公开(公告)号：US20130189812A1

公开(公告)日：2013-07-25

申请号：US13555938

申请日：2012-07-23

Applicant: Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

Inventor： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC: H01L21/768 ,  H01L21/50

CPC classification number: H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. in this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed.

Abstract translation: 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开了其他实施例。

公开(公告)号：US20130186960A1

公开(公告)日：2013-07-25

申请号：US13553997

申请日：2012-07-20

Applicant: Hidetoshi SUZUKI ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

Inventor： Hidetoshi SUZUKI ,  Yuichi Hotta ,  Yuji Shimoda ,  Yuuji Ogawa ,  Taku Nishiyama ,  Tadanobu Okubo ,  Junichi Onodera ,  Takeshi Ikuta ,  Naohisa Okumura ,  Katsuyoshi Watanabe ,  Kazuhide Doi

IPC: G06K19/077

CPC classification number: G06K19/07732 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0259 ,  H05K1/0269 ,  H05K1/113 ,  H05K1/117 ,  H05K3/284 ,  H05K3/321 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2203/1327 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.

Abstract translation: 根据一个实施例，半导体存储装置设置有存储芯片，存储芯片包括存储电路，控制存储芯片的控制器芯片和具有第一表面和第二表面的基板，第一表面和第二表面在其第一表面上 安装控制器芯片。 此外，半导体存储装置设置有形成在基板的第二表面上的外部连接端子，并且封装存储芯片，控制器芯片和基板的树脂包括彼此相对的第三表面和第四表面， 并且具有仅在与基板的第二表面相邻的第四表面上直接印刷的预定标记。

公开(公告)号：US20130186941A1

公开(公告)日：2013-07-25

申请号：US13749645

申请日：2013-01-24

Applicant: Apple Inc.

Inventor： Michael Nikkhoo ,  Amir Salehi

IPC: H05K13/00

CPC classification number: H01R43/0242 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/0475 ,  H01R12/53 ,  H01R43/0207 ,  H01R43/0249 ,  H05K3/3405 ,  H05K3/3494 ,  H05K13/0015 ,  H05K2201/094 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/101 ,  Y10T29/49179

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract translation: 所描述的实施例一般涉及感性接合领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了用于成形磁场的多种方法，用于完成感应接合工艺而不对非屏蔽的相邻电气部件造成伤害。

公开(公告)号：US20130175089A1

公开(公告)日：2013-07-11

申请号：US13820827

申请日：2011-09-15

Applicant: Hisashi Hanazaki

Inventor： Hisashi Hanazaki

IPC: H01R9/11

CPC classification number: H01R4/06 ,  H01B7/00 ,  H01R4/00 ,  H01R4/10 ,  H05K3/325 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: An object is to provide a wire connecting device for connecting a fiber-core conductor, which can improve reliability of electric connection by controlling a force in a shearing direction acted on the fiber-core conductor. The wire connecting device for connecting the fiber-core conductor configured by stranding a plurality of fiber-core conductive wires, which are formed by plating a surface of a fiber with electric conductive metal, includes a rivet having a rod-shape pin and a head extending outwardly from the pin to be mounted at an end portion of the fiber-core conductor; and a plate-shape terminal having an opening, which the pin is inserted through and the rivet is connected with, and an overlap portion, which the head is overlapped on. The fiber-core conductor is clamped between the head and the overlap portion of the terminal so as to connect electrically the fiber-core conductor and the terminal.

Abstract translation: 目的在于提供一种用于连接纤维芯导体的线连接装置，其可以通过控制作用在纤芯导体上的剪切方向上的力来提高电连接的可靠性。 用于连接纤维芯导体的线连接装置，其通过将通过用导电金属的表面电镀而形成的多根纤维芯导电线构成，包括具有棒状销和头部的铆钉 从所述销向外延伸以安装在所述纤芯导体的端部; 以及具有开口的板状端子，销插入并且铆钉连接，以及重叠部分。 纤维芯导体夹在头部和端子的重叠部分之间，以便将光纤芯导体和端子电连接。

公开(公告)号：US08363419B2

公开(公告)日：2013-01-29

申请号：US12667031

申请日：2008-06-24

Applicant: Yoh Takano

Inventor： Yoh Takano

IPC: H05K1/18

CPC classification number: H05K1/0231 ,  H01L23/142 ,  H01L23/50 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/09554 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: An insulating resin layer (30) is formed on a metal substrate (20), and a wiring is formed on the insulating resin layer (30). A circuit composed of a circuit element (50) and a passive element (60) is formed on the wiring (40), and the metal substrate (20) is covered with an over coat (80) and a sealing resin member (90). The insulating resin layer (30) is provided with an opening (31) so that a part of the metal substrate (20) is exposed therefrom. The exposed part of the metal substrate (20) is connected to one terminal of a capacitor (62) through a conductive wire (42), and the other terminal of the capacitor (62) is connected to the ground potential.

