公开(公告)号：US20140192464A1

公开(公告)日：2014-07-10

申请号：US14157684

申请日：2014-01-17

Applicant: HzO, Inc.

Inventor： David James Astle ,  Tyler Christensen Child ,  Vimal Kumar Kasagani ,  Cameron LaMar Loose ,  Blake LeRoy Stevens ,  Max Ernest Sorenson

IPC: H01L21/64 ,  H05K7/02 ,  H01L21/67

CPC classification number: B05D1/322 ,  C09J9/00 ,  C09J2201/61 ,  H01L21/56 ,  H01L21/561 ,  H01L21/67011 ,  H01L21/6715 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/0073 ,  H05K3/0079 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/09872 ,  H01L2924/00

Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Abstract translation: 公开了一种将保护涂层施加到衬底的选定部分的方法。 该方法包括在不被保护涂层覆盖的基底的至少一部分上施加掩模或形成掩模。 可以通过将可流动材料施加到基底来选择性地形成掩模。 或者，掩模可以由预成型膜形成。 在掩模就位的情况下，可以将保护涂层施加到基底和掩模上。 覆盖在掩模上的保护涂层的一部分可以从保护涂层的其它部分描绘出来; 例如，通过在掩模的周边或附近的位置处切割，削弱或从保护涂层去除材料。 然后可以将覆盖在掩模上的保护涂层和掩模的部分从基材上除去。

公开(公告)号：US08545931B2

公开(公告)日：2013-10-01

申请号：US12426572

申请日：2009-04-20

Applicant: Michael Szuch

Inventor： Michael Szuch

IPC: H05K3/28

CPC classification number: H05K3/0091 ,  B05B12/00 ,  B05B12/02 ,  B05B12/06 ,  B05C11/1015 ,  H05K2201/09872 ,  H05K2203/0126

Abstract: A coating system with an applicator that has an air cylinder with a needle valve. A control has a timer that provides a string of electrical pulses to a solenoid. With each pulse, the solenoid applies pressurized air to a cylinder piston, thereby opening the needle valve and permitting coating material to flow past the needle valve. The needle valve is closed for durations of time between pulses, and the coating material is ejected from a dispensing needle in response to closings of the needle valve.

Abstract translation: 具有涂布器的涂布系统，其具有带针阀的气缸。 一个控制器有一个定时器，它向螺线管提供一串电脉冲。 对于每个脉冲，螺线管将加压空气施加到气缸活塞，从而打开针阀并允许涂覆材料流过针阀。 针阀关闭脉冲之间的持续时间，并且响应于针阀的关闭，涂覆材料从分配针喷射。

公开(公告)号：US08313819B2

公开(公告)日：2012-11-20

申请号：US12854298

申请日：2010-08-11

Applicant: Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

Inventor： Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

IPC: B32B3/00 ,  B05D3/00

CPC classification number: A61N1/375 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/09872 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Abstract translation: 一种可植入医疗装置，其包括在基底上的多个部件，以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组，每组具有第一层，第二层和第三层。 第一层，第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成，并且该组的另外两个层中的至少一层基本上由无机材料组成，使得每个层在至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

公开(公告)号：US20120257364A1

公开(公告)日：2012-10-11

申请号：US13527258

申请日：2012-06-19

Applicant: Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

Inventor： Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

IPC: B32B27/08 ,  B05D5/00 ,  H05K7/06 ,  B05D3/10

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2203/095 ,  Y10T428/31504 ,  Y10T428/31544

Abstract: An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.

Abstract translation: 一种电气组件，其包括通过式（I）化合物的等离子体聚合和所得到的式（I）化合物的所得聚合物沉积在基材的至少一个表面上沉积的基材和保形涂层，以及等离子体聚合 氟化烃和所得到的氟代烃聚合物的沉积，使得所得到的式（I）化合物的聚合物和所得氟代烃的聚合物产生不连续的共形涂层; 其中式（I）化合物是有机化合物。

公开(公告)号：US08004860B2

公开(公告)日：2011-08-23

申请号：US11468104

申请日：2006-08-29

Applicant: James F. Salzman

Inventor： James F. Salzman

IPC: H05K9/00

CPC classification number: H05K9/0084 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/0191 ,  H05K2203/0582

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract translation: 一种电气设备，包括安装到印刷电路板的表面上的电子部件，所述表面上的接地连接和电磁干扰（EMI）屏蔽。 EMI屏蔽包括涂覆电子部件的电绝缘体，与表面接触的绝缘体和覆盖电绝缘体的导电层，以及接触电绝缘体和接地连接。

