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    Memory module system and method
    52.
    发明授权
    Memory module system and method 有权
    内存模块系统和方法

    公开(公告)号：US07606040B2

    公开(公告)日：2009-10-20

    申请号：US11077952

    申请日：2005-03-11

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K7/02

    CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

    Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

    Abstract translation: 存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。 本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。 许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。 设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。 描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

    Flexible printed-circuit board
    54.
    发明申请
    Flexible printed-circuit board 审中-公开
    柔性印刷电路板

    公开(公告)号：US20090008131A1

    公开(公告)日：2009-01-08

    申请号：US11659131

    申请日：2005-07-28

    Applicant: Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

    Inventor： Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

    IPC: H05K1/02

    CPC classification number: H05K1/0219 ,  H05K1/0237 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09236 ,  H05K2201/09445 ,  H05K2201/09727

    Abstract: A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 100 that has a first side 100a and a second side 100b opposed to each other, and an overlap portion 105 formed by bending its one end; a plurality of wiring lines 101 that are arranged on the first side 100a of the body substantially in parallel to each other; first pads 103 that are connected to respective ends of wiring lines, wider than the wiring lines and formed on the first-side surface 105a of the overlap potion; and second pads 104 that are located at respective ends of wiring lines, wider than the wiring lines and formed on the second-side surface 105b of the overlap potion. The wiring lines 101a with the first pads connected thereto and the wiring lines 101b with the second pads 104 connected thereto are alternatively arranged on the first side.

    Abstract translation: 提供了适用于高速传输并可以以低成本安装多个连接器的柔性印刷电路板。 板包括具有彼此相对的第一侧100a和第二侧面100b的柔性印刷电路板主体100和通过使其一端弯曲形成的重叠部分105; 布置在主体的第一侧100a上的多个布线101基本上彼此平行; 第一焊盘103，其连接到布线的相应端部，比布线宽，并形成在重叠部分的第一侧表面105a上; 以及第二焊盘104，其位于布线的相应端部，比布线宽，并且形成在重叠部分的第二侧表面105b上。 具有与其连接的第一焊盘的布线101a和与其连接的第二焊盘104的布线101b交替布置在第一侧上。

    High capacity thin module system
    55.
    发明授权
    High capacity thin module system 有权
    大容量薄模块系统

    公开(公告)号：US07443023B2

    公开(公告)日：2008-10-28

    申请号：US11231418

    申请日：2005-09-21

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Thin multichip flex-module
    58.
    发明申请
    Thin multichip flex-module 审中-公开
    薄多芯片柔性模块

    公开(公告)号：US20070211711A1

    公开(公告)日：2007-09-13

    申请号：US11715142

    申请日：2007-03-07

    Applicant: James E. Clayton

    Inventor： James E. Clayton

    IPC: H04L12/50

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/09745 ,  H05K2201/2018

    Abstract: A thin multichip module comprises: a frame comprising a recessed cavity; a flexible circuit having a plurality of integrated circuit chips disposed thereon, the flexible circuit bonded to the frame over at least a portion of the cavity; and the chips enclosed within the cavity by the flexible circuit; and, electrodes on the module configured to be accessible to an external socket after the frame is inserted in the module.

    Abstract translation: 薄多芯片模块包括：框架，包括凹腔; 柔性电路，其上设置有多个集成电路芯片，所述柔性电路在所述空腔的至少一部分上结合到所述框架; 并且通过柔性电路封装在腔内的芯片; 并且模块上的电极被配置为在将框架插入模块之后可由外部插座访问。

    High capacity thin module system and method
    59.
    发明申请
    High capacity thin module system and method 有权
    大容量薄模块系统及方法

    公开(公告)号：US20060091529A1

    公开(公告)日：2006-05-04

    申请号：US11231418

    申请日：2005-09-21

    Applicant: James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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