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公开(公告)号：US5563572A
公开(公告)日：1996-10-08
申请号：US247596
申请日：1994-05-23
Applicant: Ullrich Hetzler
Inventor： Ullrich Hetzler
IPC: H01C17/06 , H01C1/084 , H01C1/142 , H01C7/00 , H01C13/02 , H01C17/245 , H05K1/11 , H05K1/18 , H01C1/02
CPC classification number: H01C1/142 , H01C1/084 , H01C13/02 , H05K1/111 , H05K1/181 , H05K2201/09281 , H05K2201/09772 , H05K2201/10022 , H05K2201/10636 , H05K2203/162 , H05K2203/167 , Y02P70/611 , Y10T29/49099
Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.
Abstract translation: SMD（表面安装器件）结构的电阻器包括作为电阻轨道的两个电隔离的铜载体元件的电阻合金膜，其被构造为可焊接到印刷电路板的端子的接触元件，从而确保良好 散热成印刷电路板。 为了制造这种电阻器，可以将足够多个单独电阻器的电阻膜粘附到大铜板上而与之电隔离，并且由此形成的层叠体在产生各个电阻轨道及其与 并且在每个轨道的板元件之间产生间隙之后。
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52.发明授权公开(公告)号：US12114429B2
公开(公告)日：2024-10-08
申请号：US17770396
申请日：2020-09-07
Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Hideo Takahashi , Shinichi Takase , Hiroki Shimoda , Tsutomu Kitajima , Yoshiro Adachi , Yuuki Oohashi , Manabu Sudou
CPC classification number: H05K1/189 , H05K1/115 , H05K2201/09281 , H05K2201/09427 , H05K2201/09854
Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
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公开(公告)号：US11931099B2
公开(公告)日：2024-03-19
申请号：US16246695
申请日：2019-01-14
Applicant: NIPPON MEKTRON, LTD.
Inventor： Akio Yoshida , Ryoichi Toyoshima , Mitsunori Sasaki , Hiroyasu Hasegawa
CPC classification number: A61B18/1492 , H05K1/11 , H05K1/118 , H05K1/18 , H05K2201/09027 , H05K2201/09236 , H05K2201/09281 , H05K2201/09827 , H05K2201/10151
Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.
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公开(公告)号：US20180359862A1
公开(公告)日：2018-12-13
申请号：US16002112
申请日：2018-06-07
Applicant: Fracatal Antenna Systems, Inc.
Inventor： Nathan Cohen
CPC classification number: H05K3/282 , H05K1/0245 , H05K1/0256 , H05K1/0296 , H05K1/0298 , H05K3/1258 , H05K2201/0769 , H05K2201/09227 , H05K2201/09236 , H05K2201/09281
Abstract: Methods are disclosed which discourage formation of destructive corrosion on or about circuit traces of printed circuit boards, and/or mitigate electronic circuit degradation and or destruction through corrosion of the circuit traces, whereby said corrosion produces changing characteristics of the circuit, and/or shorting to other adjacent circuit traces. Aspects and embodiments of the present disclosure include or provide for forming at least a portion of a circuit trace or traces with fractal and/or self-complementary geometries, or self complementary geometry alone.
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公开(公告)号：US20180316080A1
公开(公告)日：2018-11-01
申请号：US16028462
申请日：2018-07-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Kuniaki YOSUI
CPC classification number: H01P3/082 , H01P3/06 , H01P3/085 , H05K1/0225 , H05K1/025 , H05K1/0253 , H05K1/147 , H05K2201/09272 , H05K2201/09281 , H05K2201/09727 , H05K2201/10189
Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section.
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Patent Agency Ranking
公开(公告)号：US09913376B2
公开(公告)日：2018-03-06
申请号：US15146364
申请日：2016-05-04
Applicant: Northrop Grumman Systems Corporation
Inventor： Anthony L. Long , Alexander Parra, II
CPC classification number: H05K1/144 , H05K1/0237 , H05K1/0243 , H05K1/0253 , H05K1/11 , H05K1/118 , H05K1/141 , H05K1/181 , H05K3/361 , H05K2201/09072 , H05K2201/09281 , H05K2201/09827 , H05K2201/10378 , H05K2201/10886
Abstract: An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.