公开(公告)号：US20100116431A1

公开(公告)日：2010-05-13

申请号：US12689383

申请日：2010-01-19

Applicant: Ivan Pawlenko ,  Larry Samson

Inventor： Ivan Pawlenko ,  Larry Samson

IPC: B32B37/00 ,  B05C11/00

CPC classification number: H05K9/0083 ,  B82Y30/00 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/011 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09872 ,  H05K2203/0126 ,  Y10T428/25 ,  Y10T428/31678

Abstract: A thermally conductive polymer composition is applied to mounted components to provide both thermal control and RF radiation attenuation. In order to improve the RF attenuation performance, a plurality of discrete conductive elements may be incorporated into the polymer composition, with the sizing, spacing and configuration of the suppressed most efficiently by the particular composition. The discrete conductive elements are significantly larger, on the order of 1-5 mils (approximately 25-127 μm) than the filler materials utilized to render the base polymer conductive. Also disclosed is an apparatus and a method for preparing and applying such a polymer composition to an electronic component.

Abstract translation: 将导热聚合物组合物应用于安装的组件以提供热控制和RF辐射衰减。 为了提高RF衰减性能，可以将多个离散的导电元件结合到聚合物组合物中，具有通过特定组合最有效地抑制的尺寸，间距和构型。 离散导电元件显着地大于用于使基础聚合物导电的填充材料大约1-5密耳（约25-127μm）。 还公开了一种用于制备和应用这种聚合物组合物到电子部件的装置和方法。

公开(公告)号：US20100108370A1

公开(公告)日：2010-05-06

申请号：US12263874

申请日：2008-11-03

Applicant: Christopher James Kapusta ,  Donald Paul Cunningham

Inventor： Christopher James Kapusta ,  Donald Paul Cunningham

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/0218 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Abstract translation: 公开了一种形成用于电气系统的图案化保形结构的系统和方法。 共形结​​构包括形成为符合电气系统的表面的电介质涂层，其中电介质涂层具有位于电气系统表面上的接触焊盘上的多个开口。 共形结​​构还包括层叠在电介质涂层上和接触焊盘上的图案化导电涂层，使得在图案化的导电涂层和接触焊盘之间形成电连接。 图案化导电涂层包括互连系统，屏蔽结构和热路径中的至少一个。

公开(公告)号：US20090279269A1

公开(公告)日：2009-11-12

申请号：US12419514

申请日：2009-04-07

Applicant: Jason SHIUE

Inventor： Jason SHIUE

IPC: H05K5/00 ,  H05K3/28 ,  B05D5/00

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

Abstract translation: 提供了一种电子设备和防水电子设备的防水方法。 电子设备包括印刷电路板，其包括板，多个电气元件和按钮装置。 防水方法包括以下步骤：施加第一非固体粘合剂以直接覆盖按钮装置，固化第一非固体粘合剂以形成第一防水层，施加第二非固体粘合剂以至少覆盖电气元件 直接固化第二非固体粘合剂以形成第二防水层。 最后，将用防水层密封的印刷电路板组装成壳体以形成防水电子装置。

公开(公告)号：US20090277662A1

公开(公告)日：2009-11-12

申请号：US12168609

申请日：2008-07-07

Applicant: Jason Shiue

Inventor： Jason Shiue

IPC: H05K5/06 ,  B32B37/06

CPC classification number: H05K5/06 ,  A63B33/002 ,  A63B2071/0625 ,  H05K3/284 ,  H05K5/0017 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311

Abstract: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This electrical device may be installed in a band structure which facilitates portability. Moreover, the present invention further provides methods for sealing at least one portion of the electrical device or the circuit board hermetically, while the electrical device or the circuit board would be sealed with the waterproof layer hermetically.

Abstract translation: 提供电气设备。 电气装置包括电路板和防水层。 防水层基本上密封电路板的至少一部分，以防止水渗入后的短路。 因此，该特定结构为电气设备提供优异的防水保护。 该电气设备可以安装在便于携带的带状结构中。 此外，本发明还提供了用于密封电气装置或电路板的至少一部分的方法，同时电气装置或电路板将密封有防水层。

公开(公告)号：US5703761A

公开(公告)日：1997-12-30

申请号：US699327

申请日：1996-08-19

Applicant: Reinhold Heiss

Inventor： Reinhold Heiss

IPC: H01L23/552 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K7/14

CPC classification number: H05K9/0045 ,  H01L23/552 ,  H05K1/0218 ,  H01L2924/16152 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K3/28 ,  Y10S174/34

Abstract: For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive manner with a contact surface on the circuit board that surrounds the components.

Abstract translation: 为了在信息技术设备中屏蔽具有高频分量的平板模块，屏蔽层的表面仅在待屏蔽部件的区域上延伸。 屏蔽表面以导电方式连接在电路板上的围绕部件的接触表面。