Abstract translation: 绝缘树脂层（30）形成在金属基板（20）上，并且在绝缘树脂层（30）上形成布线。 在布线（40）上形成由电路元件（50）和无源元件（60）构成的电路，金属基板（20）被覆盖（80）和密封树脂部件（90）覆盖， 。 绝缘树脂层（30）设置有开口（31），使金属基板（20）的一部分露出。 金属基板（20）的露出部分通过导线（42）连接到电容器（62）的一个端子，电容器（62）的另一个端子连接到地电位。

公开(公告)号：US08358514B2

公开(公告)日：2013-01-22

申请号：US12588419

申请日：2009-10-15

Applicant: Atsushi Kashiwazaki ,  Yasumitsu Tanaka

Inventor： Atsushi Kashiwazaki ,  Yasumitsu Tanaka

IPC: H05K7/00 ,  H01L23/495

CPC classification number: H05K7/20454 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/284 ,  H05K3/321 ,  H05K5/065 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/10287 ,  H05K2203/049 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2224/05599

Abstract: In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of the electrically-conductive adhesive is lower than that of the circuit board. The electrically-conductive adhesive is covered by an adhesion improving member. When peeling stress is applied to the circuit board from the molding resin, the electrically-conductive adhesive and the adhesion improving member receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board is reduced.

Abstract translation: 在电子控制装置中，在电路板的第一面的外缘部配置导电性粘合剂，作为减轻由模塑树脂接收的电路基板的应力的应力降低部。 导电粘合剂的弹性模量低于电路板的弹性模量。 导电性粘合剂被粘附改善部件覆盖。 当从模制树脂向电路板施加剥离应力时，导电粘合剂和粘附改善构件接受剥离应力以变形。 因此，对电路板的剥离应力降低。

公开(公告)号：US08354594B2

公开(公告)日：2013-01-15

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.

Abstract translation: 本发明涉及一种包括蚀刻带状导体（2）和导线导体（6）的线印刷电路板或卡（1），其中导线在连接点之间和/或电路板或卡（1）之间延伸， 4）。 电线导体（6）中的至少一个具有基本上矩形的，例如正方形的横截面。

公开(公告)号：US20120214359A1

公开(公告)日：2012-08-23

申请号：US13402021

申请日：2012-02-22

Applicant: Junya YAMADA

Inventor： Junya YAMADA

IPC: H01R4/02

CPC classification number: H05K1/111 ,  H05K3/34 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y02P70/611

Abstract: A cable connection structure includes a cable and a substrate that includes a connection electrode to which the cable is connected. The substrate includes two or more protrusions that form a groove in which a conductor part of the cable is arranged. The height of the protrusions is greater than the diameter of the conductor part of the cable.

Abstract translation: 电缆连接结构包括电缆和包括连接电缆的连接电极的基板。 基板包括形成凹槽的两个或多个突起，其中电缆的导体部分布置在凹槽中。 突起的高度大于电缆的导体部分的直径。

公开(公告)号：US20120214321A1

公开(公告)日：2012-08-23

申请号：US13504807

申请日：2010-10-28

Applicant: Sumio Kagimura ,  Hiroshi Doumae

Inventor： Sumio Kagimura ,  Hiroshi Doumae

IPC: H01R12/70

CPC classification number: H05K3/32 ,  H01R4/34 ,  H01R12/515 ,  H01R12/585 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.

Abstract translation: 电路板单元包括印刷电路板和安装在印刷电路板上并将功率模块和电线连接在一起的端子块。 端子块包括要直接连接到电源模块的端子连接部分和要连接到电线的电线连接部分。 在印刷电路板中，形成具有比平面上的端子连接部的正交投影面积大的正交投影面积的孔。 端子连接部位于印刷电路板的孔的下方或上方。

公开(公告)号：US08217269B2

公开(公告)日：2012-07-10

申请号：US13213001

申请日：2011-08-18

Applicant: Stephen C. Jacobsen ,  David P. Marceau ,  Shayne M. Zum ,  David T. Markus

Inventor： Stephen C. Jacobsen ,  David P. Marceau ,  Shayne M. Zum ,  David T. Markus

IPC: H01B7/08 ,  H01B5/08 ,  H05K1/11

CPC classification number: H01L23/4952 ,  H01L24/43 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/43 ,  H01L2224/45012 ,  H01L2224/45013 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/45578 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2224/8582 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3421 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y02P70/613 ,  H01L2924/20751 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.

Abstract translation: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。