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公开(公告)号：US09673502B2
公开(公告)日：2017-06-06
申请号：US15285615
申请日：2016-10-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
CPC classification number: H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
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公开(公告)号：US20170025730A1
公开(公告)日：2017-01-26
申请号：US15285615
申请日：2016-10-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi SASAKI , Nobuo IKEMOTO , Shigeru TAGO
IPC: H01P3/00
CPC classification number: H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
Abstract translation: 电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。 信号线设置在电介质元件组件中并沿x轴方向延伸。 参考接地导体相对于信号线在z轴方向的正侧设置。 辅助接地导体相对于信号线设置在z轴方向的负侧。 通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。 包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。
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公开(公告)号：US09480147B2
公开(公告)日：2016-10-25
申请号：US14483749
申请日：2014-09-11
Applicant: LG INNOTEK CO., LTD.
Inventor： Byeong Seob Kim , Ji Sung Ahn
CPC classification number: H05K1/0259 , G06F1/1643 , G06F3/044 , G06F2203/04107 , H05K3/361 , H05K2201/09227 , H05K2201/09272 , H05K2201/09281 , H05K2201/09727
Abstract: A touch window includes a substrate, a sensing electrode on the substrate, a wire electrically connected with the sensing electrode, a ground wire adjacent to the wire, and a printed circuit board connected with the wire and the ground wire. An overlap length between the ground wire and the printed circuit board is longer than an overlap length between the wire and the printed circuit board. Alternatively or simultaneously, a line width of the ground wire is wider than an interval or gap between the wire parallel to the printed circuit.
Abstract translation: 触摸窗包括基板，基板上的感测电极，与感测电极电连接的导线，与导线相邻的接地线以及与导线和接地线连接的印刷电路板。 接地线和印刷电路板之间的重叠长度大于导线和印刷电路板之间的重叠长度。 或者或同时地，接地线的线宽比平行于印刷电路的线之间的间隔或间隙宽。
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60.发明申请公开(公告)号：US20160183386A1
公开(公告)日：2016-06-23
申请号：US14617864
申请日：2015-02-09
Applicant: QUALCOMM Incorporated
Inventor： Young Kyu SONG , Layal ROUHANA , Kyu-Pyung HWANG , Omar James BCHIR
CPC classification number: H05K3/4644 , H01L2224/16225 , H01L2924/15311 , H05K1/0231 , H05K1/0234 , H05K1/0243 , H05K1/0298 , H05K1/111 , H05K1/113 , H05K1/114 , H05K1/115 , H05K1/167 , H05K1/181 , H05K3/1258 , H05K3/321 , H05K3/3442 , H05K3/4697 , H05K2201/0792 , H05K2201/09227 , H05K2201/09281 , H05K2201/09954 , H05K2201/10015 , H05K2201/10636 , H05K2203/0545 , Y02P70/611
Abstract: Methods and apparatus for controlling an equivalent-series resistance (ESR) of a capacitor are provided. An exemplary apparatus includes a substrate having a land side, the capacitor mounted on the land side of the substrate and having both the ESR and terminals, a resistive pattern coupled to the terminals, and a plurality of vias coupled to the resistive pattern. The resistive pattern is configured to control the ESR. The resistive pattern can be formed of a resistive paste. The resistive pattern can be formed in a substantially semicircular shape having an arc ranging from substantially 45 degrees to substantially 135 degrees. The capacitor can be a surface mount device. The resistive pattern can be formed in a shape of a land-side capacitor mounting pad, a via, or both.
Abstract translation: 提供了用于控制电容器的等效串联电阻（ESR）的方法和装置。 示例性装置包括具有接地侧的基板，安装在基板的接地侧上并具有ESR和端子的电容器，耦合到端子的电阻图案以及耦合到电阻图案的多个通孔。 电阻模式被配置为控制ESR。 电阻图案可以由电阻浆料形成。 电阻图案可以形成为具有大致45度至基本上135度的弧度的大致半圆形状。 电容器可以是表面贴装器件。 电阻图案可以形成为陆侧电容器安装垫，通孔或两者的形状。
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