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    METHOD OF FABRICATING OF CIRCUIT BOARD
    53.
    发明申请
    METHOD OF FABRICATING OF CIRCUIT BOARD 有权
    电路板制作方法

    公开(公告)号：US20130287935A1

    公开(公告)日：2013-10-31

    申请号：US13896351

    申请日：2013-05-17

    Applicant: Ngai Tsang ,  Kuo-Shu Kao

    Inventor： Ngai Tsang ,  Kuo-Shu Kao

    IPC: H05K3/02

    CPC classification number: H05K3/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/118 ,  H05K3/06 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/09909

    Abstract: A method of fabricating a circuit board is provided. An elastic bump material layer is formed on a substrate and then is patterned to form a plurality of first elastic bumps and a plurality of second elastic bumps, arranged in at least an array. A conductive layer is formed and then is patterned to form a patterned circuit layer to cover first plurality of elastic bumps and a portion of the substrate. An entirety of the plurality of second elastic bumps and another portion of the substrate are not covered by the patterned circuit layer. A protection layer is formed to cover a portion of the patterned circuit layer, a second number of the plurality of second elastic bumps entirely, a third number of the plurality of second elastic bumps partially and the another portion of the substrate, and expose the first number of the plurality of second elastic bumps.

    Abstract translation: 提供一种制造电路板的方法。 在基板上形成弹性凸块材料层，然后将其图案化以形成至少排列成多个第一弹性凸块和多个第二弹性凸块。 形成导电层，然后将其图案化以形成图案化的电路层，以覆盖第一多个弹性凸块和基板的一部分。 多个第二弹性凸块和衬底的另一部分的整体未被图案化电路层覆盖。 保护层形成为覆盖图案化电路层的一部分，多个第二弹性凸块的第二数量，第二数量的多个第二弹性凸起部分和基板的另一部分，并且暴露第一 多个第二弹性凸块的数量。

    Micro pin grid array with pin motion isolation
    54.
    发明授权
    Micro pin grid array with pin motion isolation 有权
    微针栅格阵列，具有引脚运动隔离

    公开(公告)号：US08531039B2

    公开(公告)日：2013-09-10

    申请号：US12759196

    申请日：2010-04-13

    Applicant: Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

    Inventor： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

    IPC: H01L29/40

    CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

    Abstract: A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

    Abstract translation: 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

    Retinal prosthesis with a new configuration
    55.
    发明授权
    Retinal prosthesis with a new configuration 有权
    视网膜假体具有新配置

    公开(公告)号：US08510939B2

    公开(公告)日：2013-08-20

    申请号：US11924696

    申请日：2007-10-26

    Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

    Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

    IPC: H01K3/22

    CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

    Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

    Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

    Stretchable circuit configuration
    59.
    发明授权
    Stretchable circuit configuration 有权
    可拉伸电路配置

    公开(公告)号：US08329493B2

    公开(公告)日：2012-12-11

    申请号：US12728814

    申请日：2010-03-22

    Applicant: Stephen Mascaro ,  Debra Mascaro ,  Jumana Abu-Khalaf ,  Jungwoo Park

    Inventor： Stephen Mascaro ,  Debra Mascaro ,  Jumana Abu-Khalaf ,  Jungwoo Park

    IPC: H01L21/00

    CPC classification number: H05K1/0283 ,  A61B5/0261 ,  A61B5/0295 ,  A61B5/14552 ,  B29C45/14639 ,  H05K1/183 ,  H05K3/143 ,  H05K3/284 ,  H05K3/3463 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/128 ,  H05K2203/1327

    Abstract: A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and conductors being bendable together about two orthogonal axes. The stretchable circuit also includes a stretchable sensor layer attached to the base substrate with a cavity formed therein which has a contact point exposing one of the plurality of stretchable conductors. The stretchable electronic circuit further includes a surface mount device (SMD) package with a conductor contact protrusion installed into the cavity, and wherein a substantially constant electrical connection is established between the conductor contact protrusion and the stretchable conductor at the contact point by tensile forces interacting between the stretchable base substrate and the stretchable sensor layer.

    Abstract translation: 一种可拉伸电子电路，其包括具有形成在其表面上的多个可拉伸导体的可拉伸基底基板，所述可拉伸基底基板和导体可绕两个正交轴线弯曲在一起。 可拉伸电路还包括附接到基底基底的可拉伸传感器层，其中形成有腔，其具有暴露多个可拉伸导体之一的接触点。 可伸缩电子电路还包括一个表面安装器件（SMD）封装，其中导体接触突起安装在空腔中，并且其中通过张力相互作用在导体接触突起与接触点处的可拉伸导体之间建立了基本恒定的电连接 在可拉伸基底基板和可拉伸传感器层之间。

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