置的驱动印刷电路板（PCB）。 更具体地，提供了通过防止PCB翘曲来改善接合的驱动印刷电路板。 后表面加强板包括多边形图案，以防止在表面安装技术（SMT）工艺期间由于与板的热收缩不同而导致驱动印刷电路板的PCB翘曲。

公开(公告)号：US20140240932A1

公开(公告)日：2014-08-28

申请号：US13843873

申请日：2013-03-15

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract translation: 提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。 缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。 缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

公开(公告)号：US08794808B2

公开(公告)日：2014-08-05

申请号：US13346481

申请日：2012-01-09

Applicant: Takayuki Otsubo ,  Takashi Matsunaga ,  Noriaki Ito

Inventor： Takayuki Otsubo ,  Takashi Matsunaga ,  Noriaki Ito

IPC: F21V21/00 ,  B60Q1/00

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21S43/14 ,  F21S43/195 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/10106 ,  H05K2201/2009

Abstract: An illumination device including a light emitting element and a lighting control circuit on a metal base flexible printed circuit board (FPC) that is formed by integrating a flexible metal base with a flexible printed circuit board which is formed by integrating a copper foil pattern (conductive body) with films, wherein end portions of the metal base FPC are formed as thick terminal portions so that the end portions are thicker than the metal base FPC.

Abstract translation: 一种照明装置，包括在金属基底柔性印刷电路板（FPC）上的发光元件和照明控制电路，所述柔性印刷电路板通过将柔性金属基底与柔性印刷电路板集成而形成，所述柔性印刷电路板通过将铜箔图案 主体），其中金属基底FPC的端部形成为厚的端子部分，使得端部比金属基底FPC厚。

公开(公告)号：US08785783B2

公开(公告)日：2014-07-22

申请号：US13124710

申请日：2009-10-09

Applicant: Klaus Scharrer ,  Tilo Liebl ,  Matthias Wieczorek ,  Alexander Wenk ,  Juergen Henniger ,  Karl-Heinz Baumann ,  Barbara Haering

Inventor： Klaus Scharrer ,  Tilo Liebl ,  Matthias Wieczorek ,  Alexander Wenk ,  Hans-Juergen Haering ,  Juergen Henniger ,  Karl-Heinz Baumann

IPC: H05K1/03

CPC classification number: H05K3/00 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/10393 ,  H05K2201/2009 ,  H05K2203/0165 ,  H05K2203/0169

Abstract: A protective cover for mounting a flexible printed circuit board in a protected manner, includes a protective unit for covering a surface of the flexible printed circuit board and a connecting unit for securely connecting a reinforcing plate to the protective cover.

Abstract translation: 用于以受保护的方式安装柔性印刷电路板的保护盖包括用于覆盖柔性印刷电路板的表面的保护单元和用于将加强板牢固地连接到保护盖的连接单元。

公开(公告)号：US08766099B2

公开(公告)日：2014-07-01

申请号：US12569871

申请日：2009-09-29

Applicant: Kyle H. Yeates

Inventor： Kyle H. Yeates

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/1461 ,  H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4691 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component may be mounted to a component mounting region using solder balls. The component mounting region may be surrounded on some or all sides by the groove. Flex circuit structures that bridge the groove or a portion of the rigid printed circuit board may be used to hold the component mounting region in place. The flex circuit structures may be provided in the form of separate structures or may be provided as an integral portion of the printed circuit board.

Abstract translation: 敏感电子部件可以安装在电子设备内的印刷电路板上。 为了将敏感元件与在非预期的冲击事件期间可能出现的应力隔离，可以使用印刷电路板中的凹槽来隔离电子部件。 电子部件可以使用焊球安装到部件安装区域。 部件安装区域可以在一些或所有侧面被凹槽包围。 桥接凹槽或刚性印刷电路板的一部分的柔性电路结构可用于将部件安装区域保持在适当位置。 柔性电路结构可以以单独结构的形式提供，或者可以设置为印刷电路板的整体部分。

公开(公告)号：US08705247B2

公开(公告)日：2014-04-22

申请号：US13232135

申请日：2011-09-14

Applicant: Noboru Kato

Inventor： Noboru Kato

IPC: H05K1/18

CPC classification number: H05K1/118 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/4632 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A circuit board includes a laminated body including insulation layers made of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body. Ground conductors are provided in the laminated body and that are harder than the insulation layers. The laminated body includes a flexible region and a rigid region that is adjacent to the flexible region when viewed in plan from a z-axis direction. The rigid region is defined by the ground conductors when viewed in plan from the z-axis direction. The external electrodes are provided within the flexible region when viewed in plan from the z-axis direction.

Abstract translation: 电路板包括层压体，其包括彼此堆叠的由柔性材料制成的绝缘层。 外部电极设置在层叠体的底面上。 接地导体设置在层叠体中，并且比绝缘层更硬。 层压体包括柔性区域和当从z轴方向俯视时与柔性区域相邻的刚性区域。 当从z轴方向俯视时，刚性区域由接地导体限定。 当从z轴方向俯视时，外部电极设置在柔性区域内。

公开(公告)号：US08693202B2

公开(公告)日：2014-04-08

申请号：US13547187

申请日：2012-07-12

Applicant: Kazuyuki Yoshifusa

Inventor： Kazuyuki Yoshifusa

IPC: H05K1/00

CPC classification number: H05K1/118 ,  G06F3/041 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04113 ,  H05K2201/2009

Abstract: A flexible printed circuit includes a first flexible film; a first interconnection layer on the first flexible film, wherein the first interconnection layer includes a first end portion to be connected to a first electrode of a touchscreen, and a second end portion; a second flexible film; a second interconnection layer on the second flexible film, wherein the second interconnection layer includes a first end portion to be connected to a second electrode of the touchscreen, and a second portion; an adhesive layer that bonds the first flexible film and the second flexible film; a first cover film on the first interconnection layer with the first and second end portions of the first interconnection layer being exposed; and a second cover film on the second interconnection layer with the first and second end portions of the second interconnection layer being exposed.

Abstract translation: 柔性印刷电路包括第一柔性膜; 在所述第一柔性膜上的第一互连层，其中所述第一互连层包括要连接到触摸屏的第一电极的第一端部部分和第二端部部分; 第二个柔性膜; 在所述第二柔性膜上的第二互连层，其中所述第二互连层包括要连接到所述触摸屏的第二电极的第一端部分和第二部分; 粘合所述第一柔性膜和所述第二柔性膜的粘合层; 第一互连层上的第一覆盖膜与第一互连层的第一和第二端部被暴露; 并且第二互连层上的第二覆盖膜暴露于第二互连层的第一和第二端部。

公开(公告)号：US08686298B2

公开(公告)日：2014-04-01

申请号：US13403155

申请日：2012-02-23

Applicant: Junichi Nakamura ,  Kotaro Kodani ,  Michiro Ogawa

Inventor： Junichi Nakamura ,  Kotaro Kodani ,  Michiro Ogawa

IPC: H05K1/03

CPC classification number: H01L23/49544 ,  H01L23/49822 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4682 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.

Abstract translation: 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。