公开(公告)号：US6133134A

公开(公告)日：2000-10-17

申请号：US982490

申请日：1997-12-02

Applicant: Behrooz Mehr

Inventor： Behrooz Mehr

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L21/44 ,  H01L23/49

CPC classification number: H05K1/111 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/114 ,  H05K2201/0939 ,  H05K2201/10734 ,  H05K3/3452 ,  Y02P70/611

Abstract: A ball grid array integrated circuit package which has a plurality of elliptical shaped solder pads located on a substrate of the package. Routing traces are connected to the apexes of the elliptical shaped solder pads. Connecting a routing trace to the apex of an elliptical shaped solder pad reduces the stress points on the trace/pad interface. Vias may be coupled to the solder pads and the routing traces. The vias are located at the apexes of the elliptical shaped solder pads to reduce the stress points of the substrate.

Abstract translation: 一种球栅阵列集成电路封装，其具有位于封装的衬底上的多个椭圆形焊盘。 路由迹线连接到椭圆形焊盘的顶点。 将路由轨迹连接到椭圆形焊盘的顶点可减少迹线/焊盘界面上的应力点。 通孔可以耦合到焊盘和布线迹线。 通孔位于椭圆形焊盘的顶点处，以减小基板的应力点。

公开(公告)号：US5831826A

公开(公告)日：1998-11-03

申请号：US717055

申请日：1996-09-20

Applicant: James Edward Van Ryswyk

Inventor： James Edward Van Ryswyk

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K7/20445 ,  H05K1/0206 ,  H05K1/11 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/043 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/3468

Abstract: A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.

Abstract translation: 传热装置承载在具有顶表面和底表面（212,214）的基底（204）上。 传热装置包括垫（220/222），至少一个通孔（224/226）和多个垫（302）。 衬垫（220/222）被承载在衬底（204）的顶表面（212）上以电连接到电子部件（228/230）。 通孔（224/226）与焊盘（220/222）相交并且在衬底（204）的顶表面和底表面（212,214）之间延伸。 多个焊盘（302）被承载在衬垫（220/222）下方的衬底（204）的底表面（214）上。 通孔（224/226）与多个焊盘（302）中的一个相交，以将电子部件（228/230）的操作期间产生的热传递到其上。

公开(公告)号：US5311405A

公开(公告)日：1994-05-10

申请号：US100834

申请日：1993-08-02

Applicant: David A. Tribbey ,  Henry F. Liebman ,  Allen D. Hertz ,  Peter E. Albertson

Inventor： David A. Tribbey ,  Henry F. Liebman ,  Allen D. Hertz ,  Peter E. Albertson

IPC: B23K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K13/04 ,  H05K7/10

CPC classification number: H05K1/111 ,  B23K1/0016 ,  H05K13/0465 ,  H05K3/3442 ,  B23K2201/36 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).

Abstract translation: 一种方法和装置将包括在组件（402）的每个端部处的端接件的无引线表面安装部件（402）对准和附接。 终端具有底部（704）和端部（702）部分，用于通过回流焊接工艺（1200）附接到衬底（102）上的对应衬垫。 形成包括两个相对的焊盘（108）的焊盘装置（100），每个焊盘（108）占据三椭圆形的区域。 当所述部件（402）与所述垫装置（100）对准时，所述三椭圆形区域包括基本上位于所述部件（402）的相应终端的底部（704）下方的中心的椭圆形区域（110），以及 与椭圆形区域（110）相邻并在中心纵向方向上朝向相对的垫（108）延伸的弧形区域（112）。 将焊膏（202）施加到椭圆形区域（110）上，然后回流焊接，由此焊膏（202）中的焊料（302）液化并流到弧形区域（112），从而有助于部件 402）。

公开(公告)号：US5037315A

公开(公告)日：1991-08-06

申请号：US566632

申请日：1990-08-13

Applicant: John C. Collier ,  David Lee

Inventor： John C. Collier ,  David Lee

IPC: H01R12/57 ,  H01R12/72 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/57 ,  H01R12/721 ,  H05K1/117 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/0939 ,  H05K2201/09709 ,  H05K2201/10863 ,  H05K3/325 ,  H05K3/341 ,  Y10S439/951

Abstract: An electrical connecting arrangement is provided between an electrical edge connector and a printed circuit board in which contact pads provided near the edge of the printed circuit board have a convex profile at least in the direction of insertion of the board into an opening in the edge connector. At full board insertion, each spring contact (3, FIG. 1A) of the connector engages a board contact pad (5) at a location (64) on the pad that lies beyond the center (66) of the pad.

公开(公告)号：US4645114A

公开(公告)日：1987-02-24

申请号：US745110

申请日：1985-06-17

Applicant: Jacques Van Den Brekel ,  Carlyle W. Crothers ,  Dale B. Squires

Inventor： Jacques Van Den Brekel ,  Carlyle W. Crothers ,  Dale B. Squires

IPC: B23K35/14 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0939 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

Abstract: Solder pads for surface mounting of devices on a circuit board are given predetermined shapes. By shaping of a solder pad, or contact pad, a device will be held in, or moved to, a desired position on melting of the solder at the pad. Improved alignment and positioning is obtained. Broadly, a contact or solder pad comprises a rectangular portion and a segmental portion, the device end resting on the rectangular portion and the segmental portion being outside of the contact position.

