Abstract:
In an oscillator circuit employing a pattern coil on a printed-wiring circuit board as a resonator circuit, in order to satisfactorily adjust dispersion in oscillation frequencies, an air-core coil wound by 0.5 turn and less than one turn is provided so as to be connected to the pattern coil in parallel and mounted on the printed-wiring circuit board. The oscillation frequency is adjusted by adjusting the angle of the air-core coil relative to the printed-wiring board.
Abstract:
A coil is wound either with insulated wire or space wound with uninsulated wire and subsequently coated with a solder resist or insulating material. If insulated wire is used, the insulation is removed from the wire either during or after winding at predetermined locations to match the location of connection pads in a conductive pattern on a substrate. The coil is appropriately aligned and laid down on the substrate and an attachment technique is used to form an electrical connection between the exposed areas of wire and connection pads on the substrate. Alternatively, uninsulated wire may be used, which is space wound and coated with a solder resist or insulating material. The uninsulated wire may either be masked prior to coating or the insulating material may be removed following coating to form exposed connection locations on the coil corresponding to the location of the connection pads on the substrate. An attachment technique is then used to form an electrical connection between the exposed areas of wire and the corresponding connection pads on the substrate.
Abstract:
An overload protector for a telephone set or other telecommunications terminal comprises an electrical component having DC continuity and DC resistance mounted by leads on a circuit board, the leads soldered to the conductor pattern. On application of an overload, the component heats up to a level at which sufficient heat travels along the leads to melt the solder. Usually both leads become unsoldered. One or both leads part from the conductor pattern under the effect of gravity; under the effect of a compression spring on one or both leads and held in compression between component and circuit board; or a combination of both. A convenient component is a carbon block resistor, in the Tip or Ring line. A heat insulating member can be positioned around the component. The insulating member can be a sleeve loosely fitting over the resistor and retaining heat in the resistor, or a coating or layer directly on the component.
Abstract:
An overload protector for a telephone set or other telecommunications terminal comprises an electrical component having DC continuity and DC resistance mounted by leads on a circuit board, the leads soldered to the conductor pattern. A compression spring is positioned on each lead, held in compression between component and circuit board. An insulating member fits around the component. In application of an overload, the component heats up to a level at which sufficient heat travels down the leads to melt the solder. Usually both leads become unsoldered. A convenient component is a carbon block resistor, in the Tip or Ring line. The insulating member would be a sleeve loosely fitting over the resistor and retaining heat in the resistor.
Abstract:
One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.
Abstract:
A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.
Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.
Abstract:
A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
Abstract:
An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.