Abstract translation: 用于电路板上的器件的表面安装的焊盘被赋予预定的形状。 通过焊接焊盘或接触焊盘的成形，在焊盘熔化时，器件将被保持在或移动到期望的位置。 获得改进的对准和定位。 广义上，接触或焊盘包括矩形部分和节段部分，器件端部搁置在矩形部分上，并且节段部分在接触位置之外。

公开(公告)号：US20240314920A1

公开(公告)日：2024-09-19

申请号：US18595907

申请日：2024-03-05

Applicant: MEDIATEK INC.

Inventor： Tso-Ju YI ,  Chung-Fa LEE

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/0222 ,  H05K1/114 ,  H05K2201/0939 ,  H05K2201/09509 ,  H05K2201/10734

Abstract: An electronic system is provided. The electronic system includes a base and a semiconductor device. The base having a device-attach region includes a build-up layer structure, a vertical interconnect structure and a first through via. The vertical interconnect structure and the first through via are formed passing through the build-up layer structure and located in the device-attach region. The vertical interconnect structure includes a buried via and a blind via electrically coupled to the buried via. The first through via is a straight through via. The semiconductor device is mounted on the device-attach region of the base.

公开(公告)号：US20240147621A1

公开(公告)日：2024-05-02

申请号：US18547107

申请日：2021-12-01

Applicant: HITACHI ASTEMO, LTD.

Inventor： Narutoshi YAMADA ,  Yuuichi YANAGISAWA ,  Takahiro MAKIKO

IPC: H05K1/11 ,  B23K1/005 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/116 ,  B23K1/005 ,  H05K3/3447 ,  H05K3/4007 ,  B23K2101/42 ,  H05K2201/0939

Abstract: A manufacturing method of a circuit board including an annular land portion around a through hole through which a terminal that is an object of a soldering penetrates, and that is soldered on the land portion by a soldering process with a solder supply, the manufacturing method includes: previously forming a preliminary solder at a position opposite to a supply position of the solder in the land portion with respect to the through hole before the soldering process.

公开(公告)号：US20240049387A1

公开(公告)日：2024-02-08

申请号：US18381942

申请日：2023-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansu CHEON ,  Youngjae KO

IPC: H05K1/11 ,  G04G17/04

CPC classification number: H05K1/111 ,  G04G17/04 ,  H05K2201/10128 ,  H05K2201/0939

Abstract: An electronic device includes a housing; a printed circuit board provided in the housing and including a fastening hole; a pad structure provided on the printed circuit board, the pad structure including: a first pad surrounding at least a portion of the fastening hole; a second pad spaced apart from the first pad in a first direction; and a third pad spaced apart from the first pad in a second direction that is different from the first direction with respect to the fastening hole; a first electronic component provided on the printed circuit board and electrically connected to the second pad; and a metal plate including: a first plate area provided on the first pad; and a second plate area extending from the first plate area and provided on one of the second pad and the third pad.

公开(公告)号：US10074919B1

公开(公告)日：2018-09-11

申请号：US15625149

申请日：2017-06-16

Applicant: INTEL CORPORATION

Inventor： Zhen Zhou ,  Daqiao Du ,  Anne M. Sepic ,  Kai Xiao

IPC: H01R12/00 ,  H01R12/71 ,  H01R12/75 ,  H01R43/20 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/00

CPC classification number: H01R12/714 ,  H01R12/75 ,  H01R43/205 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/4644 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09545 ,  H05K2201/10265 ,  H05K2201/10909 ,  H05K2203/06 ,  H05K2203/162

Abstract: Embodiments of the present disclosure may relate to a printed circuit board (PCB) that includes a first outer layer and a second outer layer opposite the first outer layer. The PCB may further include a routing layer between the first outer layer and the second outer layer, and an interconnect positioned within the first outer layer and coupled with the routing layer. The interconnect may include a contact within an opening in the first outer layer, wherein the contact is within a plane defined by an outer surface of the first outer layer. The interconnect may further include a plated via directly coupled with the contact and the routing layer. Other embodiments may be described or claimed.

公开(公告)号：US20180151312A9

公开(公告)日：2018-05-31

申请号：US15592480

申请日：2017-05-11

Applicant: CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN WATCH CO., LTD.

Inventor： Ryo WAKUDA

IPC: H01H13/14 ,  H05K1/11 ,  H01H13/52 ,  H05K1/18 ,  H01H13/04

CPC classification number: H01H13/14 ,  H01H13/04 ,  H01H13/52 ,  H01H2013/525 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/10053

Abstract: A switch component includes a spring plate and a cover of rubber. The cover of rubber covers at least one part of an upper surface of the spring plate. The cover of rubber includes at least one pair of supporting portions that support the spring plate.